The present invention is a process for performing a planarization treatment of pressure-sensitive adhesive (PSA). The process includes positioning a first substrate onto a support surface of a planarization tool. The process further includes placing at least one layer of PSA onto the first substrate. The process further includes positioning a second substrate onto the layer(s) of PSA. The process further includes applying a pressure to the second substrate via a flexible membrane, said pressure being applied in a generally uniform, unidirectional and localized manner. Further, the applied pressure flattens the PSA between the first substrate and the second substrate for promoting suitability of the PSA for use in rigid-to-rigid lamination processes.

The present invention is a process for performing a planarization treatment of pressure-sensitive adhesive (PSA). The process includes positioning a first substrate onto a support surface of a planarization tool. The process further includes placing at least one layer of PSA onto the first substrate. The process further includes positioning a second substrate onto the layer(s) of PSA. The process further includes applying a pressure to the second substrate via a flexible membrane, said pressure being applied in a generally uniform, unidirectional and localized manner. Further, the applied pressure flattens the PSA between the first substrate and the second substrate for promoting suitability of the PSA for use in rigid-to-rigid lamination processes.

An equipment and method for processing a carrier using a pressure difference combined with a correction fixture are disclosed. The equipment includes an upper carrier pressing device provided with a first heater, a first sealed space, and an air bladder, and a lower carrier pressing device provided with a second heater, a second sealed space, and a correction fixture. The carrier is placed between the air bladder and the correction fixture. By utilizing the pressure difference formed between the air bladder and the correction fixture, warping deformation of the carrier is effectively suppressed. The geometric surface of the first surface of the carrier is obtained through simulation or actual measurement, and the upper contact surface of the correction fixture is processed into an inverse geometric surface to offset thermal stress, thereby causing the carrier to be shaped and become more flattened.

An equipment and method for processing a carrier using a pressure difference combined with a correction fixture are disclosed. The equipment includes an upper carrier pressing device provided with a first heater, a first sealed space, and an air bladder, and a lower carrier pressing device provided with a second heater, a second sealed space, and a correction fixture. The carrier is placed between the air bladder and the correction fixture. By utilizing the pressure difference formed between the air bladder and the correction fixture, warping deformation of the carrier is effectively suppressed. The geometric surface of the first surface of the carrier is obtained through simulation or actual measurement, and the upper contact surface of the correction fixture is processed into an inverse geometric surface to offset thermal stress, thereby causing the carrier to be shaped and become more flattened.