An injection mold for molding a flip-top closure having a body portion and a lid attached to the body portion by a living hinge has first and second mold portions for defining first and second portions of the flip-top closure respectively, a lid closing tool for closing the lid of the flip-top closure on the body portion after a molding of the flip-top closure in the injection mold and before an ejection of the flip-top closure from the injection mold, and first and second linear actuators operatively connected to the lid closing tool for moving the lid closing tool about first and second axes respectively. The first and second linear actuators are controllable to move the lid closing tool along a lid closing path for closing the lid. An in-mold lid closing device and a method for making a flip-top closure are also disclosed.

An injection molding system includes a plurality of inspection apparatuses for inspecting molded article quality, a unit that transports a molded article molded by an injection molding machine, a molded article containment unit that is provided for each of types of post-treatment operations needed for the molded article, a transport destination designation unit that selects and designates the molded article containment unit to contain the molded article on the basis of a combination of inspection results from the plurality of inspection apparatuses, and a molded article sorting and transport unit that sorts and transports the molded article into the molded article containment unit designated by the transport destination designation unit.

The present invention provides a resin molded product production method that can reduce the molding defects even when resin-molding is performed in a state where a chip is temporarily bonded to a carrier via a temporary bonding sheet. The method for producing a resin molded product obtained by subjecting an object to be molded being a chip 21 temporarily bonded to a carrier 11 via a temporary bonding sheet 12 to transfer molding, including the step of: resin-molding the object to be molded by transfer molding using a molding die 1000, wherein the resin-molding is performed in a state where a gap G is formed so that the temporary bonding sheet 12 disposed in the molding die 1000 and a surface facing the temporary bonding sheet 12 on a side where the chip 21 is temporarily bonded do not come into contact with each other.

Types of molded articles carried by a carrier are identified and the molded articles are sorted based on image-related information for the molded articles molded based on set operating conditions for injection molding machines and molded article images acquired by an image acquisition unit. It is thus possible to narrow down candidate images in processing in a molded article identification unit, thereby making it possible to construct an injection molding system that has excellent production efficiency with a reduced load on processing in the molded article identification unit.

An injection molding system including an injection molding device including an injection molding section that has a fixed section to which a fixed molding die and a movable molding die are attached and fixed and that is configured to mold a molded article by injecting a material containing a metal powder into a cavity, and a first movement section for moving the movable molding die between a molding die closed position and a molding die open position, a cleaning device that performs cleaning of the molded article by blowing air, and a control device, wherein when the movable molding die is not at the molding die closed position, the control device does not cause the cleaning device to blow air, and when the movable molding die is at the molding die closed position, the control device causes the cleaning device to perfom blowing of air.

A handling device (1) for tubular or elongate bowl-shaped workpieces such as pipette tips (4) or cups, said workpieces preferably being transported or being able to be transported on a workpiece carrier (T) during the production of said workpieces until packaging, the workpiece carrier (T) having receiving places (5) for the workpieces, which receiving places are arranged in a grid relative to each other, preferably with the stipulation that faulty workpieces located on the workpiece carrier (T) can be detected, and preferably with the stipulation that a removal station (25) is provided, by means of which the faulty workpieces can be removed from the receiving places (5) of a workpiece carrier (T), receiving places (5) thus being freed up, freed-up receiving places (5) of the workpiece carrier (T) being able to be loaded with faultless workpieces by means of the handling device, the handling device comprising a refill magazine (2), which has magazine places (3) arranged next to each other, each magazine place having a holding element (7) that can be moved up and down and that is used to secure and to receive and release a faultless workpiece, with the additional stipulation that each magazine place (3) comprises a guide tube (6), in which the up and down movement of the holding element (7) occurs, the holding element (7) being able to be moved, together with a secured workpiece, into the guide tube (6), and that an acceleration apparatus (V) is provided, by means of which the workpiece can be accelerated out of the guide tube (6) and can be moved to a receiving place (5) of the workpiece carrier (T).

A cell device includes a housing including an accommodation space and a door connected to the accommodation space, a movable device arranged in the accommodation space, and an operation section arranged in the accommodation space and configured to operate the movable device, wherein the door includes a light blocking section having a light blocking property and a light transmitting section having light transmissivity and in a state where the door is closed, the light blocking section overlaps with the operation section when the housing is viewed from a door side along a normal direction of the door. The operation section is arranged in the accommodation space so as to face the door and is arranged further to the door side than is the movable device.

The present invention includes an injection molding factory system and an associated facility that comprises a building having a series of injection molding machines array on a first floor with the resin supply placed on a mezzanine level. The injection molding machines are arranged with automatic product conveyors to move injection molded product from the injection molding machines without the need for human operators or separate vehicles.

A handling system and/or a grouping unit of a handling system and a method for handling individual parts that have to be removed from a preceding production process, in particular injection-molded parts in the form of pipette tips that are produced in groups in an injection molding machine with a multiple tool and must be removed from the multiple tool for the further handling, the multiple tool including at least one distributing star having a plurality of mold cavities, whereby a removal arrangement is defined by the multiple tool for the further handling of the injection-molded parts. The method includes removing the finished injection molded parts, loading the parts into a grouping unit to produce a grid arrangement, and removing the parts from one grouping unit with a second grouping unit.

A silicone pencil preparation device includes: a conveying apparatus, a grabbing apparatus, a silicone injection molding machine and a control apparatus. The conveying apparatus includes an unprocessed pencil conveying apparatus and a processed pencil conveying apparatus. The silicone injection molding machine includes a main machine provided with a mold and a mold closing system, the mold includes a front mold and a rear mold, the mold is secured onto the mold closing system, and a middle portion of a front mold cavity is provided with a pencil carrying slot. The control apparatus is configured to perform the following steps: moving an unprocessed pencil to the pencil carrying slot; performing a mold closing operation; performing an injection molding operation on the front mold cavity and a rear mold cavity; performing a mold splitting operation; and moving a processed pencil in the pencil carrying slot to the processed pencil conveying apparatus.