Provided is a method for producing a lithium ion cell having an outer container composed of a resin molded article, and the method for producing a lithium ion cell includes a current collector forming process of forming, on the inner side of an outer container, each of a first electrode current collector and a second electrode current collector composed of an electrically conductive polymer composition by using a molding die.

The present invention produces a reliable composite material structure having high rigidity and strength. A production device is for producing a composite material structure which is formed of continuous fiber laminate plates and a resin, and which includes a tabular panel part and a rib part for reinforcing the panel part, the production device being provided with a mold which includes a first mold and a second mold and in which a space is formed. The first mold includes first mold recesses which form space corresponding to the rib part. The second mold includes a second mold recess which forms a space corresponding to the panel part. In the first mold recesses, insert pins for supporting the continuous fiber laminate plates are provided so as to be placed at a predetermined position in the first mold recesses.

The present invention produces a reliable composite material structure having high rigidity and strength. A production device is for producing a composite material structure which is formed of continuous fiber laminate plates and a resin, and which includes a tabular panel part and a rib part for reinforcing the panel part, the production device being provided with a mold which includes a first mold and a second mold and in which a space is formed. The first mold includes first mold recesses which form space corresponding to the rib part. The second mold includes a second mold recess which forms a space corresponding to the panel part. In the first mold recesses, insert pins for supporting the continuous fiber laminate plates are provided so as to be placed at a predetermined position in the first mold recesses.

Space-efficient underfilling techniques for electronic assemblies are described. According to some such techniques, an underfilling method may comprise mounting an electronic element on a surface of a substrate, dispensing an underfill material upon the surface of the substrate within a dispense region for forming an underfill for the electronic element, and projecting curing rays upon at least a portion of the dispensed underfill material to inhibit an outward flow of dispensed underfill material from the dispense region, and the underfill material may comprise a non-visible light (NVL)-curable material. Other embodiments are described and claimed.

A telescopic table frame part, in particular a height-adjustable table leg (26), comprising an outer tube (12) and an inner tube (10) which can be moved relative to the former and which is guided by means of a sliding guide, characterized in that the sliding guide comprises at least one injection-molded sliding element (24) made from a slide-promoting plastic, a method for producing a sliding guide for guiding an inner tube (10) in an outer tube (12) movable relative thereto of a telescopic table frame part, comprising attaching of at least one sliding element (24) made from a slide-promoting plastic onto the inner surface (23) of the outer tube (12) or onto the outer surface (25) of the inner tube (10) by injection molding, wherein said plastic is introduced into the inside of the inner tube through an injection molding tool access opening (16) in same, and an apparatus for carrying out the method.

A telescopic table frame part, in particular a height-adjustable table leg (26), comprising an outer tube (12) and an inner tube (10) which can be moved relative to the former and which is guided by means of a sliding guide, characterized in that the sliding guide comprises at least one injection-molded sliding element (24) made from a slide-promoting plastic, a method for producing a sliding guide for guiding an inner tube (10) in an outer tube (12) movable relative thereto of a telescopic table frame part, comprising attaching of at least one sliding element (24) made from a slide-promoting plastic onto the inner surface (23) of the outer tube (12) or onto the outer surface (25) of the inner tube (10) by injection molding, wherein said plastic is introduced into the inside of the inner tube through an injection molding tool access opening (16) in same, and an apparatus for carrying out the method.

A connection between at least two joining partners includes an interlying joining gap, with opposite joining surfaces. At least one of the joining surfaces is wetted with an adhesive layer having incorporated and/or attached solids particles, and the remaining joining gap is filled with an inorganic and/or organic filler material.

A controller (1) includes a primary molded portion (11) in which a resin molded body (10) is integrated with a bus bar (100) using a resin, causing one end of the bus bar (100) to function as a connector terminal which protrudes into connector portions (13) to (15), and configured to form electronic component disposition portions (16a) to (16d) in which an electronic component (40) is disposed and a power device disposition portion (17) in which a power device (50) is disposed, and a secondary molded portion (21) integrated with the electronic component (40), the power device (50), and the primary molded portion (11) in a state in which the electronic component (40) is disposed at the electronic component disposition portions (16a) to (16d) and the power device (50) is disposed at the power device disposition portion (17).

A controller (1) includes a primary molded portion (11) in which a resin molded body (10) is integrated with a bus bar (100) using a resin, causing one end of the bus bar (100) to function as a connector terminal which protrudes into connector portions (13) to (15), and configured to form electronic component disposition portions (16a) to (16d) in which an electronic component (40) is disposed and a power device disposition portion (17) in which a power device (50) is disposed, and a secondary molded portion (21) integrated with the electronic component (40), the power device (50), and the primary molded portion (11) in a state in which the electronic component (40) is disposed at the electronic component disposition portions (16a) to (16d) and the power device (50) is disposed at the power device disposition portion (17).

Composite heat sink structures and methods of fabrication are provided, with the composite heat sink structures including: a thermally conductive base having a main heat transfer surface to couple to, for instance, at least one electronic component to be cooled; a compressible, continuous sealing member; and a sealing member retainer compressing the compressible, continuous sealing member against the thermally conductive base; and an in situ molded member. The in situ molded member is molded over and affixed to the thermally conductive base, and is molded over and secures in place the sealing member retainer. A coolant-carrying compartment resides between the thermally conductive base and the in situ molded member, and a coolant inlet and outlet are provided in fluid communication with the coolant-carrying compartment to facilitate liquid coolant flow through the compartment.