A molded semiconductor package includes a semiconductor die embedded in a mold compound, and a plurality of metal leads embedded in the mold compound and electrically connected to the semiconductor die. A first plurality of features is formed in an exterior surface of the mold compound. The first plurality of features disrupts a planarity of the exterior surface of the mold compound and is arranged along a direction which is transverse to a lengthwise extension of the plurality of metal leads. Corresponding methods of manufacturing such a molded semiconductor package are also described.

Systems and methods are provided for a caul plate having a feature for removal. One embodiment is a caul plate for forming a composite part. The caul plate includes a body that includes a lower surface which faces the composite part, and an upper surface that is opposite to the lower surface. The caul plate also includes a groove in the upper surface to accept a tool to slide the caul plate laterally from the composite part.

Wood-type golf clubs and/or golf club heads include: (a) a golf club head base member including a face member having a ball striking face; and (b) a polymeric body member engaged with the golf club head base member, wherein the polymeric body member is formed via a rotational molding process (or other centrifugal force inducing molding process) and/or engaged with the golf club head base member via a rotational molding process (or other centrifugal force inducing molding process). The polymeric body member forms at least a portion of a crown member of the club head in some structures.

A fiber-reinforced plastic chassis may include a steering element, where the steering element comprises at least one reinforcement structure formed with continuous fibers, where the steering element comprises at least one stiffening structure formed with short and/or long fibers, where the at least one reinforcement structure is formed integrally with the at least one stiffening structure via a thermosetting matrix material, and where the steering element comprises a plurality of bearing receivers integrated in at least one of the at least one reinforcement structure and the at least one stiffening structure for receiving bearing elements.

A fiber-containing resin substrate includes a thermosetting epoxy resin-impregnated fiber base material, and an uncured resin layer formed on one side thereof formed from a composition containing: (A) a crystalline bisphenol A type epoxy resin and/or a crystalline bisphenol F type epoxy resin, (B) an epoxy resin that is non-fluid at 25 C. other than the component (A), (C) a phenol compound having two or more phenolic hydroxy groups in one molecule, (D) an inorganic filler, and (E) an urea-based curing accelerator. The fiber-containing resin substrate collectively encapsulates a semiconductor devices mounting surface or a semiconductor devices forming surface on a wafer level, even when a large-diameter wafer or a large-diameter substrate is encapsulated, to reduce warpage of the substrate or the wafer and peeling of a semiconductor device from the substrate, and to have the uncured resin layer excellent in storage stability and handleability before curing.

A method for producing a component made of fiber-reinforced plastic includes comprises the steps of providing at least one insert part, placing the insert part in a mold and embedding the insert part using a matrix material and at least one fiber mat in the mold. The insert part is provided as a closed capsule.

A partially molded substrate and a partial molding apparatus and a method thereof, which cover and mold each of one or more conductors formed on the substrate with the insulator to prevent the sizes of the substrate from being increased due to molding, thereby efficiently preventing high voltage between the conductors on the substrate from being applied, and thereby preventing interference around the conductor.

Wood-type golf clubs and/or golf club heads include: (a) a golf club head base member including a face member having a ball striking face; and (b) a polymeric body member engaged with the golf club head base member, wherein the polymeric body member is formed via a rotational molding process (or other centrifugal force inducing molding process) and/or engaged with the golf club head base member via a rotational molding process (or other centrifugal force inducing molding process). The polymeric body member forms at least a portion of a crown member of the club head in some structures.

Wood-type golf clubs and/or golf club heads include: (a) a golf club head base member including a face member having a ball striking face; and (b) a polymeric body member engaged with the golf club head base member, wherein the polymeric body member is formed via a rotational molding process (or other centrifugal force inducing molding process) and/or engaged with the golf club head base member via a rotational molding process (or other centrifugal force inducing molding process). The polymeric body member forms at least a portion of a crown member of the club head in some structures.

The present invention provides systems and methods for embedding a filament or filament mesh in a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device by providing at least a first layer of a substrate material, and embedding at least a portion of a filament or filament mesh within the first layer of the substrate material such the portion of the filament or filament mesh is substantially flush with a top surface of the first layer and a substrate material in a flowable state is displaced by the portion of the filament and does not substantially protrude above the top surface of the first layer, allowing the continuation of an additive manufacturing process above the embedded filament or filament mesh. A method is provided for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device.