Patent classifications
B29C45/1701
Apparatus for injection molding rotor magnets
An apparatus or assembly for forming injection molded magnets in permanent magnet rotors or laminations for such rotors. The assembly includes a plurality of platens defining an axial boundary of a die cavity and a plurality of support shoes that are radially moveable between a closed position defining a radial boundary of the die cavity, and an open position creating a gap between the rotor core and the plurality of support shoes. The assembly has an injection system for filling at least one of the plurality of voids of the rotor core with a magnetic slurry, and a plurality of alignment magnets configured to magnetically align the magnetic slurry.
Method for manufacturing foamable injection molding and injection device therefor
A plasticizing process in which a molten resin that has been plasticized and dissolved in a foaming gas is sent to the front end side of a heating cylinder (20) by means of a screw (21) that rotates in a heating cylinder (20), and the screw (21) retreats according as the molten resin accumulates in the front end side of the heating cylinder (20); a transfer process in which the screw (21) is advanced with rotating and transfers the molten resin accumulated in the front end side of the heating cylinder (20) from a plasticizing unit (2) to an injection unit (3), and an injection process in which the molten resin is injected from the injection unit (3) are conducted and repeated to produce a foamable injection molded product.
2K polyurethane systems with phase separation
The invention relates to a two-component polyurethane composition containing i) 10 to 80 wt. % of at least one polyol with an average molecular weight of 200 g/mol to 3000 g/mol, ii) 5 to 60 wt. % of at least one aromatic polyisocyanate, and iii) 0 to 15 wt. % of an additive. The composition has an NCO:OH ratio of 2:1 to 1:2, and the composition has a viscosity of 20 to 3000 mPas (EN ISO 2555, Brookfield viscometer, 25 C.) and displays a phase incompatibility after the mixing process. The functionality of the polyol mixture is greater than 2.3.
Method for sealing surfaces of a cellular foam body
A method of at least partially sealing surfaces of a body of a cellular foam, preferably comprising polyethylene terephthalate, the cellular foam having an initial compression strength, the method comprising the steps of: providing a body of an cellular foam comprising polyethylene terephthalate, the body having opposite surfaces; disposing the body between first pressure elements; in a first pressure applying step at a first temperature above 100 C., applying a first compression pressure to the opposite surfaces by the first pressure elements, the first compression pressure being less than 10% of the initial compression strength; disposing the pressed body between second pressure elements; and in a second pressure applying step at a second temperature at least 25 C. lower than the first temperature, applying a second compression pressure to the opposite surfaces, the second compression pressure being less than 15% of the initial compression strength.
2K polyurethane systems with a high glass-transition temperature
A two-component polyurethane composition with a viscosity of 20 to 3000 mPa.Math.s (EN ISO 2555, 25 C.), containing i) 10 to 80 wt. % of at least one polyol with a number-average molecular weight of 200 g/mol to 3000 g/mol, ii) 5 to 70 wt. % of at least one polyisocyanate, iii) 0 to 10 wt. % of a catalyst, wherein the composition has an NCO:OH ratio of 2:1 to 1:2 and polyisocyanates are used, wherein 3 to 25 mol % of the NCO groups of the polyisocyanate are converted into carbodiimide and/or uretonimine. The two-component polyurethane compositions are used as matrix binders for fiber composite moldings.
OPTICAL ASSEMBLIES INCLUDING A SPACER ADHERING DIRECTLY TO A SUBSTRATE
This disclosure describes optical assemblies that can be fabricated, for example, using wafer-level processes. The process can include providing a wafer stack that includes an optics wafer, and molding spacers directly onto the surface of the optics wafer. The spacers can be molded, for example, using a vacuum injection technique such that they adhere to the optics wafer without adhesive.
Mold for producing three-dimensional items
The invention relates to a mold for producing three-dimensional items, consisting of at least two mutually attachable pieces, and within which pieces the volume of the item to be produced is delimited. In said mold, owing to the mutually supporting surfaces, said pieces have formations delimiting airtight chambers between consecutively attached pieces. At least one of the pieces used to form part of each airtight chamber has a pneumatic valve through which said chambers are connected to a vacuum source, by means of which a sufficient negative pressure is created in the chambers to fix to one another the pieces delimiting such chambers. The walls of the pieces are non-deformable as a result of the negative pressure created within the chambers.
Rotor blade root assembly for a wind turbine
The present disclosure is directed to a root assembly for a rotor blade of a wind turbine and methods of manufacturing same. The root assembly includes a blade root section having an inner sidewall surface and an outer sidewall surface separated by a radial gap, a plurality of root inserts spaced circumferentially within the radial gap, and a plurality of spacers configured between one or more of the root inserts. Further, each of the root inserts includes at least one bushing surrounded by a pre-cured or pre-consolidated composite material. In addition, the spacers are constructed of a pre-cured or pre-consolidated composite material.
MOLDING APPARATUS INCLUDING A COMPRESSIBLE STRUCTURE
The invention provides a molding apparatus comprising a first mold part operative to hold a semiconductor substrate, and a second mold part having a main surface facing the first mold part. The first and second mold parts are movable relative to each other between an open arrangement and a closed arrangement. The main surface comprises portions defining a mold cavity, and a recess at least partially surrounding the mold cavity. The main surface also comprises a compressible structure located within the recess, wherein at least a portion of the compressible structure extends out of the recess towards the first mold part and is compressible into the recess when the compressible structure contacts the semiconductor substrate in the closed arrangement. The second mold part also comprises one or more air conduits operative to introduce compressed air into the mold cavity.