This specification discloses an article of manufacture. The article of manufacture has at least one structural blank and at least one guide. The structural blank has a plurality of oriented fiber plies in a thermoplastic matrix. The guide has a plurality of random dispersed fibers in a thermoplastic matrix. The guide is affixed to the structural blank by injection molding and over molding the guide onto the structural blank. The article of manufacture can take a number of forms for use in industries such as aircraft, automobiles, motorcycles, bicycles, trains or watercraft.

A processing method for a workpiece includes a cutting step of cutting the workpiece along streets by a cutting blade having a V-shaped tip end, to form V grooves of which shallower parts are wider than deeper parts, and a cleaning step of cleaning a back surface of the workpiece with cleaning water, after the cutting step is carried out.

An insulating insert is positioned around a field joint of a pipeline to insulate the field joint. The insert comprises a longitudinal series of annular or part-annular filler segments of insulating material, curved about a longitudinal axis, that are each joined to one or more adjacent segments of the series by at least one link. The links may be webs, rods or articulated links. The links are flexible relative to the segments to facilitate bending of the insert along its length by enabling relative angular displacement between adjacent segments of the series.

A substrate usable with a double-side adhesive strip to suspend the substrate to a wall surface. The substrate can have one or more access holes located within an outer perimeter of the substrate. Each access hole has an inner perimeter inwardly of the outer perimeter that is sized and shaped to allow a tab of the double-sided adhesive strip to be extracted through the inner perimeter, after the substrate is suspended on the wall surface. Various articles can attach to the suspended substrate, such as through magnetic attachment, a hook, or a shelf.

A substrate usable with a double-side adhesive strip to suspend the substrate to a wall surface. The substrate can have one or more access holes located within an outer perimeter of the substrate. Each access hole has an inner perimeter inwardly of the outer perimeter that is sized and shaped to allow a tab of the double-sided adhesive strip to be extracted through the inner perimeter, after the substrate is suspended on the wall surface. Various articles can attach to the suspended substrate, such as through magnetic attachment, a hook, or a shelf.

Provided are an adhesive tape attaching device for cell and a manufacturing method for the adhesive tape attaching device for cell. The adhesive tape attaching device for cell includes a tooling plate, an adhesive tape clamping and pulling mechanism, an adhesive tape cutting mechanism, an adhesive tape attaching mechanism, and a driving mechanism. The tooling plate is for carrying a cell; the adhesive tape clamping and pulling mechanism is configured to clamp an adhesive tape and drive the adhesive tape to move in a horizontal direction approaching the cell; the adhesive tape cutting mechanism is disposed in a transportation direction of the adhesive tape, the adhesive tape cutting mechanism is located upstream of the tooling plate, and the adhesive tape cutting mechanism is configured to cut the adhesive tape into adhesive tape segments; the adhesive tape attaching mechanism is configured to attach the adhesive tape segment onto a to-be-attached region.

A handrail has a thermoplastic body having a generally C-shaped cross section, a stretch inhibitor in the thermoplastic body above a T-shaped slot and a slider fabric layer. The handrail includes first and second end portions, each comprising a forward part extending from an end surface of the end portion and a rear part adjacent the forward part. A method of forming a joint can include: providing cuts to separate a top section of the thermoplastic body from a base section including shoulder portions; for each end portion, removing at least shoulder portions from the forward part thereof, to leave a central portion including a forward part at the slider fabric layer and a layer of thermoplastic; cutting the forward parts to a required shape; and assembling the first and second end portions together to form a spliced joint for moulding.

A technique for handling an integrated circuit tape assembly having a plurality of integrated circuits supported by underlying dicing tape involves placing the integrated circuit tape assembly on a film frame carrier (FFC) frame, stretching the dicing tape while on the FFC frame, and securing the stretched dicing tape by engaging a spring ring with the dicing tape and FFC frame. Adjacent integrated circuits are thereby inhibited from colliding during shipment or storage for subsequent processing.

A processing apparatus includes a wafer cassette table, a wafer carrying-out mechanism, a wafer table, a frame housing unit, a frame carrying-out mechanism, a frame table, a tape sticking unit, a tape-attached frame conveying mechanism, a tape pressure bonding unit, a frame unit carrying-out mechanism, a reinforcing part removing unit, a ring-free unit carrying-out mechanism, and a frame cassette table. The wafer carrying-out mechanism includes a Bernoulli chuck mechanism that jets gas to the back surface of the wafer and generates a negative pressure. The gas jetted by the Bernoulli chuck mechanism is inert gas. The wafer carrying-out mechanism jets the inert gas from the Bernoulli chuck mechanism to suppress oxidation of the back surface of the wafer when the wafer is carried out.

A wafer is positioned in an opening of a first frame. The wafer is pressure-bonded at one surface thereof to a first tape together with the first frame, onto a second tape pressure-bonded to a second frame. The wafer is processed by pressure-bonding the second tape, which is pressure-bonded to the second frame having an outer diameter smaller than an inner diameter of the opening of the first frame, to another surface of the wafer, cutting the first tape along an outer periphery of the second frame, imparting an external stimulus to the first tape to lower a pressure-bonding force with which the first tape is pressure-bonded to the one surface of the wafer, and peeling off the first tape from the one surface of the wafer pressure-bonded to the second tape.