In one aspect, a method of packaging a semiconductor module includes providing a semiconductor module having a first surface, a second surface opposite the first surface and edge sides extending between the first surface and the second surface. A packaging assembly is formed at least partly by a 3D printing process. The packaging assembly includes the semiconductor module and a protective covering that extends over the first surface.

In one aspect, a method of packaging a semiconductor module includes providing a semiconductor module having a first surface, a second surface opposite the first surface and edge sides extending between the first surface and the second surface. A packaging assembly is formed at least partly by a 3D printing process. The packaging assembly includes the semiconductor module and a protective covering that extends over the first surface.

A controller (1) includes a primary molded portion (11) in which a resin molded body (10) is integrated with a bus bar (100) using a resin, causing one end of the bus bar (100) to function as a connector terminal which protrudes into connector portions (13) to (15), and configured to form electronic component disposition portions (16a) to (16d) in which an electronic component (40) is disposed and a power device disposition portion (17) in which a power device (50) is disposed, and a secondary molded portion (21) integrated with the electronic component (40), the power device (50), and the primary molded portion (11) in a state in which the electronic component (40) is disposed at the electronic component disposition portions (16a) to (16d) and the power device (50) is disposed at the power device disposition portion (17).

A controller (1) includes a primary molded portion (11) in which a resin molded body (10) is integrated with a bus bar (100) using a resin, causing one end of the bus bar (100) to function as a connector terminal which protrudes into connector portions (13) to (15), and configured to form electronic component disposition portions (16a) to (16d) in which an electronic component (40) is disposed and a power device disposition portion (17) in which a power device (50) is disposed, and a secondary molded portion (21) integrated with the electronic component (40), the power device (50), and the primary molded portion (11) in a state in which the electronic component (40) is disposed at the electronic component disposition portions (16a) to (16d) and the power device (50) is disposed at the power device disposition portion (17).

The invention relates to a method for manufacturing a composite part intended for being subjected, via at least one attachment point, to pulling and/or compression forces. The method includes: winding fibers on a hub so as to form a portion of the wall of the part, and creating an externally convex rounded area at the location intended to form the area for applying the pulling and/or compression forces. The forces are radial thereto. The method also includes placing an insert on the convex rounded area, the insert including the attachment point or a mechanism for rigidly connecting the attachment point, and continuing to wind fibers so as to form the rest of the wall, while covering a portion of the insert and leaving the attachment point or the mechanism for rigidly connecting the attachment point accessible.

The invention relates to a method for manufacturing a composite part intended for being subjected, via at least one attachment point, to pulling and/or compression forces. The method includes: winding fibers on a hub so as to form a portion of the wall of the part, and creating an externally convex rounded area at the location intended to form the area for applying the pulling and/or compression forces. The forces are radial thereto. The method also includes placing an insert on the convex rounded area, the insert including the attachment point or a mechanism for rigidly connecting the attachment point, and continuing to wind fibers so as to form the rest of the wall, while covering a portion of the insert and leaving the attachment point or the mechanism for rigidly connecting the attachment point accessible.

A power supply control apparatus includes: a control board that is configured to control a voltage of a battery module; and a bus bar module that is configured to electrically connect the control board to the battery module, the control board and the bus bar module are arranged in a stacked manner, and the bus bar module includes a plurality of bus bars that are made to be independent by cutting off junctions connecting the bus bars to each other and a resin member that supports the bas bars in a state where the junctions are exposed.

A power supply control apparatus includes: a control board that is configured to control a voltage of a battery module; and a bus bar module that is configured to electrically connect the control board to the battery module, the control board and the bus bar module are arranged in a stacked manner, and the bus bar module includes a plurality of bus bars that are made to be independent by cutting off junctions connecting the bus bars to each other and a resin member that supports the bas bars in a state where the junctions are exposed.

The electric connector includes a housing to be fit into a second electric connector, and a cylindrical hollow terminal making contact with a projecting terminal arranged in the second electric connector when the projecting terminal is inserted into the cylindrical hollow terminal, the housing and the cylindrical hollow terminal being formed integrally with each other by an insertion-molding process, the cylindrical hollow terminal being formed with a structure for preventing molten resin from flowing into an area at which the cylindrical hollow terminal and the projecting terminal make contact with each other while the inserting-molding process is being carried out.

The invention relates to a method for foaming chipboard with tubes including a board body interspersed by tubes and having an upper and a lower face includes the steps of providing a corresponding chipboard with tubes, defining one or more machining regions on the upper and/or lower face of the chipboard with tubes, machining the machining regions.

In order to provide a method for foaming chipboard with tubes and a chipboard with tubes having foamed tubes that can be used in a simple, flexible, and cost-effective manner while also being highly robust, a foam-forming material is introduced at least in portions of at least one of the above-mentioned tubes in the machining region in order to locally reduce the difference in density between the tubes and the board body. The invention further relates to the use of a device for foaming tubes of a chipboard with tubes.