A system and method for automated production of a hybrid lens product comprising a lens insert embedded within a lens body. The system preferably includes a first carrier for holding at least one first mold half, a second carrier for holding at least one lens insert, and a third carrier for holding at least one second mold half. The system preferably also includes an automated movement enabling pick-and-place subassembly for positioning a lens insert within a first mold half, and for engaging a second mold half with a first mold half.

Provided are a camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic device. The molded photosensitive assembly is assembled with at least one optical lenses to form a camera module. The molded photosensitive assembly includes an imaging assembly, a molded base, and a filter member. The molded base includes a first molded portion and a second molded portion. The first molded portion embeds a part of the imaging assembly. The second molded portion is integrally formed on a first upper surface of the first molded portion, and the second molded portion has a second upper surface and a second outer side surface. A filter member is attached to the second upper surface of the second molded portion, and corresponds to a photosensitive path of the imaging assembly. The second upper surface of the second molded portion is higher than the first upper surface of the first molded portion, so as to define and form an outer space by a second outer side surface of the second molded portion and the first upper surface of the first molded portion.

To provide an electrochromic device, including a laminated body, which includes: at least one support; a first electrode layer on the support; an electrochromic layer on the first electrode layer; a second electrode layer disposed to face the first electrode layer; and an electrolyte layer, which fills between the first electrode layer and the second electrode layer, and is on the electrochromic layer, the at least one support including a resin substrate, and the laminated body having a desired curve formed by thermoforming.

A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demolding and avoiding stray lights.

A liquid crystal device (100) for focusing visible light, the liquid crystal device (100) comprising a plurality of curved substrates (101,102) arranged to form one or more curved cavities (104) therebetween, each substrate being configured to provide a focal power, wherein the one or more curved cavities contain liquid crystal and form one or more liquid crystal elements. Each of the one or more liquid crystal elements are configured to provide a focal power, the focal power of each of the liquid crystal elements being dependent on the curvature of the respective cavity and a voltage applied across the liquid crystal contained within the respective cavity. The substrates (101,102) in combination with the one or more liquid crystal elements are arranged to provide a first focal power in a substantial absence of an applied voltage and a second focal power in response to an applied voltage.

The invention relates to an ophthalmic device (1) which includes an electrochromic cell (3) comprising at least two transparent layers (4, 5) having curved inner surfaces (4a, 5a) and defining therebetween a closed recess (6) filled with an electrochromic composition (7), the recess (6) being defined peripherally by a sealing gasket (11) made from an adhesive material (20), the sealing gasket (11) being suitable for keeping the two transparent layers (4, 5) assembled together.

A wafer-level method for packaging a plurality of camera modules includes (a) overmolding a first housing material around a plurality of image sensors to produce a first wafer of packaged image sensors, (b) seating a plurality of lens units in the first wafer above the plurality of image sensors, respectively, and (d) overmolding a second housing material over the first wafer and around the lens units to form a second wafer of packaged camera modules, wherein each of the packaged camera modules includes one of the image sensors and one of the lens units, and the second housing material cooperates with the first housing material to secure the lens units in the second wafer.

A method for packaging applies to packaging a plurality of wafer-level lenses. Each wafer-level lens includes (a) a substrate with opposite facing first and second surfaces and (b) a respective lens element on at least one of the first and second surfaces. Each lens element has a lens surface facing away from the substrate. The method includes partially encasing the plurality of wafer-level lenses with a housing material to produce a wafer of packaged wafer-level lenses. In the wafer of packaged wafer-level lenses, the housing material supports each of the plurality of wafer-level lenses by contacting the respective substrate, and the housing is shaped to form a plurality of housings for the plurality of wafer-level lenses, respectively.

A light emitting device includes a substrate, a light source, and a covering member. The light source has an optical axis, a light source bottom portion and a light source upper portion opposite to the light source bottom portion in the optical axis. The light source is provided on the substrate at the light source bottom portion. The covering member has a bottom surface and a top portion opposite to the bottom surface in the optical axis and is provided on the substrate at the bottom surface to cover the light source. The covering member has a recess portion on the top portion above the light source and around the optical axis.

Manufacturing optoelectronic modules includes supporting a printed circuit board substrate (27) on a first vacuum injection tool (24). The printed circuit board substrate (27) has at least one optoelectronic component mounted thereon and has a solder mask (40) on a surface (46) facing away from the first vacuum injection tool (24). The method includes causing the first vacuum injection tool (24) and a second vacuum injection tool (22) to be brought closer to one another such that a surface (46) of the second vacuum injection tool (22) is in contact with the solder mask (40). Subsequently, a first epoxy (100, 20) is provided, using a vacuum injection technique, in spaces (104) between the upper tool (22) and the solder mask (40).