A method for the production and filling of an application package for a liquid pharmaceutical product. A thermoforming film made of thermoplastics laminated together is heated in order to plasticize the thermoforming film at least in partial areas. The plasticized areas are thermoformed in a mold in order to form a chamber for the liquid pharmaceutical product and a tube-shaped application duct opening into this chamber, with the chamber and the application duct being enclosed by a non-thermoformed, essentially flat bonding area of the thermoforming film. The liquid pharmaceutical product is filled into the chamber, and the chamber and the application duct are sealed by covering the thermoformed and filled thermoforming film with an essentially flat covering film. The covering film is directly bonded to the bonding area of the thermoforming film by thermal ring sealing, enclosing the chamber and the application duct.

A method for the production and filling of an application package for a liquid pharmaceutical product. A thermoforming film made of thermoplastics laminated together is heated in order to plasticize the thermoforming film at least in partial areas. The plasticized areas are thermoformed in a mold in order to form a chamber for the liquid pharmaceutical product and a tube-shaped application duct opening into this chamber, with the chamber and the application duct being enclosed by a non-thermoformed, essentially flat bonding area of the thermoforming film. The liquid pharmaceutical product is filled into the chamber, and the chamber and the application duct are sealed by covering the thermoformed and filled thermoforming film with an essentially flat covering film. The covering film is directly bonded to the bonding area of the thermoforming film by thermal ring sealing, enclosing the chamber and the application duct.

A method for the production and filling of an application package for a liquid pharmaceutical product. A thermoforming film of thermoplastics laminated together is heated in order to plasticize the film at least in partial areas. Plasticized areas are thermoformed in a mold in order to form a chamber for the liquid pharmaceutical product and a tube-shaped application duct opening into this chamber, with the chamber and duct being enclosed by a non-thermoformed, essentially flat bonding area of the film. The liquid pharmaceutical product is filled into the chamber. The chamber and the application duct are sealed by covering the thermoformed and filled thermoforming film with an essentially flat covering film that is bonded to the bonding area of the thermoforming film enclosing the chamber and the application duct. The thermoforming film is pressed by a forming die during thermoforming into the mold in at least a partial area of the application duct.

This invention relates to a water-soluble film (WSF) system with embedded/entrapped water-soluble films (WSF). More particularly, the invention relates to a WSF system with actives embedded/entrapped therein such as to provide precise and desired release of actives there from and its method of manufacturing for diverse applications, in which a variety of substances such as detergents, enzymes, softeners, perfumes, pesticides, fungicides, active ingredients, dyes, pigments, hazardous chemicals, active agents for cleaning laundry, dishes, floorings, walls, furniture, fluffs, pulp, etc., and the like can be so embedded/entrapped for such purpose. The invention further discloses novel online and offline process for the manufacture of such multi-layered WSF with or without liners and of desired shapes to selectively entrap interacting/non-interacting materials and their combinations. The process also provides options for the use of a wide range of raw materials, liners such as paper, film, foil, fabric, etc.

The invention relates to the use of compounds of formulae (I) and/or (II) as colorless IR absorbers wherein M is Ni, Pd, Pt, Au, Ir, Fe, Zn, W, Cu, Mo, In, Mn, Co, Mg, V, Cr or Ti, X.sub.1, X.sub.2 and X.sub.3 are each independently of the others sulfur or oxygen, R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.5 and R.sub.6 are each independently of the others hydrogen, NR.sub.7R.sub.8, unsubstituted or substituted C.sub.1-C.sub.18alkyl, C.sub.1-C.sub.18 alkyl wherein the alkylene chain is interrupted with oxygen, unsubstituted or substituted C.sub.1-C.sub.18alkenyl, unsubstituted or substituted aryl, unsubstituted or substituted arylalkyl or unsubstituted or substituted heteroarylalkyl, R.sub.7 and R.sub.8, each independently of the other, being unsubstituted or substituted C.sub.1-C.sub.18alkyl, unsubstituted or substituted aryl, unsubstituted or substituted arylalkyl or unsubstituted or substituted heteroarylalkyl, a further IR absorber optionally being added to the compounds of formulae (I) and (II). The invention relates also to novel dithiolene compounds of formulae (I) and (II) wherein X.sub.1 is oxygen and X.sub.2 and X.sub.3 are oxygen or sulfur. The invention relates furthermore to novel dithiolene compounds of formulae (I) and (II) wherein R.sub.1 to R.sub.6 are NR.sub.7R.sub.8. ##STR00001##

