The present invention relates to a 3D printer outputting method for mounting electrical components, the method comprising a step of generating a structure forming unit structures and a step of positioning component objects on the structure. The positions of the component objects can be changed by using a coordinate system. In mounting a component object (20) on a structure (10), a coordinate system (140) is used to check for colliding or overlapping portions of the component object and to determine whether the component object (20) is supported by unit structures (15), and the merits of 3D are used to rearrange the colliding or overlapping portions or portions, that are not supported, into other dimensions. In addition, in order to automatically insert an actual component object (20), the component object is picked up by a well-known pickup device (30), and the time point and position at which a second component object (20′) is to be inserted in the first component object (20) are predetermined.

Provided is an encapsulation method not causing molding failures such as filling failures and flow marks when collectively encapsulating a large-area silicon wafer or substrate with a resin composition. Specifically, provided is a method for encapsulating a semiconductor element-mounted base material, using a curable epoxy resin composition containing: an epoxy resin (A), a curing agent (B), a pre-gelatinizing agent (C) and a filler (D). The semiconductor element-mounted base material is collectively encapsulated under conditions of (a) molding method: compression molding, (b) molding temperature: 100 to 175° C., (c) molding period: 2 to 20 min and (d) molding pressure: 50 to 350 kN.

Provided is an encapsulation method not causing molding failures such as filling failures and flow marks when collectively encapsulating a large-area silicon wafer or substrate with a resin composition. Specifically, provided is a method for encapsulating a semiconductor element-mounted base material, using a curable epoxy resin composition containing: an epoxy resin (A), a curing agent (B), a pre-gelatinizing agent (C) and a filler (D). The semiconductor element-mounted base material is collectively encapsulated under conditions of (a) molding method: compression molding, (b) molding temperature: 100 to 175° C., (c) molding period: 2 to 20 min and (d) molding pressure: 50 to 350 kN.

A composite material with an insert-molded attachment steel is provided. The composite material includes a plurality of burring apertures, each of which has a flange in one direction on the attachment steel and is inserted between fibers. A resin is then introduced between the fibers in each burring aperture and external to the flange.

A lightweight vehicle pan assembly and for attachment to a vehicle frame via welding includes at least one metal flange and a molded pan body. The at least one metal flange has a weld portion adapted for welded attachment to the vehicle frame and an interface portion extending from the weld portion. The molded pan body has a base wall and at least one side wall extending upward from the base wall. The interface portion of the at least one metal flange is embedded in the at least one side wall of the molded pan body. The interface portion includes at least two rows of apertures defined therein for increasing a bond strength between the at least one metal flange and the molded pan body.

A manufacturing method of a three-dimensional stretchable electronic device includes: preparing an aluminum mold for producing a substrate having one or more protrusions on an upper side and a lower side thereof; forming a path for a connection line for connecting the protrusions of the substrate using a wire; introducing a first polymer for forming the protrusions of the substrate into a predetermined portion of the aluminum mold; removing the wire and the three-dimensional stretchable substrate from the aluminum mold; injecting a liquid metal into the path for a connection line from which the wire was removed, thus manufacturing a three-dimensional stretchable substrate having a connection line; and transferring elements to the protrusions of the three-dimensional stretchable substrate having the connection line and connecting the elements to the connection line, thus connecting the elements to each other.

A manufacturing method of a three-dimensional stretchable electronic device includes: preparing an aluminum mold for producing a substrate having one or more protrusions on an upper side and a lower side thereof; forming a path for a connection line for connecting the protrusions of the substrate using a wire; introducing a first polymer for forming the protrusions of the substrate into a predetermined portion of the aluminum mold; removing the wire and the three-dimensional stretchable substrate from the aluminum mold; injecting a liquid metal into the path for a connection line from which the wire was removed, thus manufacturing a three-dimensional stretchable substrate having a connection line; and transferring elements to the protrusions of the three-dimensional stretchable substrate having the connection line and connecting the elements to the connection line, thus connecting the elements to each other.

A method for making a crush can for a vehicle which has an internal moulded structure can include providing a crush can with a hole, filling the hole in the crush can with a fibre-reinforced material and compression moulding the fibre-reinforced material using the internal shape of the crush can as an outer shell of a split mould.

A method of fabricating a fan case for a gas turbine engine defines a metallic ring including an outer surface and an inner surface. A first composite material is assembled about the outer surface of the metallic ring. A second composite material is assembled about the first composite material. The first composite material and the second material are cured about the metallic ring within a tool to form a first subassembly. The first subassembly is removed from the tool. A fan case assembly for a gas turbine engine and a gas turbine engine are also disclosed.

A method of fabricating a fan case for a gas turbine engine defines a metallic ring including an outer surface and an inner surface. A first composite material is assembled about the outer surface of the metallic ring. A second composite material is assembled about the first composite material. The first composite material and the second material are cured about the metallic ring within a tool to form a first subassembly. The first subassembly is removed from the tool. A fan case assembly for a gas turbine engine and a gas turbine engine are also disclosed.