In one aspect, a method of packaging a semiconductor module includes providing a semiconductor module having a first surface, a second surface opposite the first surface and edge sides extending between the first surface and the second surface. A packaging assembly is formed at least partly by a 3D printing process. The packaging assembly includes the semiconductor module and a protective covering that extends over the first surface.

A wafer for repairing damage to asphalt shingles comprising a first layer of a rubberized asphalt, a fiber matrix layer and a second layer of the rubberized asphalt. The first and second layers of rubberized asphalt sandwich and are bound to the fiber matrix layer forming an integrated wafer. The wafer is formed in a select shape.

In a preferred embodiment, a composite panel with a smooth outer surface, ready for painting with or without addition of primer, may be created by constructing a panel layup assembly upon a mold, the panel layup assembly including a composite panel having a core and a resin formulation, and a release film between the mold and the composite panel, where a smooth release surface of the release film is in contact with the composite panel upon construction; initiating curing of the composite panel at a first temperature within a lowermost ten percent of a curing temperature range of the resin formulation; continuing curing of the composite panel at a second temperature above the lowermost ten percent of the curing temperature range; and completing curing of the composite panel at a third temperature below the second temperature.

A method of bonding a second object to a first object includes: providing the first object, which includes a thermoplastic liquefiable material in a solid state; providing the second object, which includes a surface portion that has a coupling structure with an undercut such that the second object can make a positive-fit connection with the first object; and pressing the second object against the first object with a tool that is in physical contact with a coupling-in structure of the second object while mechanical vibrations are coupled into the tool. The step of pressing and coupling vibrations into the tool continues until a flow portion of the thermoplastic material of the first object is liquefied and flows into the coupling structures of the second object. Thereafter, the thermoplastic material of the first object is permitted to re-solidify to yield a positive-fit connection between the first and second objects.

A system for curing a thermoset composite may include a tooling die configured to receive and support an uncured thermoset composite part and to heat the uncured thermoset composite part; a pressure media bag configured to be placed over the uncured thermoset composite part disposed on the tooling die and including a pressure media; and a mechanical press configured to apply a consolidation pressure to the uncured thermoset composite part disposed on the tooling die, the pressure media bag may be configured to distribute the consolidation pressure applied by the mechanical press to the uncured thermoset composite part disposed on the tooling die.

A method of injection molding a test tube-shaped preform for biaxial stretch blow molding includes supplying a major material resin from outer and inner flow paths to a combined flow path for a predetermined time and rate. For a period of time within a range of the predetermined time period during which the major material resin is supplied, the intermediate layer resin is simultaneously supplied from the middle flow path to the combined flow path at a second predetermined supplying rate. A columnar laminated molten resin is injected into a cavity of a metal mold connected to a tip of the nozzle through a gate to fill the cavity, the columnar laminated molten resin being composed of the major material resin and the intermediate layer resin formed in the major material resin in a laminated manner that are combined into a columnar shape at the combined flow path.

There is provided herein a method of manufacturing a device comprising at least a first fibre using a draw apparatus, the method comprising: providing a first preform comprising a shape memory polymer to the draw apparatus; heating a first portion of the first preform; and drawing, using the draw apparatus, the heated first portion in order to form the first fibre.

A resin molding method is capable of reducing the use amount of micropellets and obtaining a resin molded article having required characteristics. A resin molding method includes a disposing step of disposing a preliminary molded body laminated and formed in a three-dimensional shape in a molding die, a filling step of heating and melting the preliminary molded body by an electromagnetic wave transmitted through the molding die and filling the molding die with a molten resin material, and a cooling step of cooling and solidifying the molten resin material in the molding die. In the cooling step, a resin molded article integrated so as to eliminate a lamination interface of the preliminary molded body is formed in the molding die.

The invention concerns a preform for a container made of plastic material, comprising a cylindrical body that extends along an axis of revolution of the preform and a bottom that closes the cylindrical body. The bottom has an outer profile with a central portion and a curved portion joining the central portion to the cylindrical body. The central portion has, in longitudinal cross-section, a first concave section. The curved portion has successively, in longitudinal cross-section, from the first concave section towards the cylindrical body, a first convex or frustoconical section, a second concave section and a second convex or frustoconical section.

A manufacturing apparatus for manufacturing a resin container includes an injection molding part configured to injection-mold a preform, and a temperature adjustment part configured to adjust a temperature of the preform molded in the injection molding part, in which the manufacturing apparatus is configured to blow-mold the preform whose temperature has been adjusted in the temperature adjustment part, the preform is inserted into the temperature adjustment part in a state where an outer surface temperature of the preform is higher than a glass transition temperature of the preform by 30° C. or higher and 60° C. or lower, and the preform is cooled to a predetermined temperature suitable for blow molding in the temperature adjustment part.