An eyewear lens according to the present invention is configured so as to be provided with: a transparent first substrate having a principal surface; a second substrate disposed facing the principal surface, the transmittance thereof with respect to light in a predetermined wavelength region being different from that of the first substrate; an electric element in which optical characteristics thereof is changed by electrical control, the electric element being provided between the first substrate and the second substrate; and an adhesive layer provided between the first substrate and the second substrate.

Optics over a light source, such as, but not limited to, an LED on a circuit board. The optic does not entirely encapsulate the LED but rather includes an inner surface such that an air gap exists between the optic and the LED. The optic may include a lens and may conform to the shape of the circuit board.

Method for providing a head mounted optical system, the method comprising: an optical system providing step (S1), during which an optical system with an active function is provided and, an encapsulating step (S8), during which the optical system is at least partly encapsulated in a transparent capsule by stacking in close contact the optical system with at least one substrate of the transparent capsule and made integral with an adhesive.

The invention relates to electronic contact lens systems, methods for fabrication thereof, and uses thereof for treatment of ophthalmic diseases and conditions, for example, meibomian gland dysfunction.

A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.

The present invention provides a method of making a mask for patterning a three-dimensional substrate. A mandrel includes a form machined in a surface corresponding to a shape of the substrate. A layer of material is deposited in a first region of the form and a metal layer is deposited in a second region of the form. A portion of the mandrel is subsequently removed. The present invention also provides a method of patterning a three-dimensional substrate with a mask.

The present disclosure relates generally to contact lenses having a space within the lens. In various embodiments, a contact lens comprises a posterior component having an anterior surface and an anterior component having a posterior surface. The posterior component and the anterior component can comprise various combinations of gas permeable and gas impermeable optical materials. A contact lens also comprises a space between the posterior surface and the anterior surface, with the space configured to permit diffusion of a gas from a perimeter of the space through the space and across the anterior surface of the posterior component.

A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.

Optics over a light source, such as, but not limited to, an LED on a circuit board. The optic does not entirely encapsulate the LED but rather includes an inner surface such that an air gap exists between the optic and the LED. The optic may include a lens and may conform to the shape of the circuit board.

A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.