A manufacturing method of a reinforced structure includes a step of preparing a stringer that has a fiber exposed surface, a step of disposing an electrically conductive protection member on the fiber exposed surface to cover at least a part of the fiber exposed surface, a step of arranging the stringer on a skin having an uncured resin component, and a step of curing the skin after the arranging. The electrically conductive protection member includes a composite material made of combination of a resin component and an electrically conductive fiber component. The step of curing includes curing the skin and the electrically conductive protection member simultaneously. The manufacturing method can prevent edge glow without increasing the number of production steps.

An aircraft skin panel includes a laminated composite layer and a ground plane coupled to the composite layer, wherein the ground plane is an electrically conductive elastic thermoplastic.

A heated composite structure and a method for forming a heated composite structure. The structure includes carbon fibers embedded within a thermoplastic matrix. The carbon fibers are connected with first and second electrodes that are configured to be connected with an electric source such that applying current to the electrodes causes current to flow through the embedded carbon fibers to provide resistive heating sufficient to heat the composite structure to impede formation of ice on the composite structure.

A composite film having a high dielectric permittivity engineered particles dispersed in a high breakdown strength polymer material to achieve high energy density.

Systems and methods for curing complex fiber-reinforced composite structures utilize two distinct heat sources. A first heat source is utilized for heating a complex fiber-reinforced composite structure from within an internal portion of the complex fiber-reinforced composite structure. A second heat source is utilized for heating the complex fiber-reinforced composite structure from an external surface of the complex fiber-reinforced composite structure.

A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.

A rigid coupler for use in electrically isolating an electrically conductive fluid conveyance system is described. The rigid coupler includes a nonconductive liner having a first end configured to couple to a first adjoining section of the fluid conveyance system, and a second end, opposite said first end, configured to couple to a second adjoining section of the fluid conveyance system. A reinforcing structure circumscribes the nonconductive liner and is coupled to a portion of the nonconductive liner extending between the first and second ends of the nonconductive liner. The reinforcing structure includes a multi-axial braided fiber material impregnated with a matrix material. A fiber overwrap is hoop wound about at a least a portion of the reinforcing structure between the first and second ends of the nonconductive liner.

Provided is an encapsulation method not causing molding failures such as filling failures and flow marks when collectively encapsulating a large-area silicon wafer or substrate with a resin composition. Specifically, provided is a method for encapsulating a semiconductor element-mounted base material, using a curable epoxy resin composition containing: an epoxy resin (A), a curing agent (B), a pre-gelatinizing agent (C) and a filler (D). The semiconductor element-mounted base material is collectively encapsulated under conditions of (a) molding method: compression molding, (b) molding temperature: 100 to 175° C., (c) molding period: 2 to 20 min and (d) molding pressure: 50 to 350 kN.

Provided is a method for producing an electrically conductive composite, wherein the method includes: a) providing a bed of a polymer in a non-continuous solid form; b) providing, on the polymer bed, a composition that comprises a chemical precursor dissolved in a liquid medium made to inhibit a chemical reaction of the chemical precursor into forming an electrically conductive inorganic component; c) forming an electrically conductive inorganic component from a chemical reaction of the chemical precursor, by at least evaporating the liquid medium; and d) exposing to electromagnetic radiation an electromagnetic radiation absorber of the composition, to sinter those portions of said polymer bed in thermal contact therewith, to form a polymer network that percolates an electrically conductive network formed with the electrically conductive inorganic component.

Also provided are a system and a package adapted to implement the presently disclosed method.

A composite film having a high dielectric permittivity engineered particles dispersed in a high breakdown strength polymer material to achieve high energy density.