A wafer bonding apparatus includes a first bonding chuck to fix a first wafer on a first surface thereof, a second bonding chuck to fix a second wafer on a second surface thereof facing the first surface, a bonding initiation member at a center of the first bonding chuck to push the first wafer towards the second surface, and a membrane member including a protrusion protruding from a center portion of the second surface towards the first surface, and a planar portion defining the protrusion on an outer region surrounding the center portion.

Described herein are techniques for reducing resin squeeze-out including a method comprising receiving a first component and a second component, where the first component is configured to be joined to the second component at an overlap area using an adhesive layer to form a structure having a ledge. The method further comprises applying the adhesive layer to the overlap area on the first component. The method further comprises selectively curing a portion of the adhesive layer adjacent to the ledge. The method further comprises forming the structure by combining the first component, the second component, and the adhesive layer and curing a remainder of the adhesive layer.

Techniques and mechanisms for bonding a first wafer to a second wafer in the presence of a fluid, the viscosity of which is greater than a viscosity of air at standard ambient temperature and pressure. In an embodiment, a first surface of the first wafer is brought into close proximity to a second surface of the second wafer. The fluid is provided between the first surface and the second surface when a first region of the first surface is made to contact a second region of the second surface to form a bond. The viscosity of the fluid mitigates a rate of propagation of the bond along a wafer surface, which in turn mitigates wafer deformation and/or stress between wafers. In another embodiment, the viscosity of the fluid is changed dynamically while the bond propagates between the first surface and the second surface.

Disclosed is a tire building apparatus and a method for joining or cutting tire components. The tire building apparatus includes a rocking member that is movable in a rocking plane in a rocking motion along a rocking line, a translation guide extending parallel to the rocking line and a carriage that is displaceable along the translation guide, wherein the rocking member has a convex edge that defines a minor arc of a circle and extends up to a rotation center, wherein the rocking member is supported by the carriage at the rotation center and is angularly displaceable with respect to the carriage about a rotation axis extending through the rotation center.

Examples herein relate generally to methods, and associated components, characterized by the laser welding of crosslinked polyethylene plumbing components so as to create a leak-proof connection with both mechanical and thermal fusion bonds.

A stabilizer bushing installed on a stabilizer bar is made of two divided parts of rubber or the like to prevent or decrease generation of a gap in a bonding surface. The stabilizer bushing installed on an outer periphery of the stabilizer bar by adhesion includes divided rubber bushings of an upper rubber bushing and a lower rubber bushing. Before adhesion, both end portions of the upper and lower rubber bushings, respectively, in a circumferential direction are tapered so that an overlapping amount between the upper and lower rubber bushings increases toward the outer periphery side of the bushings. After adhesion, a bonding surface is bonded by pressure.

Disclosed is a tire building apparatus and a method for joining or cutting tire components. The tire building apparatus includes a rocking member that is movable in a rocking plane in a rocking motion along a rocking line, a translation guide extending parallel to the rocking line and a carriage that is displaceable along the translation guide, wherein the rocking member has a convex edge that defines a minor arc of a circle and extends up to a rotation center, wherein the rocking member is supported by the carriage at the rotation center and is angularly displaceable with respect to the carriage about a rotation axis extending through the rotation center.

A method for quickly applying and spreading adhesive between substrates without leaving air bubbles. The method includes holding two substrates apart from each other with adhesive sides facing, a second substrate being positioned above a first substrate. The second substrate is suspended in a manner so as to cause a portion to warp towards the first substrate. After a liquid filler is applied between the two substrates, rollers are lowered onto the second substrate and moved so as to disperse the liquid filler between the first and second substrates. In accordance with the rolling of the rollers, end portions of the second substrate are lowered towards the first substrate.

Disclosed are UV curable adhesive compositions and methods to adhere polycarbonate substrates containing UV absorbers to glass for use in ophthalmic lenses.

A device for joining a first component to be welded to a second component to be welded, the joining device having at least one electrically conductive, resistive heating film which comprises a central connection portion and two lateral electrical connection portions. The joining device comprises at least one first electrical insulation member which is positioned in contact with the first face of the heating film, and at least one second electrical insulation member which is positioned in contact with the second face of the heating film, the two electrical insulation members being configured to allow the transfer of heat and to prevent the flow of electric current between the heating film and each component to be welded.