A process for molding one or more bottle preforms, wherein molten plastic is injected into at least one molding cavity; and wherein air is drawn from the at least one molding cavity, through at least one channel for the air to pass from the at least one molding cavity towards the outside of the molding device, by means of suction means; and apparatus and device for performing such a process.

To provide a thermoplastic resin composition having an enhanced cleaning performance for cleaning a molding processing machine. The thermoplastic resin composition for cleaning a molding processing machine contains (A) an olefin-based resin, and (B) (B1) a nonionic surfactant having an HLB of 13 to 20, wherein the composition contains component (B) in an amount of 0.5 to 10 parts by mass relative to 100 parts by mass of component (A).

For each of different resins R, a zero shear viscosity ?o of each resin R is obtained by using a conversion function expression whose parameters are a melt flow rate (MFR) and a set temperature of a heating cylinder and is registered. Also, a purge resin required amount Wu corresponding to a viscosity difference ?d between the zero shear viscosity ?of of a former resin Rf and the zero shear viscosity ?os of a succeeding resin Rs is registered. When resin switching is performed, the zero shear viscosity ?of of the former resin Rf and the zero shear viscosity ?os of the succeeding resin Rs are obtained by inputting the MFR of the former resin Rf and the MFR of the succeeding resin Rs to a molding machine controller, the viscosity difference ?d between the zero shear viscosity ?of of the former resin Rf and the zero shear viscosity ?os of the succeeding resin Rs is obtained, an amount of a purge resin required for resin switching is obtained as a purge resin required amount Wu, and at least the obtained purge resin required amount Wu is displayed.

An injection molding system includes a conveyor apparatus that moves a mold, and an injection molding apparatus that performs, using an injection cylinder and a screw, injection molding with the mold, wherein the improvement of the injection molding system includes at least one structure located in proximity to at least a part of the conveyor apparatus, wherein the at least one structure includes at least one element that is moveable, and wherein, when the screw is removed from the injection cylinder, the at least one element is in a position to prevent the at least one element from contacting the screw.

A nozzle assembly for an injection molding system has a nozzle adapter with one or more vent holes therein. A porous metal insert is provided in fluid communication with at least one of the vent holes. The porous metal insert is also in fluid communication with a flow channel through the nozzle assembly. As molten polymeric material advances through the flow channel from a barrel to a mold assembly, gases entrained in the molten polymeric material are vented through the porous metal insert and escape through the one or more vent holes. Pressurized air may be introduced through the vent holes, such as by one or more blow-back modules, to unclog pores of the one or more porous metal inserts between shots of the injection molding system.

A manufacturing method of a semiconductor device includes the steps of: preparing a lead frame; mounting a plurality of semiconductor chips on the lead frame; and sealing one portion of the lead frame with a sealing resin. The resin-sealing step includes the step of: disposing the lead frame, molds having main surfaces on which cavity parts are formed, the lead frame being disposed on the main surface of the heated molds; injecting a resin in the main surfaces of the heated molds so as to seal the one portion of the lead frame with the sealing resin; and taking out the lead frame from the heated molds. In the taking-out step, while the lead frame is taken out, the main surfaces of the molds are inspected by using a sensor, and the sensor is cooled and formed integrally with an arm used for taking out the lead frame.

The invention discloses a probe and a method of manufacturing the same. The probe has a long cylindrical shape and includes a probe head (1), a probe body (2) at the rear of the probe head (1), and a probe tail (3) at a rear end of the probe body (2). The probe has a three-layer composite structure. The probe tail is a three-layer composite structure. The probe of the invention is used to detect a body tissue, and according to different electrical signals fed back by different body tissues, a type of the body tissue being detected by the probe can be known, thereby avoiding a medical accident in which a spinal cord or nerve is injured by a screw intruded into a vertebral foramen. The probe of the invention is simple in structure, convenient for use, easy in operation, of high reliability, high surgical safety and high success rate of surgery.

A nozzle assembly for an injection molding system has a nozzle adapter with one or more vent holes therein. A porous metal insert is provided in fluid communication with at least one of the vent holes. The porous metal insert is also in fluid communication with a flow channel through the nozzle assembly. As molten polymeric material advances through the flow channel from a barrel to a mold assembly, gases entrained in the molten polymeric material are vented through the porous metal insert and escape through the one or more vent holes. Pressurized air may be introduced through the vent holes, such as by one or more blow-back modules, to unclog pores of the one or more porous metal inserts between shots of the injection molding system.

A mold component configured to be actuated between: a first configuration in which the mold component comprises a passage that allows passage of fluid (such as air) and prevents passage of the melt; and a second configuration in which the passage is actuated such as to become part of a molding surface.

A manufacturing method of a semiconductor device includes the steps of: preparing a lead frame; mounting a plurality of semiconductor chips on the lead frame; and sealing one portion of the lead frame with a sealing resin. The resin-sealing step includes the step of: disposing the lead frame, molds having main surfaces on which cavity parts are formed, the lead frame being disposed on the main surface of the heated molds; injecting a resin in the main surfaces of the heated molds so as to seal the one portion of the lead frame with the sealing resin; and taking out the lead frame from the heated molds. In the taking-out step, while the lead frame is taken out, the main surfaces of the molds are inspected by using a sensor, and the sensor is cooled and formed integrally with an arm used for taking out the lead frame.