B29C65/50

METHOD OF BUTT SEAMING ARTIFICIAL TURF AND RECYCLABLE BUTT SEAMED ARTIFICIAL TURF
20210094241 · 2021-04-01 ·

The invention comprises a method of butt seaming artificial turf. The method comprises providing a piece of artificial turf comprising a primary backing material having an upper surface and a lower surface, a plurality of tufts of filament material formed in the primary backing material, wherein the tufts are arranged to simulate blades of grass extending outwardly from the upper surface of the primary backing material and the tufts have tuft backs formed on the lower surface of the primary backing material and a layer of a thermoplastic polymer formed on the lower surface of the primary backing material and the tuft backs such that the layer of thermoplastic polymer attaches the tuft backs to the primary backing material. The method further comprises heating a portion of the layer of thermoplastic polymer adjacent an edge of the artificial turf until the portion of the layer of thermoplastic polymer softens and pressing the softened portion of the layer of thermoplastic polymer into contact with a seaming tape.

TECHNIQUE FOR HANDLING DICED WAFERS OF INTEGRATED CIRCUITS

A technique for handling an integrated circuit/tape assembly having a plurality of integrated circuits supported by underlying dicing tape involves placing the integrated circuit/tape assembly on a bottom file frame carrier (FFC) frame having structure (e.g., an inner rim or flexible pegs), placing a top FFC frame having a central opening over the integrated circuit/tape assembly, and mating the top and bottom FFC frames such that the dicing tape is pulled over the structure thereby laterally stretching the dicing tape, which breaks wafer saw bows holding the integrated circuits together. The lateral stretching of the dicing tape increases distance between adjacent integrated circuits in at least two mutually orthogonal lateral directions, thereby inhibiting the adjacent integrated circuits from colliding during shipment or storage for subsequent processing. The resulting assembly can be thinner than conventional FFC configurations, which results in more efficient shipment and storage.

TECHNIQUE FOR HANDLING DICED WAFERS OF INTEGRATED CIRCUITS

A technique for handling an integrated circuit tape assembly having a plurality of integrated circuits supported by underlying dicing tape involves placing the integrated circuit tape assembly on a film frame carrier (FFC) frame, stretching the dicing tape while on the FFC frame, and securing the stretched dicing tape by engaging a spring ring with the dicing tape and FFC frame. Adjacent integrated circuits are thereby inhibited from colliding during shipment or storage for subsequent processing.

WELDED FILM AND METHOD OF PRODUCING SAME
20230405942 · 2023-12-21 · ·

A welded film including, at least a first thermoplastic resin film, a second thermoplastic resin film, and a thermoplastic resin film for connection disposed so as to span between the first thermoplastic resin film and the second thermoplastic resin film, wherein the first thermoplastic resin film and the thermoplastic resin film for connection are welded at a first welded portion, and the second thermoplastic resin film and the thermoplastic resin film for connection are welded at a second welded portion, and the welded portions are separated by 2.0 mm or more, or each of the welded portions is separated from an end portion of the corresponding thermoplastic resin film among the two thermoplastic resin films; and a method of producing the welded film.

Method of joining two objects

A method for joining two objects by anchoring an insert portion provided on one of the objects in an opening provided on the other one of the objects. The anchorage is achieved by liquefaction of a thermoplastic material and interpenetration of the liquefied material and a penetrable material, the two materials being arranged on opposite surfaces of the insert portion and the wall of the opening. Before such liquefaction and interpenetration, an interference fit is established in which such opposite surfaces are pressed against each other, and, for the anchoring, mechanical vibration energy and possibly a shearing force are applied, wherein the shearing force puts a shear stress on the interference fit.

Welding head

A welding head comprises a welding element (51) for welding a lid (1) to an opening device of a container (10). The welding head (43) further comprises a 5 compensating device (62) operable for compensating a misalignment between the welding element (51) and the lid (1), thereby centering the welding element (51) relative to the lid (1).

Wind turbine blade with anchoring sites
10954916 · 2021-03-23 · ·

The invention relates to a wind turbine blade having integrated thermoplastic anchoring sites for attachment of surface mounted devices, a method for producing such blade and a wind turbine equipped with such blade.

Method of repairing a composite material

A method of repairing damage to a composite material having a composite substrate and at least one layer of shielding material includes: a) removing damage to the at least one layer of shielding material by creating a hole in the at least one layer of shielding material; b) applying a patch of shielding material in the region of the hole via a resin, wherein a ratio of a resin weight to a weight of the patch of shielding material lies in a range between about 0.45-0.55; and c) curing the resin, wherein an absorptive, consumable material is positioned in contact with the resin during at least a portion of the curing.

Three dimensional fabrics with liner strips and assembly methods therefor
10960636 · 2021-03-30 ·

3D fabrics have multiple layers including an outer dimensional layer of traditional fabric and a liner layer integrated with outer layer. The 3D fabrics have variable depth, typically ranging from between about 0.25 inches to about 2.0 inches. The 3D fabrics are produced from a molding process that creates the outer dimensional layer while adhering it to the liner layer. The 3D fabrics have unique visual properties which make them desirable for a variety of applications.

Three dimensional fabrics with liner strips and assembly methods therefor
10960636 · 2021-03-30 ·

3D fabrics have multiple layers including an outer dimensional layer of traditional fabric and a liner layer integrated with outer layer. The 3D fabrics have variable depth, typically ranging from between about 0.25 inches to about 2.0 inches. The 3D fabrics are produced from a molding process that creates the outer dimensional layer while adhering it to the liner layer. The 3D fabrics have unique visual properties which make them desirable for a variety of applications.