Patent classifications
B29C2945/76494
DISPLAY DEVICE AND DISPLAY SYSTEM OF INJECTION MOLDING MACHINE
A display device and a display system of an injection molding machine, capable of automatically displaying a window highly relevant to a window being displayed on a main screen on a sub-screen are provided.
A display device of an injection molding machine, capable of displaying two or more windows includes: a display unit having at least a main display unit and a sub-display unit; an input unit that receives an input related to selection of a window to be displayed on the display unit; and a display control unit that selectively controls the window to be displayed on the display unit based on the input to the input unit, wherein the display control unit switches a window to be displayed on the main display unit based on the input to the input unit and displays a window displayed in the past on the main display unit on the sub-display unit.
SYSTEM FOR MANUFACTURING MOLDED PRODUCT AND APPARATUS FOR TAKING OUT MOLDED PRODUCT
There are provided a molded product manufacturing system that can be easily adapted to IoT and an apparatus for taking out a molded product that can promote adaptation of the molded product manufacturing system to IoT. A molded product manufacturing system includes an injection molding machine, an apparatus for taking out a molded product, and one or more peripheral devices arranged around the apparatus to operate together during operation of the apparatus. The apparatus includes a communication unit operable to transmit internal data to an external server via a communication network. The communication unit of the apparatus transmits external data, which is output from the one or more peripheral devices, to external servers together with information on a die.
MANUFACTURING METHOD AND MANUFACTURING DEVICE FOR FOAM MOLDED ARTICLE
A method for producing a foam-molded product uses a producing apparatus including a plasticizing cylinder. The plasticizing cylinder has a plasticization zone, a starvation zone, and an introducing port which is formed in the plasticizing cylinder and via which a physical foaming agent is introduced into the starvation zone. The method includes: plasticizing and melting a thermoplastic resin into a molten resin in the plasticization zone; introducing a pressurized fluid containing the physical foaming agent having a fixed pressure into the starvation zone; allowing the molten resin to be in the starved state in the starvation zone; bringing the molten resin in the starved state into contact with the pressurized fluid having the fixed pressure in the starvation zone; and molding the molten resin into the foam-molded product. At least one pressure boosting part is provided in the starvation zone.
Injection molding cell and injection molding cell management system
An injection molding cell management system includes a plurality of injection molding cell each having an injection molding machine, its peripheral device and an injection molding cell management unit and a host management unit. The injection molding cell management unit includes a worker identification information input unit, which accepts input of worker identification information for identifying a worker who performs input and/or operation of the injection molding machine and its peripheral device, and a prohibition state releasing unit which releases a prohibition state of the input and/or operation of the injection molding machine and its peripheral device, based on the worker identification.
Molding system for preparing fiber-reinforced thermoplastic composite article
The present disclosure provides a molding system for preparing a fiber-reinforced thermoplastic composite article. The molding system includes: a molding machine; a mold disposed on the molding machine and having a mold cavity for being filled with a composite molding material including a polymeric resin and a plurality of fibers; a processing module configured to generate an anisotropic stress distribution of the composite molding material in the mold cavity based on a molding condition for the molding machine; and a controller coupled to the processing module and configured to control the molding machine with the molding condition to perform an actual molding process for preparing the fiber-reinforced thermoplastic composite article. The anisotropic stress distribution of the composite molding resin is generated based in part on consideration of an integral effect of an elongational viscosity and a shear viscosity of the composite molding material.
MOLDING SYSTEM FOR PREPARING FIBER-REINFORCED THERMOPLASTIC COMPOSITE ARTICLE
The present disclosure provides a molding system for preparing a fiber-reinforced thermoplastic composite article. The molding system includes: a molding machine; a mold disposed on the molding machine and having a mold cavity for being filled with a composite molding material including a polymeric resin and a plurality of fibers; a processing module configured to generate an anisotropic stress distribution of the composite molding material in the mold cavity based on a molding condition for the molding machine; and a controller coupled to the processing module and configured to control the molding machine with the molding condition to perform an actual molding process for preparing the fiber-reinforced thermoplastic composite article. The anisotropic stress distribution of the composite molding resin is generated based in part on consideration of an integral effect of an elongational viscosity and a shear viscosity of the composite molding material.
Manufacturing method of semiconductor device
A manufacturing method of a semiconductor device includes the steps of: preparing a lead frame; mounting a plurality of semiconductor chips on the lead frame; and sealing one portion of the lead frame with a sealing resin. The resin-sealing step includes the step of: disposing the lead frame, molds having main surfaces on which cavity parts are formed, the lead frame being disposed on the main surface of the heated molds; injecting a resin in the main surfaces of the heated molds so as to seal the one portion of the lead frame with the sealing resin; and taking out the lead frame from the heated molds. In the taking-out step, while the lead frame is taken out, the main surfaces of the molds are inspected by using a sensor, and the sensor is cooled and formed integrally with an arm used for taking out the lead frame.
Injection molding system
In an injection molding system, an insert formed with a cavity or an insert member for molding an insert-molded article is shot by a camera, and the insert or the insert member to be inserted into a mold is identified based on a characteristic of the insert or the insert member shot by the camera and previously stored data on the insert or the insert member.
Molding system for preparing fiber-reinforced thermoplastic composite article
The present disclosure provides a molding system for preparing a fiber-reinforced thermoplastic composite article. The molding system includes: a molding machine; a mold disposed on the molding machine and having a mold cavity for being filled with a composite molding material including a polymeric resin and a plurality of fibers; a processing module configured to generate an anisotropic stress distribution of the composite molding material in the mold cavity based on a molding condition for the molding machine; and a controller coupled to the processing module and configured to control the molding machine with the molding condition to perform an actual molding process for preparing the fiber-reinforced thermoplastic composite article. The anisotropic stress distribution of the composite molding resin is generated based in part on consideration of an anisotropic rotational diffusion effect of the fibers in the composite molding material.
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
A manufacturing method of a semiconductor device includes the steps of: preparing a lead frame; mounting a plurality of semiconductor chips on the lead frame; and sealing one portion of the lead frame with a sealing resin. The resin-sealing step includes the step of: disposing the lead frame, molds having main surfaces on which cavity parts are formed, the lead frame being disposed on the main surface of the heated molds; injecting a resin in the main surfaces of the heated molds so as to seal the one portion of the lead frame with the sealing resin; and taking out the lead frame from the heated molds. In the taking-out step, while the lead frame is taken out, the main surfaces of the molds are inspected by using a sensor, and the sensor is cooled and formed integrally with an arm used for taking out the lead frame.