A method of manufacturing a core stiffened structure includes orienting the plurality of core wafers in a non-uniform pattern onto a first face sheet, the non-uniform pattern producing non-uniform spacing between adjacent core wafers; assembling a second face sheet onto the plurality of wafers; and curing an adhesive to create a bond between the plurality of wafers, the first face sheet, and the second face sheet.

A method for joining a thermoset plastic component and a thermoplastic component by bonding includes interconnecting the two components via a functional layer of the thermoset plastic component. The thermoplastic component is directly applied to the functional layer of the thermoset plastic component, such that a diffusion region is formed between the thermoplastic component and the functional layer of the thermoset plastic component.

A stand supports an electronic apparatus in an erect state. The stand includes: a supporting portion that has a supporting surface which supports a rear surface of the electronic apparatus; a leg portion that is rotatably connected to the supporting portion via a hinge; a flexible member that has flexibility, that is formed in a sheet shape, and that is provided along one edge of the supporting portion so as to protrude from the one edge; a surface material that has flexibility and forms front surfaces of the supporting portion and the flexible member; a first bonding layer that fixes the surface material onto the supporting portion; and a second bonding layer that is formed to have a lower coating density of a bonding adhesive than the first bonding layer and fixes the surface material onto the flexible member.

A method for producing a polymer film of high thickness on a substrate including the following steps: a) forming a first thermoplastic polymer film on a first substrate, b) forming a second thermoplastic polymer film on a second substrate including a support substrate covered by an anti-adherent layer, c) bonding the second thermoplastic polymer film to the first thermoplastic polymer film, by thermocompression, by applying a creep temperature higher than the glass transition temperature of the first thermoplastic polymer film and of the second thermoplastic polymer film, whereby a third thermoplastic polymer film is obtained, d) separating the first substrate from the second substrate, the third thermoplastic polymer film separating from the anti-adherent layer and remaining bonded to the first substrate.