Patent classifications
B29C65/565
Surgical cap and method
In accordance with one aspect of the present disclosure, a surgical cap is provided that includes a cover having a head-receiving cavity and a resilient member connected to the cover and extending about less than the entire head-receiving cavity. The cover includes a plurality of layers comprising at least one layer inward from the resilient member adapted to separate the resilient member from a head received in the head-receiving cavity and at least two outer layers outward from the resilient member to which the resilient member is secured. In accordance with another aspect, a method of fabricating a surgical cap is provided.
Shear web assembly interconnected with additive manufactured components
A method for assembling a shear web assembly of a wind turbine includes providing at least one spar cap. The method also includes forming a spar connecting member of a thermoplastic material via additive manufacturing. Further, the method includes securing the spar connecting member to the spar cap. Moreover, the method includes providing a shear web, forming a web connecting member of a thermoplastic material via additive manufacturing, and securing the web connecting member at a first end of the shear web. In addition, the method includes interconnecting the web connecting member and the spar connecting member at a joint. Thus, the method further includes heating the joint to secure the web connecting member and the spar connecting member together.
METHOD OF JOINING TWO OBJECTS
A method for joining two objects by anchoring an insert portion provided on one of the objects in an opening provided on the other one of the objects. The anchorage is achieved by liquefaction of a thermoplastic material and interpenetration of the liquefied material and a penetrable material, the two materials being arranged on opposite surfaces of the insert portion and the wall of the opening. Before such liquefaction and interpenetration, an interference fit is established in which such opposite surfaces are pressed against each other, and, for the anchoring, mechanical vibration energy and possibly a shearing force are applied, wherein the shearing force puts a shear stress on the interference fit.
Heat stakes
Apparatus configured to enable the staking of an interfacing part to a base is provided. The apparatus includes a retainer configured to convey a stake and the interfacing part to the base. The apparatus is further configured to provide a heat and/or vibration to effect the simultaneous attachment of the stake to the base and the interfacing part to the base.
Process for creating a polymer filament suitable for use in three-dimensional printing
A thermoplastic filament comprising multiple polymers of differing flow temperatures in a regular geometric arrangement, and a method for producing such a filament, are described. Because of the difference in flow temperatures, there exists a temperature range at which one polymer is mechanically stable while the other is flowable. This property is extremely useful for creating thermoplastic monofilament feedstock for three-dimensionally printed parts, wherein the mechanically stable polymer enables geometric stability while the flowable polymer can fill gaps and provide strong bonding and homogenization between deposited material lines and layers. These multimaterial filaments can be produced via thermal drawing from a thermoplastic preform, which itself can be three-dimensionally printed. Furthermore, the preform can be printed with precisely controlled and complex geometries, enabling the creation of monofilament and fiber with unique decorative or functional properties.
Method for connecting two components, and component arrangement
A method for the connection of a first component to a second component includes providing a first component which has a projection with an undercut, and providing a second component which has a cavity. The method also includes introducing a sealing and/or connecting material into the cavity of the second component, and joining the first component and the second component together to form a component arrangement. The projection of the first component projects, in the joined state, into the cavity of the second component.
Process for creating a filament
A thermoplastic filament comprising multiple polymers of differing flow temperatures in a geometric arrangement and an interior channel containing a structural or functional thread therein is described. A method for producing such a filament is also described. Because of the difference in flow temperatures, there exists a temperature range at which one polymer is mechanically stable while the other is flowable. This property is extremely useful for creating thermoplastic monofilament feedstock for three-dimensionally printed parts, wherein the mechanically stable polymer enables geometric stability while the flowable polymer can fill gaps and provide strong bonding and homogenization between deposited material lines and layers. These multimaterial filaments can be produced via thermal drawing from a thermoplastic preform, which itself can be three-dimensionally printed. Furthermore, the preform can be printed with precisely controlled and complex geometries, enabling the creation of a filament or fiber with an interior thread contained within the outer, printed filament or fiber. This thread adds structural reinforcement or functional properties, such as electrical conductivity or optical waveguiding, to the filament.
MODULAR QUARTER PANEL FASCIA BRACKET
An apparatus and method, according to an exemplary aspect of the present disclosure includes, among other things, a quarter panel comprised of a sheet molding compound and a fascia bracket. The fascia bracket includes a first flange integrated into the quarter panel, a second flange comprising a vehicle body mount interface, and a gripping feature configured to grip a portion of a fascia to be attached to the quarter panel.
TECHNIQUE FOR HANDLING DICED WAFERS OF INTEGRATED CIRCUITS
A technique for handling an integrated circuit/tape assembly having a plurality of integrated circuits supported by underlying dicing tape involves placing the integrated circuit/tape assembly on a bottom file frame carrier (FFC) frame having structure (e.g., an inner rim or flexible pegs), placing a top FFC frame having a central opening over the integrated circuit/tape assembly, and mating the top and bottom FFC frames such that the dicing tape is pulled over the structure thereby laterally stretching the dicing tape, which breaks wafer saw bows holding the integrated circuits together. The lateral stretching of the dicing tape increases distance between adjacent integrated circuits in at least two mutually orthogonal lateral directions, thereby inhibiting the adjacent integrated circuits from colliding during shipment or storage for subsequent processing. The resulting assembly can be thinner than conventional FFC configurations, which results in more efficient shipment and storage.
TECHNIQUE FOR HANDLING DICED WAFERS OF INTEGRATED CIRCUITS
A technique for handling an integrated circuit tape assembly having a plurality of integrated circuits supported by underlying dicing tape involves placing the integrated circuit tape assembly on a film frame carrier (FFC) frame, stretching the dicing tape while on the FFC frame, and securing the stretched dicing tape by engaging a spring ring with the dicing tape and FFC frame. Adjacent integrated circuits are thereby inhibited from colliding during shipment or storage for subsequent processing.