B29C70/0035

Fiber composite laminate and method for producing a fiber composite laminate

A fiber composite laminate having one or more fiber layers, comprising a first laminate region and a second laminate region. In the first laminate region, the fiber layers of the fiber composite laminate are impregnated with a thermoplastic elastomer material. In the second laminate region, fiber layers of a first lamina of the fiber composite laminate are impregnated with the thermoplastic elastomer matrix, and fiber layers of at least one second lamina of the fiber composite laminate that is positioned on top of the first lamina are impregnated with a thermosetting polymer matrix.

Composites
10618262 · 2020-04-14 ·

A method of fabricating a composite material, the method comprises the steps of a) providing a first layer of a fibre reinforced polymer, preferably a thermoset FRP, b) providing an array of thermoplastic islands across at least a proportion of a major surface of the first layer, c) providing a second layer of a fibre reinforced polymer, preferably a thermoset FRP, d) laying the second layer over at least some of the islands, and e) securing the first and second layers together. There is also disclosed a composite which comprises a first layer of a fibre reinforced polymer and a second layer of a fibre reinforced polymer, between which is an intervening layer comprising an array of thermoplastic islands.

Prepreg, laminate, and molding

The present invention aims at providing a prepreg for producing a laminate suitable as a structural material, and a laminate, which have excellent tensile shear joining strength, fatigue joining strength, and interlaminar fractural toughness values, and can be firmly integrated with another structural member by welding. The present invention is a prepreg including the following structural components [A], [B], and [C], wherein [C] is present on a surface of the prepreg, [C] is a crystalline thermoplastic resin having a glass transition temperature of 100 C. or higher or an amorphous thermoplastic resin having a glass transition temperature of 180 C. or higher, and the reinforcing fibers [A] are present which are included in a resin area including [B] and a resin area including [C] across an interface between the two resin areas: [A] reinforcing fibers; [B] a thermosetting resin; and [C] a thermoplastic resin.

Off-set resin formulations and blocking/deblocking resin systems for use as a “co-cure-ply” in the fabrication of large-scale composite structure

A method for bonding composite substrates includes coupling a first co-cure prepreg layer having a first off-set amine to epoxide molar ratio onto a surface of a first composite substrate and coupling a second co-cure prepreg layer having a second off-set amine to epoxide molar ratio onto a surface of a second composite substrate. The first and second composite substrates are cured to the first and second co-cure prepreg layers, respectively, using a first cure cycle (including B-stage and cure temperatures) to form a first and a second co-cure prepreg layer portion. The method further includes coupling the first co-cure prepreg layer portion to the second co-cure prepreg layer portion and applying a second cure cycle to cure the first co-cure prepreg layer portion of the first composite substrate to the second co-cure prepreg layer portion of the second composite substrate to form a monolithic covalently bonded composite structure.

Molded article and method for making the same

A composite article includes a first segment and a second segment spaced apart form the first segment. The composite article includes continuous fibers that extend from the first segment to the second segment. The composite article also includes discontinuous fiber distributed throughout the composite article.

FIBER-REINFORCED COMPOSITE MATERIAL MOLDED ARTICLE AND METHOD FOR PRODUCING SAME

Provided is a fiber-reinforced composite material molded article including a thick portion having a thickness equal to or greater than 10 mm, in which the thick portion has an inner layer which is formed of a cured material of a composite material (A) containing reinforcing fiber and an epoxy resin and a surface layer which is formed of a cured material of a composite material (B) containing reinforcing fiber and a vinyl ester resin.

PRINTHEAD MODULE FOR ADDITIVE MANUFACTURING SYSTEM
20190351667 · 2019-11-21 ·

A module for an additive manufacturing system includes a frame, a dispenser configured to deliver a layer of particles over a platen, an energy source to generate a beam to fuse the particles, and a metrology system having a first sensor to measure a property of the surface of layer before being fused and a second sensor to measure a property of the layer after being fused. The dispenser, first sensor, energy source and second sensor are positioned on the frame in order along a first axis, and the dispenser, first sensor, energy source and second sensor are fixed to the frame such that the frame, dispenser, first sensor, energy source and second sensor can be mounted and dismounted as a single unit from a movable support.

HEAT-DISSIPATING FILM, AND ITS PRODUCTION METHOD AND APPARATUS
20190338176 · 2019-11-07 ·

The present invention relates to a heat-dissipating film. The heat-dissipating film comprises a heat-conductive layer comprising fine graphene particles and carbon nanotube uniformly dispersed, a mass ratio of the carbon nanotube to the total of the fine graphene particles, wherein the carbon nanotube is 0.05-0.2, and the fine graphene particles are substantially aligned with the heat-conductive layer, and the heat-conductive layer has a density of 1.9 g/cm.sup.3 or more and thermal conductivity of 600 W/mK or more.

SEALED CIRCUIT CARD ASSEMBLY

A method of manufacturing a sealed circuit card assembly includes disposing a circuit card assembly within a volume defined by a housing and at least partially filling the volume with a curable liquid such that the curable liquid encapsulates at least a circuit card. The method may also include curing the curable liquid to form a potted circuit card assembly and, after at least partially filling the volume with the curable liquid and after curing the curable liquid, vacuum impregnating the potted circuit card assembly with a sealant to seal any exposed interfaces or cracks to form the sealed circuit card assembly. Accordingly, the sealed circuit card assembly may include a first cured material encapsulating the circuit card of the circuit card assembly and a second cured material disposed within, for example, a porosity of the first cured material.

MOLDED ARTICLE AND METHOD FOR MAKING THE SAME
20240140049 · 2024-05-02 ·

A composite article includes a first segment and a second segment spaced apart form the first segment. The composite article includes continuous fibers that extend from the first segment to the second segment. The composite article also includes discontinuous fiber distributed throughout the composite article.