A connection system includes an optical connector assembly; and an optical plug. The connector assembly includes a stack of gel-groove assemblies and a spring assembly mounted within a housing. Each of the gel-groove assemblies includes a first gel block at a first axial end, a second gel block at a second axial end, and a fiber mating region between the first and second gel blocks. The optical plug including sub-modules over-molded over arrays (e.g., ribbons) of the optical fibers. Each sub-module defines notches for receiving latches of the spring assembly when the optical plug is coupled to the first axial end of the optical adapter. Bare optical fibers extend from the plug, pass through the first axial gel block, and enter the fiber mating region when the plug is coupled to the adapter.

A method of forming an optical interconnect between first and second photonic chips located on an optical printed circuit board (OPCB) includes applying a coupling agent to a bonding surface of a flexible, freestanding polymer waveguide array film having at least one polymer waveguide disposed therein. The waveguide array film is placed onto the first and second photonic chips so that the waveguide array film extends over a gap and/or a step between the first and second photonic chips to thereby form a bonding interface between the bonding surface of the waveguide array film and the first and second photonic chips. The coupling agent is selected such that optical coupling between the first and second photonic chips arises simultaneously with formation of the bonding interface.

The present invention intends to provide a resin composition for an optical connection component capable of achieving both suppression of loss fluctuation due to temperature increase and satisfactory PC connection. The resin composition for an optical connection component includes a base resin and an inorganic filler. A glass transition temperature of the base resin is higher than or equal to 85 C. A mass of a residue obtained by heating the resin composition for the optical connection component at 700 C. is greater than or equal to 68.0% and less than or equal to 74.4% with respect to a mass of the resin composition for the optical connection component. A Rockwell hardness of the resin composition for the optical connection component is greater than or equal to 97.1 and less than or equal to 106.8.