To achieve universal welding of thermoplastic workpiece parts with simple equipment, an infrared light transmission welding method is disclosed in which simple polychromatic, incoherent infrared light is generated by a simple infrared light source and is directed through a first workpiece part to a weld point for the purposes of connection to a second workpiece part. In particular, the infrared light is directed through a transparent bracing element.

A light-absorbing layer and a bonding layer are layered on a first side of each of a belt-shaped male base portion integrated with a male portion and a female base portion integrated with a female portion on a side of the male and female base portions opposite the first side. The light-absorbing layer contains a light-absorbing material having a wavelength absorption range from 800 nm to 1200 nm to absorb a laser beam of the range. The bonding layer contains a low-melting-point resin in a form of a metallocene linear low-density polyethylene having a melting point ranging from 60 degrees C. to 120 degrees C. When the zipper tape is bonded to the base film, the laser beam is applied to heat the light-absorbing layer to melt the bonding layer. The melted bonding layer is pressure-bonded to the base film. The base film can be bonded without causing thermal degradation.

A light-absorbing layer and a bonding layer are layered on a first side of each of a belt-shaped male base portion integrated with a male portion and a female base portion integrated with a female portion on a side of the male and female base portions opposite the first side. The light-absorbing layer contains a light-absorbing material having a wavelength absorption range from 800 nm to 1200 nm to absorb a laser beam of the range. The bonding layer contains a low-melting-point resin in a form of a metallocene linear low-density polyethylene having a melting point ranging from 60 degrees C. to 120 degrees C. When the zipper tape is bonded to the base film, the laser beam is applied to heat the light-absorbing layer to melt the bonding layer. The melted bonding layer is pressure-bonded to the base film. The base film can be bonded without causing thermal degradation.

Described herein are various embodiments directed to rotor devices, methods, and systems. Embodiments of rotors disclosed herein may be used to characterize one or more analytes of a fluid. A method may include bonding a first layer and a second layer using two-shot injection molding. The first layer coupled to the second layer may collectively define a set of wells. The first layer may be substantially transparent. The second layer may define a channel. The second layer may be substantially absorbent to infrared radiation. A third layer may be bonded to the second layer using infrared radiation. The third layer may define an opening configured to receive a fluid. The third layer may be substantially transparent. The channel may establish a fluid communication path between the opening and the set of wells.

Systems and methods can involve wedge dissectors attached to strips in turn attached to medical balloons, for forming serrations within vascular wall tissue for angioplasty as well as drug delivery.

Systems and methods can involve wedge dissectors attached to strips in turn attached to medical balloons, for forming serrations within vascular wall tissue for angioplasty as well as drug delivery.

In an example, a method of sealing a bond cavity is described. The method comprises placing an adhesive around a perimeter of a first structure to be joined to a second structure. The method also comprises positioning the first structure relative to the second structure such that the adhesive is disposed between the first structure and the second structure. The method also comprises merging the first structure and the second structure until the first structure and the second structure are separated by a desired gap for bonding. The method also comprises heating the perimeter to at least partially cure the adhesive to form a leak-proof bond cavity perimeter between the first structure and the second structure.

An example method of joining a first structure and a second structure is described that includes forming a bond cavity between a first structure and a second structure, placing a semi-permeable breather material at one or more exits of the bond cavity, placing a vacuum bag around the bond cavity and the semi-permeable breather material, evacuating the bond cavity via a vacuum port and forcing adhesive into the bond cavity via an adhesive port while the bond cavity is evacuated, and curing the adhesive via one or more heaters to bond the first structure to the second structure.

The lid portion has a first body, a first rib protruding from the first surface of the first body and extending along the first surface, and the storage section has a second body, a second rib protruding from the second surface of the second body and extending along the second surface. The first and second ribs have main welded portions welded at intersections crossing each other, and the lid portion and/or the storage portion has main welded portions extending from one of the first and second ribs to the other between the main welded portions adjacent to each other. The lid portion and/or the storage section has an auxiliary rib extending from one of the first and second ribs to the other between the adjacent main welded portions, and the auxiliary rib has a sub-welded portion that is welded to the other at the intersection with the other.

Described herein are techniques for reducing resin squeeze-out including a method comprising receiving a first component and a second component, where the first component is configured to be joined to the second component at an overlap area using an adhesive layer to form a structure having a ledge. The method further comprises applying the adhesive layer to the overlap area on the first component. The method further comprises selectively curing a portion of the adhesive layer adjacent to the ledge. The method further comprises forming the structure by combining the first component, the second component, and the adhesive layer and curing a remainder of the adhesive layer.