The invention relates to the use of compounds of formulae (I) and/or (II) as colorless IR absorbers wherein M is Ni, Pd, Pt, Au, Ir, Fe, Zn, W, Cu, Mo, In, Mn, Co, Mg, V, Cr or Ti, X.sub.1, X.sub.2 and X.sub.3 are each independently of the others sulfur or oxygen, R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.5 and R.sub.6 are each independently of the others hydrogen, NR.sub.7R.sub.8, unsubstituted or substituted C.sub.1-C.sub.18alkyl, C.sub.1-C.sub.18 alkyl wherein the alkylene chain is interrupted with oxygen, unsubstituted or substituted C.sub.1-C.sub.18alkenyl, unsubstituted or substituted aryl, unsubstituted or substituted arylalkyl or unsubstituted or substituted heteroarylalkyl, R.sub.7 and R.sub.8, each independently of the other, being unsubstituted or substituted C.sub.1-C.sub.18alkyl, unsubstituted or substituted aryl, unsubstituted or substituted arylalkyl or unsubstituted or substituted heteroarylalkyl, a further IR absorber optionally being added to the compounds of formulae (I) and (II). The invention relates also to novel dithiolene compounds of formulae (I) and (II) wherein X.sub.1 is oxygen and X.sub.2 and X.sub.3 are oxygen or sulfur. The invention relates furthermore to novel dithiolene compounds of formulae (I) and (II) wherein R.sub.1 to R.sub.6 are NR.sub.7R.sub.8. ##STR00001##

A method and apparatus for manufacturing a welded resin article which includes (a) bringing first and second resin members to come into contact with each other; (b) applying laser light to the first and second resin members while moving the laser light relative to the first and second resin members; (c1) obtaining a value corresponding to the intensity of infrared light from a plurality of locations on a surface; (d) successively calculating, as a section average, the average of a predetermined number of successive values, among those obtained from the plurality of locations corresponding to the intensity of the infrared light; (e) a step of successively calculating a deviation judgment value; and (f) a step of successively judging whether or not the deviation judgment value falls within a predetermined judgment threshold range.

A method and apparatus for manufacturing a welded resin article which includes (a) bringing first and second resin members to come into contact with each other; (b) applying laser light to the first and second resin members while moving the laser light relative to the first and second resin members; (c1) obtaining a value corresponding to the intensity of infrared light from a plurality of locations on a surface; (d) successively calculating, as a section average, the average of a predetermined number of successive values, among those obtained from the plurality of locations corresponding to the intensity of the infrared light; (e) a step of successively calculating a deviation judgment value; and (f) a step of successively judging whether or not the deviation judgment value falls within a predetermined judgment threshold range.

The invention relates to a process for producing semi-finished composites and composite components. For production of the semi-finished products or components, (meth)acrylate monomers, (meth)acrylate polymers, polyfunctionalized (meth)acrylates, hydroxy-functionalized (meth)acrylate monomers and/or hydroxy-functionalized (meth)acrylate polymers are mixed with di- or polyisocyanates or with uretdione materials. This liquid mixture is applied by known processes to fibre material, for example carbon fibres, glass fibres or polymer fibres, and polymerized with the aid of a first temperature increase or of a redox accelerator or by means of photoinitiation. Polymerization, for example at room temperature or at up to 120° C., gives rise to thermoplastics which can still be subjected to a forming operation. The hydroxy-functionalized (meth)acrylate constituents can subsequently be crosslinked in a press with isocyanates or uretdiones already present in the system at a second temperature at least 20° C. above the polymerization temperature. In this case, the shaping to give the final component is effected simultaneously in this press. In this way, dimensionally stable thermosets or crosslinked composite components can be produced.

Parts made by additive manufacturing are often structural in nature, rather than having functional properties conveyed by a polymer or other component. Printed parts having piezoelectric properties may be formed using a composite filament comprising a plurality of piezoelectric particles dispersed in a thermoplastic polymer. The composite filaments may be formed through melt blending and extrusion. The composite filament is compatible with fused filament fabrication and has a length and diameter compatible with fused filament fabrication, and the piezoelectric particles are substantially non-agglomerated and dispersed along the length of the composite filament. The piezoelectric particles may remain substantially non-agglomerated when dispersed in the thermoplastic polymer through melt blending. Additive manufacturing processes may comprise heating such a composite filament at or above a melting point or softening temperature thereof to form a softened composite material, and depositing the softened composite material layer by layer to form a printed part.