In order to achieve lower costs in a molding apparatus using a mold by reducing mold cleaning steps following releasing of the product from the mold and shortening the molding cycle, the apparatus is equipped with a plurality of fixed molds and movable molds which are heated to the temperature necessary to harden a molding material and come together by means of clamping to form a cavity, and a non-heated cold runner which supplies the molding material from an injection device to the interior of the cavity via a gate opened in the movable mold, the fixed molds and movable molds being movable between an injection stage where the injection device and cold runner (32) are present and an opening stage near the injection stage.

There is provided a molding method for efficiently and accurately molding a hollow part of a thermosetting resin with a simple mechanism, a mold, and a molded article. A mold used for molding of a thermosetting resin includes an upper mold, an intermediate mold, and a lower mold which can be stacked with each other. Primary molding for molding segment parts and secondary molding for bonding the segment parts are sequentially performed by placing or retracting the intermediate mold to switch between a runner for primary molding and a runner for secondary molding.