A composite component and methods for producing a composite component are described herein. In some aspects, a method for producing a composite component may include molding a body from a plastic material, such that the molded body has at least one recess arranged adjacent to at least one respective projection. This method may also include pressing the at least one respective projection such that the plastic material of the molded body is thereby displaced into an opening-side region of the at least one recess adjacent thereto. The method may further include introducing flowable filler material into the at least one recess and solidifying the filler material. The filler material may be an electrically conductive filler material.

To manufacture a motor vehicle composite component, plastic particles are introduced into a mold cavity of a mold and are connected there to one another to form a particle foam. The mold is then adjusted while the mold cavity changes, and a thermoplastic plastic is then injected into the mold cavity while a carrying element and/or at least one fastening element are formed, wherein the thermoplastic plastic is bonded to the particle foam at least by connection in substance. The aforementioned materials may also be introduced in the reverse order. The mold is then adjusted once again while the mold cavity changes, and a metal melt is then injected into the mold cavity, as a result of which an electrical strip conductor and/or at least one metallic fastening element are formed.

A connector cavity assembly for a medical device, comprising at least one connector cavity comprising a plurality of electrically conductive electrode contacts spaced apart from each other and a plurality of electrically insulating insulation elements, wherein the electrode contacts and the insulation elements are arranged alternatingly; and a connector cavity housing. The connector cavity assembly is characterized in that the at least one connector cavity is removably arranged within the connector cavity housing, wherein the connector cavity housing exerts a pretension on the at least one connector cavity leading to a liquid-tight sealing between the insulation elements and the electrode contacts.

A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.

A plastic polycarbonate film is silk screen printed or printed with a robotic application or any other printing application, with a defrost grid composed from a flexible circuit of a silver or other thermoformable conductive inks and then trimmed/die cut to size. Once the plastic decoration is trimmed to size it is placed into an injection mold. In the molding process, the decorated insert is placed into the cavity or onto the core of an injection mold that has been designed for in-mold decorating. The desired molding resin is shot behind or over the insert, bonding its surface to the decorated insert and forming an integral finished part.

A conductive member module has a pair of conductive members formed in a plate shape and facing each other, and a sealing part for sealing the pair of conductive members. The conductive member module is produced by performing an accommodation step, a sealing step, and an extraction step. In the sealing step, the conductive members are sealed with a resin injected into a die while a force is applied by the resin to the individual conductive members in directions to approach each other in a facing orientation of the pair of conductive members.

A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector. Reuseable plates may be used instead of the heat sink panels. Alternatively the panel may be encapsulated in and separated from a re-useable mold after curing.

A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.

A defrosting system for a window, headlight, or taillight for a vehicle includes a polymeric substrate, an ink layer disposed on the substrate and comprising a conductive or resistive ink, and a film layer disposed on the ink layer such that the ink layer is between the film layer and the polymeric substrate layer.

A manufacturing method of a symbol button for a vehicle includes: preparing a button body comprising a side portion, a top portion formed of a polymer material on which a metal is able to be plated; forming an electrically conductive layer on an outside of the button body using a conductive polymer material; forming a plating shielding layer in a form of a symbol using a material on which a metal is not able to be plated on the electrically conductive layer; and performing metal plating on the outside of the button body having the plating shielding layer.