A method of forming an antistatic plastic includes providing a mixture containing 10 parts by weight of crystalline silicon particles, 1 to 30 parts by weight of an encapsulant, and 0.5 to 25 parts by weight of a backsheet material. The mixture is compounded to form an antistatic plastic, wherein the encapsulant is different from the backsheet material.

Provided is a method of forming a conductive polymer composite. The method includes forming a mixture. The mixture includes a first thermoplastic polymer, a second thermoplastic polymer and a plurality of metal particles. The first thermoplastic polymer and the second thermoplastic polymer are immiscible with each other. The plurality of metal particles include at least one metal that is immiscible with both the first thermoplastic polymer and the second thermoplastic polymer. The method includes heating the mixture to a temperature greater than or equal to a melting point of the metal.

In an example method for forming three-dimensional (3D) printed electronic parts, a build material is applied. An electronic agent is selectively applied in a plurality of passes on a portion of the build material. A fusing agent is also selectively applied on the portion of the build material. The build material is exposed to radiation in a plurality of heating events. During at least one of the plurality of heating events, the portion of the build material in contact with the fusing agent fuses to form a region of a layer. The region of the layer exhibits an electronic property. An order of the plurality of passes, the selective application of the fusing agent, and the plurality of heating events is controlled to control a mechanical property of the layer and the electronic property of the region.

Retroreflective articles include a layer of optical elements (110,120,130), embedded in a bead bond layer (140). The optical elements include transparent microspheres (110), at least one colored polymeric layer (120) covering the transparent microspheres, and a reflective layer (130) covering the colored polymeric layer. The polymeric layer includes at least one nanopigment. The transparent microspheres have a diameter range of 80-120 micrometers, with at least 75% of the transparent microspheres having a diameter range of 85-105 micrometers.

A composition, method, and system for directly printing and creating complete functional 3D electronic circuits and devices without any thermal or laser post-processing treatment, by using at least Triphenylamine (TPA) as a powder binding agent. The composition can have mechanical characteristics that allow it to be melted and extruded on a structure, and electrical properties that allow it to function as at least one of a conductor, insulator, resistor, p-type semiconductor, n-type semiconductor, or capacitor.

The present invention provides a thin and flexible device and method of use thereof for wound treatment and infection control. The integrated surface stimulation device may comprise wireless stimulation system in a disposable and/or reusable flexible device for widespread use in multiple therapeutic applications. The invention would be situated on the skin surface of a patient and would be activated so as to reduce the overall occurrence of infections and/or increase wound healing rates. As provided, the device will comprise an integrated power supply and pre-programmable stimulator/control system on a flexible polymeric substrate layer with areas of stimulating electrodes, applied using techniques such as those found in additive manufacturing processes. The device is especially valuable in treating biofilm-based infections.

A 3D printing system includes a reservoir for a UV-curable dielectric material in communication with a first nozzle configured to print the UV-curable dielectric material onto a substrate and a reservoir for a low CTE filler in communication with a second nozzle configured to print the low CTE filler onto the substrate, and a reservoir for a conductive ink in communication with a third nozzle configured to print the conductive ink onto the substrate. The 3D printing system prints the UV-curable dielectric material and the low CTE filler such that the printed low CTE filler mixes with the printed UV-curable dielectric material and forms a UV-curable dielectric layer with the low CTE filler dispersed therein.

Three-dimensional (3D) printing and injection molding conductive filaments and methods of producing and using the same are disclosed. According to an aspect, a conductive filament for 3D printing includes a material comprising polymer. The conductive filament also includes anisotropic conductive particles dispersed within the material.

Provided is a method of forming a conductive polymer composite. The method includes forming a mixture. The mixture includes a first thermoplastic polymer, a second thermoplastic polymer and a plurality of metal particles. The first thermoplastic polymer and the second thermoplastic polymer are immiscible with each other. The plurality of metal particles include at least one metal that is immiscible with both the first thermoplastic polymer and the second thermoplastic polymer. The method includes heating the mixture to a temperature greater than or equal to a melting point of the metal.

Techniques are described for additive manufacturing, e.g., 3D printing, stretchable tactile sensors. As described, the techniques may allow the stretchable tactile sensors to be 3D printed under ambient conditions via nanocomposite inks. In various embodiments, sinter-free inks are described with adjustable viscosities and electrical conductivities. Moreover, conductive compositions are described in which micron or submicron-sized silver particles are dispersed in a highly stretchable silicone elastomer. Techniques are described herein in which the inks are used 3D printing process to form tactile sensing platforms and integrated arrays.