Methods and systems are provided for fabricating polymer-based imprint lithography templates having thin metallic or oxide coated patterning surfaces. Such templates show enhanced fluid spreading and filling (even in absence of purging gases), good release properties, and longevity of use. Methods and systems for fabricating oxide coated versions, in particular, can be performed under atmospheric pressure conditions, allowing for lower cost processing and enhanced throughput.

According to one embodiment, a transfer apparatus includes a transfer roller which supports a mold and transfers a fine transfer pattern formed on the mold to a resin coated on a substrate installed in a substrate installation part with movement of the transfer roller and a transfer roller guide part for guiding the transfer roller when the mold is pressed against the resin coated on the substrate installed in the substrate installation part by the movement of the transfer roller.

A process for the nanostructuring of fibers in fiber-composite plastics, where a sulfur-containing nanostructure is formed. Also, a plastics matrix with such nanostructured fibers is disclosed, and also a process for the repair of fibers in a fiber-composite plastic.

The invention relates to a method for manufacturing a hoisting rope, comprising the steps of providing a plurality of elongated composite members, which composite members are made of composite material comprising reinforcing fibers in polymer matrix; and arranging the composite members to form an elongated row of parallel composite members, which row has a longitudingal direction, a thickness direction and a width direction, and in which row the composite members are positioned side by side such that they are parallel to each other, and spaced apart from each other in width direction of the row; and directing plasma treatment on the outer surface of the composite members; and embedding the composite members in fluid polymer material; and solidifying the polymer material wherein the composite members are embedded. The invention relates also to a hoisting rope obtained with the method and an elevator comprising the hoisting rope.

A reinforcing element, having a cross section with a flattened overall shape and extending in a main direction and comprising at least one lateral edge made of a polymeric composition comprising a thermoplastic polymer, the lateral edge extending in a general direction substantially parallel to the main direction is treated by heating at least a part of the lateral edge, during which at least a part of the lateral edge is subjected to a plasma flow so as to raise the temperature of the part of the lateral edge above the melting point of the thermoplastic polymer.

Disclosed herein are embodiments of a plasma treatment system and methods for utilizing directed plasma to reduce instances of gas venting and leaking of contents from plastic bottles due to scratches occurring on sealing interfaces of the bottles and closures. In an embodiment, a plasma treatment system for repairing scratches applied to PET bottles comprises one or more plasma nozzles disposed along a bottle filling line and a plasma being issued by the plasma nozzles to repair the scratches. The plasma nozzles are arranged into a configuration that uniformly distributes plasma to all parts of a neck finish comprising the PET bottles. The plasma treatment of the PET bottles is performed prior to capping of the bottles. In an embodiment, the plasma treatment is performed after filling the bottles with contents so as to avoid a risk of scratches from misaligned filling tubes.

The present invention has as its object the provision of a method of bonding substrates, which can bond two substrates, at least one of which has warpage and undulation of a bonding surface, in a high adhesion state and a method of producing a microchip. In the method of bonding substrates according to the present invention, the first substrate is formed of a material having a deformable temperature at which the substrate deforms and which is higher than a deformable temperature of the second substrate, the method includes: a surface activation step of activating each of bonding surfaces of the first substrate and the second substrate; a stacking step of stacking the first substrate and the second substrate so that the respective bonding surfaces thereof are in contact with each other; and a deforming step of deforming the bonding surface of the second substrate to conform to a shape of the bonding surface of the first substrate, and the deforming step is performed by heating the stacked body of the first substrate and the second substrate obtained in the stacking step at a temperature not lower than the deformable temperature of the second substrate and lower than the deformable temperature of the first substrate.

The present invention has as its object the provision of a method of bonding substrates, which can bond two substrates, at least one of which has warpage and undulation of a bonding surface, in a high adhesion state and a method of producing a microchip.

In the method of bonding substrates according to the present invention, the first substrate is formed of a material having a deformable temperature at which the substrate deforms and which is higher than a deformable temperature of the second substrate, the method includes: a surface activation step of activating each of bonding surfaces of the first substrate and the second substrate; a stacking step of stacking the first substrate and the second substrate so that the respective bonding surfaces thereof are in contact with each other; and a deforming step of deforming the bonding surface of the second substrate to conform to a shape of the bonding surface of the first substrate, and the deforming step is performed by heating the stacked body of the first substrate and the second substrate obtained in the stacking step at a temperature not lower than the deformable temperature of the second substrate and lower than the deformable temperature of the first substrate.

The present invention relates to a plasma generating apparatus for a secondary battery. The plasma generating apparatus for the secondary battery comprises a roller part comprising a transfer roller that transfers a separator and a metal member built in the transfer roller, and a plasma generating part comprising a main body spaced apart from the transfer roller and a plurality of electrode members disposed on positions that are spaced apart from each other in a direction of both ends of the main body and partially generating a plasma between the metal member and the main body to form a patterned bonding layer on a surface of the separator, wherein the plurality of electrode members are detachably coupled to the main body to adjust a number of the electrode members coupled to the main body based on a size of the separator.

For producing a dome-shaped element (2) provided with thermal protection for a solid propellant rocket engine, a coupling annular body (4) is arranged in a mold (5) and has a surface (20) that is clean and activated, by an atmospheric-pressure plasma treatment, before depositing a primer layer (26) and an adhesive layer (27) on the surface (20); ablative material is then automatically applied to the adhesive layer and to an area (17) of the mold (5) so as to form a series of superimposed layers (30).