A semiconductor apparatus includes a semiconductor device, on-semiconductor-device metal pad and metal interconnect each electrically connected to the semiconductor device, a through electrode and a solder bump each electrically connected to the metal interconnect, a first insulating layer on which the semiconductor device is placed, a second insulating layer formed on the semiconductor device, a third insulating layer formed on the second layer. The metal interconnect is electrically connected to the semiconductor device via the on-semiconductor-device metal pad at an upper surface of the second layer, penetrates the second layer from its upper surface, and is electrically connected to the through electrode at an lower surface of the second layer, and an under-semiconductor-device metal interconnect is between the first layer and the semiconductor device, and the under-semiconductor-device metal interconnect is electrically connected to the metal interconnect at the lower surface of the second layer.

Various components and methods related to a leading edge assembly are disclosed. The leading edge assembly can include an outer strike shell and a foam core. The foam core can be located inside the outer strike shell. The leading edge assembly can include a heating element with a plurality of sensors and wires. A method of manufacturing a leading edge assembly can include forming a composite layer, applying a metallic layer to the composite layer, installing an electronic device, and inserting a foam core into a cavity bounded by the composite layer and/or the electronic device.

Methods of forming dry adhesives including a method of making a dry adhesive including applying a liquid polymer to the second end of the stem, molding the liquid polymer on the stem in a mold, wherein the mold includes a recess having a cross-sectional area that is less than a cross-sectional area of the second end of the stem, curing the liquid polymer in the mold to form a tip at the second end of the stem, wherein the tip includes a second layer stem; corresponding to the recess in the mold, and removing the tip from the mold after the liquid polymer cures.

A one-step process for the production of a paneling is provided and, in particular, floor paneling for a motor vehicle with an insulation of fiber/absorbent nonwoven, as well as possibly further absorbent layers, which can differ zonally (partially) over the area and thickness of the insulation in their mechanical-physical and acoustic properties. The focus are nonwoven structures whose fiber orientation is perpendicular to the surface/wear layer of the floor paneling.

Cables are constructed with embedded discontinuities in the cable jacket that allow the jacket to be torn to provide access to the cable core. The discontinuities can be longitudinally extending strips of polymer material coextruded in the cable jacket.

An intravenous delivery system may have a liquid source containing a liquid, tubing, and an anti-run-dry membrane positioned such that the liquid, flowing form the liquid source to the tubing, passes through the anti-run-dry membrane. The anti-run-dry membrane may be positioned within an exterior wall of a drip unit, and may be secured to a seat of the exterior wall by an attachment component. The attachment component may have various forms, such as a secondary exterior wall that cooperates with the exterior wall to define a drip chamber, a washer positioned such that the anti-run-dry membrane is between the washer and the seat, and an adhesive ring formed of a pressure sensitive adhesive and secured to the anti-run-dry membrane and the seat via compression. Interference features may protrude inward from the exterior wall or outward from the anti-run-dry membrane to help keep the anti-run-dry membrane in place.

There is provided a method of fabricating a blade platform out of composite material with integrated gaskets for a turbine engine fan, the platform including a base and a stiffener, the method including using three-dimensional weaving to make a single-piece fiber blank with a plurality of longitudinal yarn layers extending in a direction corresponding to a longitudinal direction of the base of the platform; shaping the fiber blank to form a fiber preform having a first portion forming a base preform and a second portion forming a stiffener preform; positioning platform gaskets at side margins of the first portion of the fiber preform forming a base preform; placing the fiber preform with the gaskets in an injection mold; injecting resin into the injection mold; compacting the assembly; heating the injection mold to solidify the resin; and unmolding the resulting platform.

An opening device for a package made of a sheet packaging materialsaid sheet packaging material comprising at least a first layer and a second layer, and having a hole formed through said first layer and sealed by a cover portion of said second layeris made of plastic material molded onto said cover portion, and in turn comprises a spout defining a pouring opening and a wall portion closing said pouring opening, said wall portion defining, together with said cover portion, a user-removable sealing portion of said spout, a weakening region being interposed between said wall portion and said spout and said cover portion covering said weakening region; a molding apparatus for molding an opening device on a sheet packaging material is also disclosed.

Provided are methods for forming a rigid cable harness. An example method includes providing a curable sleeve comprising a curable compound, an adhesive, and a backing; wherein the curable adhesive tape has a longitudinal direction. The method further includes placing a plurality of cables on the sleeve in the longitudinal direction and wrapping the curable sleeve around the placed plurality of cables to form a cable harness, wherein the wrapping comprises wrapping the plurality of cables with the curable sleeve in the longitudinal direction. The method additionally includes positioning the cable harness into a desired shape and curing the curable compound of the cable harness to form the rigid cable harness, wherein the rigid cable harness has the desired shape.

An encapsulation method of electronic components comprises steps as follows: preparing electronic components with cylindrical bodies wherein a cylindrical body has front and rear ends made of metals and a middle end made of ceramics and the front end or the rear end features an outer diameter greater than the middle end of the cylindrical body; preparing a mould consisting of upper and lower moulds; encasing the cylindrical bodies inside the upper and lower moulds, injecting heated and softened protective materials into the mould in which protective materials as protective layers are coated on the cylindrical bodies; injecting the cylindrical bodies removed from the upper and lower moulds into a roller in which excessive protective layers on the front and rear ends of the cylindrical bodies are de-coated.