Patent classifications
B29C65/006
PLASTICITY INDUCED BONDING
Methods and apparatuses for bonding polymeric parts are disclosed. Specifically, in one embodiment, the polymeric parts are bonded by plastically deforming them against each other while they are below the glass transition temperatures.
Plasticity induced bonding
Methods and apparatuses for bonding polymeric parts are disclosed. Specifically, in one embodiment, the polymeric parts are bonded by plastically deforming them against each other while they are below the glass transition temperatures. A method includes: placing a first polymeric part in contact with a second polymeric part; and plastically deforming the first polymeric part and the second polymeric part against each other to bond the first polymeric part to the second polymeric part. Additionally, during the plastic deformation, a temperature of the first polymeric part is less than a glass transition temperature of the first polymeric part and a temperature of the second polymeric part is less than a glass transition temperature of the second polymeric part.
SURFACE GEOMETRY FOR ADHESIVE BONDING OF POLYMER COMPONENTS
A method of joining polymer components includes additively manufacturing first and second mating features on first and second polymer components such that a mechanical lock is created through undercut geometric features of an adhesive material when the polymer components are joined. Adhesive is added between the mating components to strengthen the joint.
CMC blade with integral 3D woven platform
A method of forming a component for use in a gas turbine engine includes the steps of forming an airfoil/root assembly; creating a platform assembly structure having an opening; inserting the airfoil/root assembly into the opening; and bonding the platform assembly structure to the airfoil/root assembly to form the component.
Joining of polymer and surface-modified solid part
The present invention relates to alternative methods of joining a solid part (1) and a polymer (2). The methods comprise attaching a primer layer (4) with a predetermined surface chemistry, density and thickness covalently to at least a part of a surface (3) of the solid part (1). Some embodiments of the invention further comprise polymerizing second molecules onto the primer layer (4) so that the surface (3) is at least partly covered with surface immobilized polymer brushes (8). The surface (3) of the solid part (1) is brought into contact with the polymer (2) and a predetermined temperature profile is applied resulting in covalent bonds (6) being established between the polymer (2) and the primer (4), and/or polymer brushes (8) melting or softening and entangling with melted or softened polymer (2) so that the solid part (1) and the polymer (2) remain joined after cooling. The obtained strength of the bonding between the solid part (1) and the polymer (2) is significantly higher than if the same materials are joined with conventional methods not comprising the establishment of a primer layer (4).
ATTACHMENT METHOD USING ANODIC BONDING
The invention relates to an anodic bonding method for bonding two elements with an intermediate layer. The invention especially, but not exclusively, relates to an anodic bonding method for between a metallic element and a heterogeneous element, for example a glass, artificial sapphire or ceramic element. The specificity and aim of the present invention is to produce an assembly that is gas-tight and fluid-tight, solderless, brazing- or welder-free and without organic compound (glue). The present method has multiple industrial applications, including making it possible to attach a watch-glass, typically made of mineral glass, sapphire or transparent or translucent ceramics, to a bezel or case middle of a watch case using the anodic bonding technique.
Method and device for thermocompression bonding
There are provided a method and device for thermocompression bonding of possibly preventing any warping of a resin member to be caused by thermocompression bonding, and of possibly reducing the time to be taken for processing. The method for thermocompression bonding, includes: preheating a resin member using an infrared radiation section; and subjecting the resin member to thermocompression bonding using a heating section and a pressurization section.
PLASTICITY INDUCED BONDING
Methods and apparatuses for bonding polymeric parts are disclosed. Specifically, in one embodiment, the polymeric parts are bonded by plastically deforming them against each other while they are below the glass transition temperatures. A method includes: placing a first polymeric part in contact with a second polymeric part; and plastically deforming the first polymeric part and the second polymeric part against each other to bond the first polymeric part to the second polymeric part. Additionally, during the plastic deformation, a temperature of the first polymeric part is less than a glass transition temperature of the first polymeric part and a temperature of the second polymeric part is less than a glass transition temperature of the second polymeric part.
Polymer seaming using diffusion welds
The present invention is a method for seaming a polymeric material. The method involves forming an interface between a plurality of separate polymeric sheets of materials. Next, heat and pressure are applied to facilitate the diffusion of the polymer molecules at the interface. A diffusion weld is made when the polymer molecules diffuse across the interface.
Microfluidic structure
A microfluidic structure comprising a thermoplastic portion defining a microfluidic recess, a bonding layer on the thermoplastic portion and a siloxane elastomer portion covalently bonded to the bonding layer to seal the microfluidic recess. The microfluidic recess can therefore be formed simply, quickly and cheaply using known injection molding techniques, which are not hampered by the need for a curing step. However, the positive qualities associated with elastomers can be brought to the structure by using this to seal the microchannels. The bonding layer can be formed by silica deposited on the thermoplastic portion using techniques known in the field of optics.