A system for transforming plastic parisons to plastic containers with a transport device which transports the plastic parisons along a predetermined transport path, wherein the transport device has a movable station support disposed at least indirectly on a stationary base support on which a plurality of transforming stations is disposed. The transforming stations each have blow mold devices which each form cavities within which the plastic parisons can be transformed into the plastic containers and these blow mold devices are each disposed on blow mold supports. The system has a changing device which is suitable and intended in order, in a changing mode of the system, at least to remove the blow mold devices from their blow mold supports and/or to dispose blow mold devices on the blow mold supports, and wherein, during a further mode of operation which differs from the changing mode, this changing device is suitable and intended for carrying out a treatment operation on at least one working element intended for the system.

Ways for simultaneously forming and filling a container with a liquid product are provided that include a mold cavity, a dispensing means, a blow nozzle, a conduit, and a hydrophobic surface. The mold cavity defines an internal surface and accepts a preform. The dispensing means receives the liquid product and dispenses a charge of the liquid product. The blow nozzle transfers the charge of the liquid product dispensed from the dispensing means into the preform to urge the preform to expand toward the internal surface of the mold cavity and form a resultant container. The liquid product remains within the container as an end product. The conduit fluidly couples the dispensing means to the blow nozzle. The hydrophobic surface contacts the liquid product when the system simultaneously forms and fills the container, where the hydrophobic surface forms part of the dispensing means, the blow nozzle, and/or the conduit.

A resin residue removal device is provided that is capable of appropriately removing a resin residue adhered to a lower surface of a die of a molding apparatus. The present invention provides a resin residue removal device for removing a resin residue adhered to a lower surface of a die of a molding apparatus, the device including a moving mechanism and a resin residue removal head, wherein the moving mechanism is configured to move the resin residue removal head between a lateral position out of a position immediately below the die and an immediately below position as the position immediately below, and also in the immediately below position, to move the head between a separate position separate from the lower surface and a close position close to the lower surface, and the resin residue removal head is configured to allow removal of the resin residue adhered to the lower surface by moving along the lower surface.

A plunger pump, including: a tubular cylinder that has an internal space communicating with inlet and outlet flow paths; and a piston that is movable along an axis of the cylinder, wherein a head of the piston includes, on an outer peripheral surface thereof, a sealing portion that is slidable against an inner peripheral surface of the cylinder, which includes a body tubular portion wherein the head is arranged during normal use, and a cleaning tubular portion wherein the head is arranged during cleaning, an inner peripheral surface of the cleaning tubular portion has an inner diameter equal to that of an inner peripheral surface of the body tubular portion, the cleaning tubular portion includes, on the inner peripheral surface thereof, at least one cleaning liquid circulation groove that is configured by a through hole or recess, and the cleaning liquid circulation groove extends obliquely with respect to the axis.