According to one implementation, a composite material molding jig includes a rigid portion and a convex portion for forming a groove for inserting an optical fiber sensor. The rigid portion has a surface for laminating prepreg sheets. The convex portion is formed in a surface side of the rigid portion. Further, according to one implementation, a composite material molding method is a method for molding a composite material, on which the groove for inserting the optical fiber sensor has been formed, by heating and curing a laminated body of the prepreg sheets laminated on the above-mentioned composite material molding jig.

Provided is a method for manufacturing a stretchable elastic member excellent in appearance and reduced in manufacturing cost by applying a first adhesive to an inner surface of a sheet at one side at predetermined intervals, applying a second adhesive to elongated resilient and elastic members at predetermined intervals, forming first application regions in which the first adhesive is applied and first non-application regions between the first application regions and the adjacent first application regions, forming second application regions in which the second adhesive is applied over a large number of the first application regions and second non-application regions between the second application regions and the adjacent second application regions, fixedly installing, on an inner surface of the sheet at the one side, the elongated resilient and elastic members and a sheet at the other side at the outer side of the elongated resilient and elastic members, and cutting the elongated resilient and elastic members in sections in which the first non-application regions and the second application regions oppose each other when seen from the above.

Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecraft and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110 C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than 40 C.

System includes a first object having an energy-assisted bonding (EAB) mechanism along a surface of the first object. The EAB mechanism includes a heat-activatable adhesive layer and a carbon-filled (CF) sheet material. The CF sheet material is electrically conductive for resistive heating. A control sub-system is configured to control a coupling actuator to drive an actuator body toward the first object, wherein the actuator body and the first object engage each other. The coupling actuator is configured to apply pressure to the EAB mechanism along the surface of the first object. The control sub-system is also configured to control the power source to apply a current through the CF sheet material of the EAB mechanism to provide thermal energy through resistive heating that activates the adhesive layer along the interface.

Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecraft and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110 C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than 40 C.

Fluid flow conduits and apparatus and methods for joining the conduits, preferably in a sterile manner, are disclosed. Each conduit has a polymeric open end that is sealed by a sealing member that may include a heating element. The polymeric end material is melted, the sealing members are moved to expose the melted open ends of the conduits and the ends are brought together to form a fused or welded connection between the conduits.

A method of illuminating an item is disclosed. The method includes applying adhesive to the item, interspersing a taggant in the adhesive, illuminating the item with an excitation signal, sensing luminescence emitted by the taggant in response to illumination by the excitation signal, and determining the authenticity of the item based on the sensed emitted luminescence. The item can include any item benefited by authentication, and can include a postage stamp. A method of customizing an item is disclosed. This can include the steps of preparing a substrate, applying a security feature to the substrate, printing non-customized information on the substrate, receiving image information, and printing the image information on the substrate.

An intentionally activated frangible bonding system comprises a frangible adhesive, adhesive primer, composite material matrix, and/or the like, having a polydispersion of at least one additive spread throughout the frangible bonding material. The additive degrades a bond provided by the frangible bonding material, upon application of a specific energy to the frangible bonding material. An energy emitter is configured to selectively direct the specific energy toward a structure or assembly comprising components bonded by the frangible bonding material to degrade the frangible bonding material bonding the components for disassembly.

A device and method are provided for testing the effectiveness of an adhesive composition to adhere a sheet of material to a substrate. A connector is attached to the sheet and the adhesive is used to adhere the sheet to the substrate and permitted to cure to a selected amount. After (or even before, if desired) the adhesive cures, a load is applied to the connector, having the effect of pulling the sheet away from the substrate. The duration of the pulling and the amount of the load can be varied. If too large a dome is formed under the location of the connector, the adhesive does not pass the test. Optionally, the adhesive formulation is adjusted to make it stronger to resist such doming.

A cathode conductive strip can be attached to a semiconductor radiation sensor by using a double sided dual adhesive electrically conductive tape in a sensor assembly or a detector module to provide reliable electrical connection between the semiconductor radiation sensor and the cathode conductive strip. The double sided dual adhesive electrically conductive tape includes an electrically conductive backing with two different adhesion strength adhesives on both sides. The high adhesion strength side is bonded to the cathode electrode of the semiconductor radiation sensor. The lower adhesion strength side is bonded to the conductive face of the cathode conductive strip.