A method of fabricating a polymer composite material by mixing a polymer material with a planar material, depositing the mixture on a substrate, and stretching the resulting thin film, is described. Polymer composite materials produced using said method and ballistic resistant materials comprising said polymer composite materials are also described.

A method for forming a matrix composite layer on a workpiece and a workpiece with a matrix composite layer are disclosed. In an embodiment the method includes forming a wall around a metallic surface such that the wall extends in a vertical direction from a plane formed by the metallic surface, and depositing a filler material in a walled area on the metallic surface. The method further includes depositing a plastic material on the filler material and performing a vacuum treatment of the filler material and the plastic material thereby forming a matrix composite layer disposed on the metallic surface.

An apparatus is provided which extrudes a radiation-curable construction material above a support surface with a slot die to deposit a layer of extruded construction material above the support surface. Radiation is selectively projected with a projection unit to a construction region between the support surface and the slot die, thereby curing portions of the extruded construction material. The apparatus repeats these steps are repeated until a desired object is formed by the contiguous cured portions of the construction material extending across and between the layers.

Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecraft and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110 C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than 40 C.

A consumable material for use in an extrusion-based digital manufacturing system, the consumable material comprising a length and a cross-sectional profile of at least a portion of the length that is axially asymmetric. The cross-sectional profile is configured to provide a response time with a non-cylindrical liquefier of the extrusion-based digital manufacturing system that is faster than a response time achievable with a cylindrical filament in a cylindrical liquefier for a same thermally limited, maximum volumetric flow rate.

A thermosetting resin composition containing a thermosetting resin and an inorganic filler, in which the inorganic filler contains secondary sintered particles (A) formed of primary particles of boron nitride, which have an aspect ratio of 10 to 20, and secondary sintered particles (B) formed of the primary particles of boron nitride, which have an aspect ratio of 2 to 9. The thermosetting resin composition can produce a thermal conductive sheet that has excellent filling property of the inorganic filler, and excellent thermal conductivity, adhesiveness and electrical insulating properties.

A swellable downhole article includes a swellable material and a carbon nitride material. The swellable material may include at least one of an elastomeric material and an absorbent material. The carbon nitride material may remove cations from a downhole fluid. Methods of forming the swellable downhole article are also disclosed, as are methods of forming a carbon nitride containing material for removing contaminants from a fluid.

Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecraft and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110 C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than 40 C.

Nanocomposites comprising a polymer matrix having a controlled dispersion of nanoparticles at high concentrations are described. The nanoparticles can be materials that absorb radiation. Thus, the nanocomposites can be of use in radiation shielding. Also described are methods of preparing the nanocomposites and multifunctional structures, such as sandwich panels, comprising the nanocomposites.

A slurry composition for forming an article using additive manufacturing is provided. The slurry composition comprises a carrier having a viscosity of at least 0.001 cP at normal temperature and pressure. The carrier is adapted to be flowable through a nozzle. The slurry composition further comprises a material selected from the group of a metal-containing material, a ceramic-containing material, an inorganic carbon-containing material, a silica-containing material, and combinations thereof.