An orthopedic surgical instrument includes from about 40 wt % to about 85 wt % of a base thermoplastic and from about 15 wt % to about 60 wt % of a filler material. The base thermoplastic includes polyetherimide, polycarbonate, modified polyphenylene ether, polyamide, copolymers of these thermoplastics, and combinations thereof. In some aspects all materials in the orthopedic surgical instrument are biocompatible. An orthopedic surgical kit includes an orthopedic surgical instrument and a container suitable for sealing the orthopedic surgical instrument therein. The orthopedic surgical instrument in the kit includes from about 50 wt % to about 90 wt % of a base thermoplastic selected from the group consisting of polyetherimide, polycarbonate, modified polyphenylene ether, polyamide, copolymers of these thermoplastics, and combinations thereof, and from about 10 wt % to about 50 wt % of a filler material.

Microporous breathable films include a polyolefin and an inorganic filler dispersed in the polyolefin.

Provided are an apparatus and a method of controlling a stiffness of a soft material hardened from a liquid state having viscosity into a solid state. The apparatus of controlling a stiffness of a soft material includes: a soft material accommodating means including a chamber corresponding to a space in which the soft material having fluidity before being hardened is accommodated and a wall structure surrounding the chamber; and a stimulus means applying a stimulus to the soft material to generate a flow in the soft material, wherein a flow is applied to the soft material to control the stiffness in the soft material and control stiffnesses to be different from each other in each region of the soft material.

Embodiments disclosed herein relate to polymer resins having a first thermoset and one or more additional components (e.g., a second thermoset and/or a thermoplastic), composite laminates including the same, methods of making and using the same, and composite laminate structures including the same.

A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a pad material precursor from a nozzle and solidifying the pad material precursor to form a solidified pad material.

The embodiments of the present application provide a method for making continuous micro-irrigation tubing, the continuous micro-irrigation tubing so made, a method for performing irrigation using the said continuous micro-irrigation tubing, and the application of the said continuous micro-irrigation tubing in agricultural irrigation, wherein the method for making continuous micro-irrigation tubing comprises: preconditioning a filler; blending the preconditioned filler with high-pressure polyethylene resin at a predefined weight ratio and making said filler and resin into filler pellet; making preformed tubing from the filler pellet; and threading the preformed tubing into a high-temperature extractor in which continuous extraction is performed to make continuous micro-irrigation tubing. The method enables the making of continuous micro-irrigation tubing containing micro-pores on the tubing wall. After the continuous micro-irrigation tubing is filled with water, water exudes through the micro-pores.

An aspect of the invention is directed to a method for producing a connector using injection-molding by providing at least one conductor and at least one contact pin which are electrically connected at a contact point, producing a thermoset premold from a thermoset using injection-molding, wherein the thermoset is injection-molded around at least a first section of the at least one conductor and/or around at least a second section of the at least one contact pin, and injection-molding of a thermoplast on the thermoset premold, wherein the step of injection-molding takes place before the thermoset premold has obtained a degree of curing of 90%. Another aspect of the invention is a connector comprising at least one conductor and at least one contact pin is disclosed.

A method of manufacturing hexagonal boron nitride laminates contains steps of: a) Dissolving dielectric polymers in solvent. b) Mixing h-BN powder to form a well-mixed h-BN coating slurry. c) Coating slurry on substrates and dried at 100 to 150° C. d-1) For free standing h-BN film, peel off h-BN dielectric polymer layer from substrate in water batch by roll to roll process. d-2) For h-BN film on substrates, heat compression of the substrates and hBN laminates at 100 to 250° C. for multi-layer structures. Thereby, hexagonal boron nitride laminates exhibit thermal conductivity of 10 to 40 W/m.Math.K, which is significantly larger than that currently used in thermal management. In addition, thermal conductivity of hexagonal boron nitride laminates increases with the increasing mass density, which opens a way of fine tuning of its thermal properties.

The invention is directed to a process for the preparation of a reinforced article which comprises the step of molding a molding composition comprising pellets into the article at an elevated temperature, wherein each of the pellets has an axial length and comprises a core and a sheath around the core, wherein the core comprises an impregnating agent and a multifilament strand comprising glass fibers each having a length substantially equal to the axial length of the pellet and substantially oriented in the axial length of the pellet, wherein the sheath comprises a thermoplastic polymer; and wherein the molding composition further comprises a filler.

Provided is a resin sheet, wherein in a stress measurement in which a dynamic shear strain is applied in a direction parallel to a surface, the difference between a loss tangent as measured when a strain amplitude is 10% of the sheet thickness and a loss tangent as measured when the amplitude is 0.1% is equal to or greater than 1 at a temperature of 80° C. and a frequency of 0.5 Hz. The resin sheet of the present invention can provide a semiconductor device with excellent connection reliability, wherein air bubbles and cracks are less likely to occur in the resin sheet. In the resin composition of the present invention, aggregates are less likely to occur during storage. The resin sheet obtained by forming the resin composition into a sheet has good flatness. The hardened material thereof can provide a circuit board or a semiconductor device with high connection reliability.