The purpose of the present invention is to provide a transfer sheet capable of providing hard coat properties and excellent weather resistance to a resin molded article such as organic glass. The transfer sheet has, in order, a base material film for mold release, a hard coat layer, a primer layer, and an adhesive layer. The weather resistance and adhesiveness of the hard coat layer and the primer layer are improved and hard coat properties and excellent weather resistance can be provided to a resin molded article being the transfer object, as a result of: the hard coat layer being formed from a cured product of a resin composition including a curable resin; and the primer layer being formed from a binder resin including a polyurethane having a mass-average molecular weight of 40,000-100,000 and including 1-30% by mass of an acrylic component.

A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.

An optical element for a lighting device of an automotive vehicle. The optical element includes a first portion configured to transmit electromagnetic (EM) radiation therethrough, the EM radiation including visible wavelengths and an ablation process wavelength. Also included is a second portion configured to absorb at least the ablation process wavelength, the second portion being in contact with the first portion to define an ablation process boundary which separates a surface of the first portion from an adjacent surface of the second portion. A patterned optical coating is provided on the optical element such that the optical coating material is provided on at least a part of the surface of the second portion, but not provided on the surface of the first portion.

A process for forming a two layer plastic device with textures or drawings thereon and a structure formed by the structure are provided. An inner bottom layer has textures or drawings on the surface thereof which includes at least one enclosing space. A through hole is formed on the enclosing space so that the masking material can be filled into the space between the outer mold and the inner mold. Then the masking material enters into the enclosing space through the through hole. As a result, only one mold (the outer mold) is necessary for forming the masking layer, while in the prior art, two molds are needed. The whole process can be completed mechanically without any manual operation. A color of the masking layer may be different from that of the inner bottom layer so that the textures or drawings clearly exposes on the surface of the masking layer.

A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector. Reuseable plates may be used instead of the heat sink panels. Alternatively the panel may be encapsulated in and separated from a re-useable mold after curing.

In a method for the further processing of a product (30) that is preferably prefabricated in large numbers, the product has a surface (31) for an additive multi-dimensional application of material. Information for the additive multi-dimensional application of material is input into a device in which the multi-dimensional application of material is digitised from this information and is deconstructed into elements that are suitable for the additive application of the application of material to the surface (31). The prefabricated product (30) is introduced into a device (I) for additive application of the material application such that the elements for the additive multi-dimensional application of material on the surface (31) are assembled in accordance with the information using an additive manufacturing method. Because the surface is an individualising surface (31) of the prefabricated product, and because the additive application of material is a multi-dimensional individualisation that is intended and suitable for individualising the product, and because at least one of the prefabricated products is identified by the information and is provided individually with the multi-dimensional individualisation (32), a method is provided by which products that are prefabricated in relatively large numbers can be further processed, individualised or personalised to meet individual demands. The prefabricated product (30) is equipped with an associated information carrier for receiving the information for individualisation that supports the method sequence.

A casing component according to an embodiment of the present technology includes a decorating film and a casing part. The decorating film is formed on a base film by vapor deposition and includes a metal layer, fine cracks being formed in the metal layer by stretching the base film. The casing part has a decorated region, the decorating film being adhered to the decorated region.

A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.

A transfer sheet includes a cured liquid crystal composition layer, a block layer including a (meth)acrylic polymer, and a thermoplastic welded layer in this order, the thermoplastic welded layer and the block layer are in direct contact with each other, and the thermoplastic welded layer includes a thermoplastic resin and an ultraviolet curable resin.

A method of manufacturing a real material product having a composite layer and using a liquid-phase reactive curing method according to the present invention can precisely and beautifully manufacture a real material product through a double injection process, and can implement various patterns. The bottom of a real material layer is coated with a plastic resin layer, and the top of the real material layer is coated with a PUA or PUR layer.