A film peeling device includes a chamber, a lower stage disposed on a first wall of the chamber, first to fourth grippers capable of peeling first to fourth sides of a film by gripping the first to fourth sides of the film attached to an object disposed on the lower stage and an upper stage disposed on a second wall of the chamber facing the first wall of the chamber and capable of extending in a first direction in which the object is disposed.

A method of making a component includes applying a clamping force to the component, the component coupled to a carrier strip of a panel via a polymeric tab and separating a portion of the polymeric tab from a substrate of the component, thereby causing the component to be detached from the panel.

The application relates to a method for producing a double-walled pipe (1) and a pipe (1) of this type, having an outer pipe (3) which is press-fitted with an inner pipe (2) consisting of a corrosion-resistant alloy, wherein an adhesive (4) is inserted at least in regions between the outer pipe (3) and the inner pipe (2), wherein, after adhering the inner pipe (2) with the outer pipe (3), the inner pipe (2) and the adhesive layer (4) are removed at the pipe ends, and the inner side of the outer pipe (3) is plated via an integral connection with the inner pipe (2).

The present invention relates to a method for peeling off a strippable coating film formed on a surface of an adherend, including: a first step of preliminarily putting a trigger part in contact with at least a part of the surface of the adherend between the strippable coating film and the adherend; a second step of removing the trigger part so as to break at least a part of the strippable coating film; and a third step of peeling off the strippable coating film by using, as a trigger, a broken portion of the strippable coating film.

A method of manufacturing an optically anisotropic polymer thin film includes forming a composite structure that includes a polymer thin film and a high Poisson's ratio polymer thin film disposed directly over the polymer thin film, attaching a clip array to opposing edges of the composite, the clip array including a plurality of first clips slidably disposed on a first track located proximate to a first edge of the composite and a plurality of second clips slidably disposed on a second track located proximate to a second edge of the composite, applying a positive in-plane strain to the composite along a transverse direction by increasing a distance between the first clips and the second clips, and decreasing an inter-clip spacing amongst the first clips and amongst the second clips along a machine direction, wherein the high Poisson's ratio polymer thin film applies a negative in-plane strain to the polymer thin film along the machine.

The invention concerns a heating apparatus for recycling metal work pieces such as pipes, stacks, tanks and chutes which are lined and/or coated with materials such as rubber, neoprene, polyurethane or plastic. The heating apparatus applies heat to metal work piece to the point where the adhesive bond between the metal work piece and the rubber, neoprene, polyurethane or plastic is broken. An anti-ignition re-usable bladder is fitted inside a metal work piece to prevent ignition of the liner and/or coating and eliminate or significantly reduce the release of gases from the liner and/or coating during the heating process.

A debonding support device includes a suction plate including a support region for supporting a glass assembly, the support region including at least two suction regions applying different suction forces per unit area, the suction regions including a debonding initiation portion suction region for sucking a debonding initiation portion at which debonding of the glass assembly is to be initiated, the debonding initiation portion suction region applying the strongest of the different suction forces per unit area; a vacuum pump connected to the suction plate to provide a vacuum pressure for the suction plate, and a controller.

In a lining material peeling method of peeling a lining material, which is fixedly formed on a surface of a base material, from the base material, a liquefied fluid which evaporates after injection is injected to a boundary between the base material and the lining material.

A method for treating a substrate having millimeter and/or micrometer and/or nanometer structures. The method includes applying at least one protective material to the structures, wherein the at least one protective material can be dissolved in a solvent, and the structures are produced by an imprinting process.

A system for applying thermal interface materials to components includes a supply of thermal interface material and a die. The die is operable for pushing against and/or removing a portion of the thermal interface material that is between the die and a corresponding one of the components. The portion of the thermal interface material is removed from the supply and applied to the corresponding one of the components.