Described are systems and methods for multi-material printing. The systems and methods can utilize a stereolithographic printing device, a moving stage, and a microfluidic device. The microfluidic device can include a plurality of reservoirs, each reservoir housing a different ink for printing, and a microfluidic chip. The microfluidic chip can include a chamber that comprises a plurality of inlets, a printing region, and one or more outlets as well as an elastic membrane.

Described are systems and methods for multi-material printing. The systems and methods can utilize a stereolithographic printing device, a moving stage, and a microfluidic device. The microfluidic device can include a plurality of reservoirs, each reservoir housing a different ink for printing, and a microfluidic chip. The microfluidic chip can include a chamber that comprises a plurality of inlets, a printing region, and one or more outlets as well as an elastic membrane.

Embodiments related to systems and methods of forming structures on substrates (e.g., flexible substrates, fabrics, textiles, leathers) are disclosed. In some embodiments, a method of forming a structure on a substrate is provided. The method may involve submerging at least one surface of the substrate into a resin bath. The method may include patterning electromagnetic radiation through a window onto one or more regions of the substrate to polymerize the resin onto the one or more regions of the substrate. An alternative method may involve covering a surface of the substrate with a layer of polymeric powder. The alternative method may include directing electromagnetic radiation toward one or more regions on the surface of the substrate to heat the polymeric powder to form a layer on the surface of the substrate. A method of depositing an ultraviolet (UV)-curable material onto a substrate by a valve jetting process is also provided.

Embodiments related to systems and methods of forming structures on substrates (e.g., flexible substrates, fabrics, textiles, leathers) are disclosed. In some embodiments, a method of forming a structure on a substrate is provided. The method may involve submerging at least one surface of the substrate into a resin bath. The method may include patterning electromagnetic radiation through a window onto one or more regions of the substrate to polymerize the resin onto the one or more regions of the substrate. An alternative method may involve covering a surface of the substrate with a layer of polymeric powder. The alternative method may include directing electromagnetic radiation toward one or more regions on the surface of the substrate to heat the polymeric powder to form a layer on the surface of the substrate. A method of depositing an ultraviolet (UV)-curable material onto a substrate by a valve jetting process is also provided.

Provision module (2) for providing additive manufacturing powder, comprising a main hopper (29) for storing additive manufacturing powder, the main hopper (29) being designed to be connected to a manufacturing module (4) configured to additively manufacture an object from the powder located in the main hopper (29), an inlet (211) of the provision module (2), which inlet is designed to be connected to the manufacturing module (4) and to receive powder located in the manufacturing module (4), a glovebox (25) designed to receive a container (28), the glovebox (25) being able to be closed in a sealed manner, a supply circuit configured to transfer powder located in the glovebox (25) to the main hopper (29), an extraction circuit that is different from the supply circuit and is configured to transfer additive manufacturing powder from the inlet (211) of the provision module (2) to the container (28), when the container (28) is received in the glovebox (25), the glovebox (25) comprising gloves (251) for closing the container (28) once it has been filled with powder, while the glovebox (25) is closed.

A molding device includes a movement processing unit configured to move a liquid column sandwiched between two substrates and a molding unit configured to perform a molding process by partially changing the liquid column to a solid within a prescribed molding region.

A molding device includes a movement processing unit configured to move a liquid column sandwiched between two substrates and a molding unit configured to perform a molding process by partially changing the liquid column to a solid within a prescribed molding region.

A filament spool dry box includes a shell, a dehumidifier and a sleeve component. The shell includes a hanging structure configured to allow a bracket to be disposed in for hanging the shell. The dehumidifier is disposed inside the shell. The sleeve component is rotatably disposed inside the shell and configured to allow a filament to be disposed on. A central axis of the hanging structure is offset from and above a central axis of the sleeve component. The filament spool dry box can isolate the filament from an external environment outside the shell and remove moisture from an internal environment inside the shell by the dehumidifier. Therefore, the filament spool dry box can prevent the filament inside the shell from absorbing moisture. Furthermore, the filament spool dry box can replace disposable spools in the prior art and be energy saving and environmental protecting.

A Docking Arrangement for an Additive Manufacturing Process An operating handle (50) for controlling the operational state of a valve arrangement (26) associated with a container (12) to control dispensing of material from the container (12) to a component of an additive manufacturing process. The operating handle (50) includes a rotatable shaft 56 which is coupled to the valve arrangement (26) and is rotatable between a plurality of angular positions corresponding one or more operational states of the valve arrangement (26). A lever (52) is operatively coupled to the shaft (56) and is configured to cause rotation of the shaft (56) between the plurality of angular positions upon rotation of the lever (52). The handle (50) is also rotatable under the operation of an actuator (40) provided as part of a docking arrangement (10) associated with the component.

In some embodiments, a method of determining the fill level of a resin pool in a bottom-up additive manufacturing apparatus includes the steps of: (a) providing an additive manufacturing apparatus including a build platform and a light transmissive window (12), the build platform (15) and the window (12) defining a build region therebetween, with the window (12) carrying a resin pool, the pool having a resin top surface portion; (b) advancing the build platform (15) and the window (12) towards one another until the build platform (15) contacts the resin top surface portion; (c) detecting the impact of the build platform (15) with the resin top surface portion; and (d) determining the fill level of the resin pool from the detected impact.