A wafer is positioned in an opening of a first frame. The wafer is pressure-bonded at one surface thereof to a first tape together with the first frame, onto a second tape pressure-bonded to a second frame. The wafer is processed by pressure-bonding the second tape, which is pressure-bonded to the second frame having an outer diameter smaller than an inner diameter of the opening of the first frame, to another surface of the wafer, cutting the first tape along an outer periphery of the second frame, imparting an external stimulus to the first tape to lower a pressure-bonding force with which the first tape is pressure-bonded to the one surface of the wafer, and peeling off the first tape from the one surface of the wafer pressure-bonded to the second tape.

A microwave heating device includes a variable frequency microwave power supply, a waveguide launcher, and a fixture to contain a material to be heated, with the fixture located directly adjacent to the end of the launcher. All heating occurs in the near-field region, i.e., no cavity modes or standing waves are established within the fixture. This condition may be insured by keeping the thickness of the fixture or workpiece under one wavelength (at all microwave frequencies being used). The launcher is preferably a horn configured to spread the microwave power laterally over a selected area while maintaining a single propagating mode. The invention may be used to enhance catalytic reactions for research and other purposes. Alternatively, the invention may be configured to perform spot curing or repair operations involving adhesives and composites.

A technique for handling an integrated circuit/tape assembly having a plurality of integrated circuits supported by underlying dicing tape involves placing the integrated circuit/tape assembly on a bottom file frame carrier (FFC) frame having structure (e.g., an inner rim or flexible pegs), placing a top FFC frame having a central opening over the integrated circuit/tape assembly, and mating the top and bottom FFC frames such that the dicing tape is pulled over the structure thereby laterally stretching the dicing tape, which breaks wafer saw bows holding the integrated circuits together. The lateral stretching of the dicing tape increases distance between adjacent integrated circuits in at least two mutually orthogonal lateral directions, thereby inhibiting the adjacent integrated circuits from colliding during shipment or storage for subsequent processing. The resulting assembly can be thinner than conventional FFC configurations, which results in more efficient shipment and storage.

A threadlike adhesive sticking apparatus of the present invention is a threadlike adhesive sticking apparatus configured to press a threadlike adhesive wound in a roll shape together with a release liner against an object while feeding out the threadlike adhesive, and includes a pressing unit configured to press the threadlike adhesive debonded from the release liner against the object. A compression elastic modulus of the release liner is 1.5 MPa or less.

A method of assembly of a carbon fiber space frame structure eliminates the need for gusset plates at the j oints of the space frame structure. The elimination of the gusset plates at the j oints of the space frame structure reduces the weight of the space frame structure and eliminates stresses that occur at the j oints due to gusset plates attached at the j oints.

A method for forming a solar panel can include attaching one or more tacking pads to one or both of a first surface of a first solar panel subassembly and a second surface of a second solar panel subassembly. The method further includes dispensing an adhesive onto at least one of the first and second surfaces. The first and second surfaces are placed in contact with the one or more tacking pads, thereby tacking the first and second solar panel subassemblies together, during which the first and second surfaces contact the adhesive, thereby decreasing a thickness and increasing a surface area of the adhesive. Subsequently, the adhesive is cured. The tacking pad(s) maintain fixed alignment of the solar panel subassemblies during curing of the adhesive, and establish a bond line of the adhesive.

The present invention relates to false eyelashes (1), comprising: a plurality of discrete eyelash fibers (10); and a baseline (20) extending across the plurality of eyelash fibers (10) and linking the plurality of eyelash fibers (10) in parallel or substantially parallel with one another. The baseline (20) is formed of a solidified raw resin (20′). The solidified raw resin (20′) forming the baseline (20) at least partially covers the proximal ends of the plurality of eyelash fibers (10), thereby linking the plurality of eyelash fibers (10) with one another. The present invention also relates to a method for manufacturing such false eyelashes (1) by sandwiching the plurality of eyelash fibers (10) between lower and upper molds (100, 200) and filling a raw resin (20′) of the baseline (20) in a molten state into a narrow passage (300) defined between the lower and upper molds (100, 200).

The present invention relates to false eyelashes (1), comprising: a plurality of discrete eyelash fibers (10); and a baseline (20) extending across the plurality of eyelash fibers (10) and linking the plurality of eyelash fibers (10) in parallel or substantially parallel with one another. The baseline (20) is formed of a solidified raw resin (20′). The solidified raw resin (20′) forming the baseline (20) at least partially covers the proximal ends of the plurality of eyelash fibers (10), thereby linking the plurality of eyelash fibers (10) with one another. The present invention also relates to a method for manufacturing such false eyelashes (1) by sandwiching the plurality of eyelash fibers (10) between lower and upper molds (100, 200) and filling a raw resin (20′) of the baseline (20) in a molten state into a narrow passage (300) defined between the lower and upper molds (100, 200).

A machine to apply tape to a surface includes a handle for manipulation by a user connected to a wheeled applicator allowing the tape to be dispensed from the applicator and rolled onto a surface. The applicator includes two sidewalls adjustable relative to each other on guide bars to define space therebetween where rolls of tape having different widths can be accommodated. The sidewalls further include bottom portions shaped complimentarily with the wheel to define a path sized for a width of the tape around the wheel, and where the sidewalls further define a path sized for the width of the tape over at least one guide bar. The applicator also may include a clutched take-up reel operatively connected to the wheel, where rotation of the wheel causes the take-up reel to rotate and collect a liner.

A machine to apply tape to a surface includes a handle for manipulation by a user connected to a wheeled applicator allowing the tape to be dispensed from the applicator and rolled onto a surface. The applicator includes two sidewalls adjustable relative to each other on guide bars to define space therebetween where rolls of tape having different widths can be accommodated. The sidewalls further include bottom portions shaped complimentarily with the wheel to define a path sized for a width of the tape around the wheel, and where the sidewalls further define a path sized for the width of the tape over at least one guide bar. The applicator also may include a clutched take-up reel operatively connected to the wheel, where rotation of the wheel causes the take-up reel to rotate and collect a liner.