Patent classifications
B29C2059/027
Method for producing packaging for an item and packaging
A method for producing packaging for an item and to a packaging for an item is provided. The method provides for the following: providing a container material consisting of a leaf material from a plant; shaping the container material into a three-dimensional packaging container having a container opening and a container edge surrounding the container opening; producing a sealing edge on a top surface of the container edge, wherein the top surface of the container edge is sanded down by sanding; placing an item in the three-dimensional packaging container through the container opening and sealing the container opening by a sealing film, wherein the sealing film is adhesively bonded to the sealing edge in an adhesive-free manner.
Display device and method of fabricating the same
A method of fabricating a display device includes: preparing a substrate including emission areas and a non-emission area between the emission areas; forming a bank on the non-emission area to a first height; forming light conversion patterns on the emission areas to a height equal to or less than the first height; polishing a surface of a light conversion layer including the bank and the light conversion patterns so that the surface of the light conversion layer is flat; and forming a filler layer on a surface of the substrate on which the light conversion layer is provided. The polishing of the light conversion layer includes planarizing the surface of the light conversion layer so that the bank and the light conversion patterns have a second height through chemical mechanical polishing utilizing a metallic slurry.
Manufacturing method for a substrate wafer
A manufacturing method for a substrate wafer, including: a wafer having a first and second main surface; forming a flattening resin layer on second main surface; with the flattening resin layer adsorbed and held as a reference surface, grinding or polishing first main surface as a first processing; removing flattening resin layer from the wafer; with the wafer's first main surface subjected to the first processing adsorbed and held, grinding or polishing second main surface as a second processing; with the second main surface subjected to second processing adsorbed and held, further grinding or polishing first main surface as a third processing; with first main surface subjected to third processing adsorbed and held, further grinding or polishing second main surface as a fourth processing to obtain a substrate wafer, wherein first processing and/or third processing is executed such that the wafer has a central concave or central convex thickness distribution.
DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
A method of fabricating a display device includes: preparing a substrate including emission areas and a non-emission area between the emission areas; forming a bank on the non-emission area to a first height; forming light conversion patterns on the emission areas to a height equal to or less than the first height; polishing a surface of a light conversion layer including the bank and the light conversion patterns so that the surface of the light conversion layer is flat; and forming a filler layer on a surface of the substrate on which the light conversion layer is provided. The polishing of the light conversion layer includes planarizing the surface of the light conversion layer so that the bank and the light conversion patterns have a second height through chemical mechanical polishing utilizing a metallic slurry.
Method for Processing Thermoset Parts
The present disclosure relates to a method for processing an additively manufactured thermoset part. The method comprises heating an outer surface of the additively manufactured thermoset part to a temperature which is greater than or equal to the heat distortion temperature of the part and which is less than the thermal degradation temperature of the part. By pre-heating the outer surface of the part to within the aforementioned range, it has been found that the additively manufactured thermoset part can be subsequently abraded more quickly and easily.
Polypropylene-Based Material For Fuse Welding Repairs On Automotive Plastic Components
A heat welding composition and method for the repair of vehicle body components, particularly thermoplastic bumpers manufactured from polypropylene/EPDM. The composition includes a polypropylene base resin, talc filler, and optional additives, so as to be optimized for fusion-welding plastic to plastic automotive substrates. The method allows the material to be extruded into strips, applied with standard heat welding tools, and fused directly to damaged parts. The composition and method eliminate the need for structural fillers and enables OEM-grade repairs with improved durability, sustainability, and speed.
METHOD FOR PRODUCING A STRUCTURE ON A SURFACE
A method for manufacturing a structure on a surface of a workpiece (1) is disclosed, the method having the following steps: applying a liquid base layer (2) onto the surface of the workpiece (1); spraying on at least one droplet (3) into the not yet congealed base layer (2), wherein the at least one droplet (3) at least partially, preferably completely, penetrates into the base layer (2); fixing the base layer (2); and at least partially removing the at least one droplet (3).
Further, a second method having the following steps is disclosed: spraying on at least one droplet (3) onto the surface of the workpiece (1); applying a liquid base layer (2) onto the surface of the workpiece (1), wherein the base layer (2) flows around the at least one droplet (3) and preferably at least partially covers the at least one droplet (3); fixing the base layer (2); at least partially removing the at least one droplet (3).
Finally, a device for performing the methods is disclosed.