The present invention relates to a polyvinyl acetal resin film, comprising a polyvinyl acetal resin material, wherein the polyvinyl acetal resin film has a thickness of 5 to 350 μm, and satisfies the following Formulae (1) and (2) where, comparing one surface and the other surface, a mean value of the 10-point average roughness of a rougher surface A and a mean value of the 10-point average roughness of a smoother surface B are defined as Rz1(a) μm and Rz2(a) μm, respectively:

Rz1(a)>1.1×Rz2(a)  (1)

3>Rz2(a)  (2), a value obtained by dividing the standard deviation of the 10-point average roughness of the surface A by Rz1(a) and a value obtained by dividing the standard deviation of the 10-point average roughness of the surface B by Rz2(a) are each 0 to 0.30, a viscosity of a toluene/ethanol (1:1, mass ratio) solution containing 10%-by-mass of a polyvinyl acetal resin contained in the polyvinyl acetal resin material, which is measured at 20° C. and 30 rpm using a Brookfield-type (B-type) viscometer, is 100 to 1,000 mPa.Math.s, and the amount of a plasticizer in the polyvinyl acetal resin film is 0 to 20% by mass based on a total mass of the polyvinyl acetal resin film.

A silicone embossing rubber roller has no fine depression defects on the surface and, furthermore, is not liable to produce protrusions on an embossed plastic film surface. The silicone rubber roller is such that the silicone rubber layer on the surface contains spherical solid particles, and the spherical solid particles having a particle size of 0.8 μm or smaller and the spherical solid particles having a particle size of 30 μm or larger respectively occupy 1% or less of the volume of all the spherical solid particles.

A silicone embossing rubber roller has no fine depression defects on the surface and, furthermore, is not liable to produce protrusions on an embossed plastic film surface. The silicone rubber roller is such that the silicone rubber layer on the surface contains spherical solid particles, and the spherical solid particles having a particle size of 0.8 μm or smaller and the spherical solid particles having a particle size of 30 μm or larger respectively occupy 1% or less of the volume of all the spherical solid particles.

A thermoplastic film which embodies a three-dimensional pattern. The thermoplastic film comprises a three-dimensional pattern including at least three sub-patterns of deformations. The shape, positioning, and pattern deformation density of the at least three sub-patterns of deformations cause the three-dimensional pattern to give the thermoplastic film a thicker appearance.

A thermoplastic film which embodies a three-dimensional pattern. The thermoplastic film comprises a three-dimensional pattern including at least three sub-patterns of deformations. The shape, positioning, and pattern deformation density of the at least three sub-patterns of deformations cause the three-dimensional pattern to give the thermoplastic film a thicker appearance.

The present invention relates to a polyvinyl acetal resin film, comprising a polyvinyl acetal resin material, wherein the polyvinyl acetal resin film has a thickness of 10 to 350 μm, one surface has a 10-point average roughness Rz value of less than 2 μm and a friction angle of larger than 31° but 40° or smaller, the other surface has a 10-point average roughness Rz value of 2 μm to 7 μm and a friction angle of 20° to 31°, a viscosity of a toluene/ethanol (1:1, mass ratio) solution containing 10%-by-mass of a polyvinyl acetal resin contained in the polyvinyl acetal resin material, which is measured at 20° C. and 30 rpm using a Brookfield-type (B-type) viscometer, is 100 to 1,000 mPa.Math.s, and the amount of a plasticizer in the polyvinyl acetal resin film is 0 to 20% by mass based on a total mass of the polyvinyl acetal resin film.

Systems and methods that prevent oxygen inhibition of a light-initiated polymerization reaction by purging the oxygen from reaction surfaces using inert gas flow. In some embodiments, oxygen is purged using a gas diffusion system that introduces, via a diffuser, an inert gas into a workspace between a UV light source and a UV curable layer of a workpiece. The diffuser may be made of a transparent or diffuse material to allow UV light to pass through it, and includes an array of micro-holes for the gas to pass through towards the workpiece. The inert gas flow may be heated to maintain a desired and uniform reaction temperature.

Systems and methods that prevent oxygen inhibition of a light-initiated polymerization reaction by purging the oxygen from reaction surfaces using inert gas flow. In some embodiments, oxygen is purged using a gas diffusion system that introduces, via a diffuser, an inert gas into a workspace between a UV light source and a UV curable layer of a workpiece. The diffuser may be made of a transparent or diffuse material to allow UV light to pass through it, and includes an array of micro-holes for the gas to pass through towards the workpiece. The inert gas flow may be heated to maintain a desired and uniform reaction temperature.

Provided are a cylindrical base, a master and a method for manufacturing a master enabling a uniform transfer of a fine pattern. A cylindrical base of a quartz glass having an internal strain in terms of birefringence of less than 70 nm/cm is used. A resist layer is deposited to an outer circumference surface of this cylindrical base, a latent image is formed on the resist layer, the latent image formed on the resist layer is developed and the pattern of the developed resist layer is used as a mask for etching to form a structure including concaves or convexes arranged in a plurality of rows on the outer circumference surface of the cylindrical base.

Provided are a cylindrical base, a master and a method for manufacturing a master enabling a uniform transfer of a fine pattern. A cylindrical base of a quartz glass having an internal strain in terms of birefringence of less than 70 nm/cm is used. A resist layer is deposited to an outer circumference surface of this cylindrical base, a latent image is formed on the resist layer, the latent image formed on the resist layer is developed and the pattern of the developed resist layer is used as a mask for etching to form a structure including concaves or convexes arranged in a plurality of rows on the outer circumference surface of the cylindrical base.