A patterning method using an imprint mold, to form an imprinted pattern structure, includes providing a resist layer from which the pattern structure will be formed, performing a first imprint process on a first area of the resist layer by using the imprint mold to form a first pattern of the pattern structure through deformation of the resist layer in the first area, and performing a second imprint process on a second area of the resist layer by using the imprint mold to form a second pattern of the pattern structure through deformation of the resist layer in the second area. The first and second areas are overlapped with each other in a third area of the resist layer, and the performing the second imprint process deforms a first portion of the first pattern in the third area to form the second pattern.

A riblet film has a riblet structure on a first side of the riblet film; and a fixing surface on a second side of the riblet film. The riblet film is formed from a cured embossing lacquer, in which a planar textile is embedded, and in which the riblet structure is embossed.

A method for processing floorboards using digital printing, comprising: preparing a base material layer; arranging a printing layer on the base material layer, wherein the printing layer is directly printed by a digital printing apparatus and is formed on a surface of the base material layer; and arranging a protection layer on the printing layer, wherein the protection layer is attached to the printing layer by means of one or a combination of processes selected from roll-coating, shower-coating, spray-coating, transfer-printing and printing, wherein the protection layer displays one or a combination of artistic effects selected from flat, sunken, raised, finely creased, patterned and crackled by means of one or a combination of processes selected from levelling, flatting, printing, embossing, corroding, carving, brushing and crackling. According to the processing technology of the present disclosure, various patterns can be designed and processed in different ways or combinations according to the user's requirements.

Provided are: a composition for forming an underlayer film for imprinting, which contains a high-molecular-weight compound having a polymerizable group, a chelating agent, and a solvent, and a method for producing the same; a kit including the composition for forming an underlayer film; a pattern producing method using the composition for forming an underlayer film; and a method for manufacturing a semiconductor element, which includes the pattern producing method as a step.

In order to provide an imprint device capable of reducing pattern defects, the imprint device which brings a mold into contact with an imprint material on a substrate and transfers a shape of a surface of the mold onto the substrate includes: a mold holding part which holds the mold; a substrate holding part which holds the substrate; and a measuring unit which measures a contact force generated when a part of the mold or the mold holding part is brought into contact with a predetermined contact part, wherein the contact part is installed at a position in a predetermined plane different from a position in the predetermined plane of the substrate held by the substrate holding part and is installed at a height position corresponding to a height of a surface of the substrate held by the substrate holding part.

A pattern forming method of forming, with a mold, a pattern on a substrate held by a substrate holding unit capable of changing a holding force for each holding region includes setting, with a plurality of shot regions corresponding to a first holding region as a target for pattern formation, a first holding force in the first holding region smaller than a second holding force in a second holding region different from the first holding region, coating, with an imprint material, a region including the plurality of shot regions corresponding to the first holding region, and forming the pattern on the substrate by bringing the imprint material, with which the plurality of shot regions corresponding to the first holding region is coated, and the mold in contact with each other.

A multidimensional heat-seal emblem having a digitally-printed image on one side in registration to a three-dimensional relief profile. The emblem has enhanced aesthetic impact, flex, stretch, durability and is suitable for soft goods. A method of production is also disclosed that provides 0.05 mm level relief detail with high profile features up to 6 mm in height.

An imprinting template, an imprinting system, and an imprinting method for imprinting a pattern in a formable material on a substrate. The template includes an edge region that surrounds a pattern region. A full height represents an absolute value of a distance between top surface and bottom surface of the pattern region. The edge region extends to an edge of a mesa of the template. A portion of the edge region may be at least a full height below the top surface of the pattern region. An area of the portion of the edge region may be at least large enough to prevent formable material that is between the template and the substrate from extruding out beyond the edge of the mesa.

A molding apparatus that molds a composition on a substrate with a mold includes a mold holding unit configured to hold the mold, a substrate holding unit configured to hold the substrate, a first elastic member configured to apply a first elastic force to the mold holding unit in a direction away from the substrate holding unit, and a control unit configured to cause the mold holding unit to move in the direction away from the substrate holding unit in a case where the control unit determines that an abnormality has occurred.

A method and an apparatus for embossing a pattern into a varnish on a sheet-like substrate are provided. The method applies a planar stamp using a roller, while the apparatus includes a roller having a planar stamp.