Patent classifications
B29K2705/10
Resin structure having electronic component embedded therein, and method for manufacturing said structure
In a resin structure including a resin molded body and a plurality of electronic components embedded in the resin molded body, (i) the resin molded body has a plurality of exposed surfaces on which electrodes of the plurality of electronic components are exposed, (ii) the resin molded body has a recess formed therein, and (iii) the recess has a bottom surface which is at least one of the plurality of exposed surfaces.
Compression-molded parts having an embedded conductive layer and method for making same
A compression-molded part has a conductive layer embedded in the part during molding of the part. The conductive layer is generally adjacent an outer surface of the part and is preferably formed from a mesh, a foil, a pulled screen, or multiple layers of conductive elements. The part is preferably optimized for use on the exterior of an aircraft for lightning-strike or EMI protection or for use as an antenna. Methods for forming the panels of the invention include placing the conductive layer against a mold surface of a compression mold, then forming the compression-molded part with the conductive layer embedded in the part.
EMBEDDING APPARATUS AND METHOD UTILIZING ADDITIVE MANUFACTURING
An embedded material and an embedding apparatus and method. A compatible solute can be dissolved in a solvent. The object to be embedded can be coated with the solvent/plastic solution using, for example, addition and/or condensation polymerization. The solvent can be removed. The coated object can be inserted, snap fit, or submerged into a partially 3D printed substrate with or without the aid of ultrasonic embedding, thermal energy, joule heating, and/or the use of adhesives, and the 3D printing process resumes in order to fully embed the coated object within the 3D printed substrate. The coated object can be inserted, snap fit, or submerged into a partially 3D printed substrate with or without the addition of ultrasonic embedding, thermal energy, joule heating, and/or adhesives, and the 3D printing process resumes in order to fully embed the coated object within the 3D printed substrate.
TWO-COLOR SPIRAL STRIP INJECTION MACHINE BASED ON PLC CONTROL AND STRIP INJECTION METHOD THEREOF
A two-color spiral strip injection machine based on PLC control, comprising: a frame having a strip injection machine body, a motor, a PLC control box and a transmission mechanism, wherein the motor is connected to the strip injection machine body via the transmission mechanism; the strip injection machine body includes a cast aluminum heating cylinder, a core regulating lead screw; the core regulating lead screw includes a copper wire inlet, a head and a snout; the snout is connected to the transmission mechanism; the cast aluminum heating cylinder includes a head flange and a sizing inlet; the head includes a strip injection nozzle, the cast aluminum heating cylinder further includes a temperature sensor; the control box includes a PLC control program; the automated two-color strip injection is implemented by obtaining the real-time monitoring and feedback information of the temperature sensor.
Power feeding structure, resin plate body for window including power feeding structure, and method of manufacturing resin plate body for window including power feeding structure
A power feeding structure includes a resin plate body for window configured by stacking a resin panel and a resin film including an object to have power fed such that the object to have power fed is interposed between the resin panel and the resin film, and an electrical conductive portion that contacts the object to have power fed and is provided inside the resin plate body for window, the power feeding structure feeding power to the object to have power fed via the electrical conductive portion that is provided at a resin sheet that is provided inside the plate body such that the electrical conductive portion is interposed between the resin sheet and the object to have power fed, the resin panel and the resin sheet being adhered, and resin components contained in the object to have power fed and the electrical conductive portion, respectively, being adhered.
Metal-containing polymeric reinforced pipe, method for manufacturing same and pipeline produced using said pipe
The polymeric pipes reinforced with a metal casing are used for transporting oil and gas, acids, alkali products, drinking water and industrial water, and also in the transportation of aggressive and neutral pulps. A metal-containing polymeric reinforced pipe includes a welded metal casing and a polymeric matrix having an amorphous-phase-based molecular structure. The metal-containing polymeric reinforced pipe is produced by extrusion moulding with simultaneous feeding of a polymer melt and the reinforcing metal casing into the mould cavity, followed by intensive cooling of the internal and external surfaces of the pipe being moulded. The invention increases the quality and endurance limit in the radial direction of the metal-containing polymeric reinforced pipe, productivity of the process for manufacturing the pipe, and also the strength and technological effectiveness of a pipeline constructed from the pipes produced.
MULTILAYER COMPOSITE BODY OF METAL AND POLYPROPYLENE-BASED RESIN COMPOSITION AND METHOD FOR PRODUCING SAME
A multilayer composite body in which a shaped metal article, a thermosetting resin layer, a modified polyolefin resin layer, and a polypropylene-based resin composition, or a PP-based GFRTP are laminated in the order of description. A multilayer composite body of a metal and a resin is obtained which excels in a fixing strength (shear breaking stress) between the shaped metal article and the molded article of the polypropylene-based resin composition. The thermosetting resin layer is composed mainly of a urethane resin or an epoxy resin. The polypropylene-based resin composition is molded by an injection molding. The modified polyolefin resin forming the modified polyolefin resin layer includes one or two or more of non-chlorinated modified polyolefin resins having a weighted average of melting points of 70 C. to 110 C., as determined with a differential scanning calorimeter (DSC).
SILICONE RESIN REFLECTIVE SUBSTRATE, MANUFACTURING METHOD FOR SAME, AND BASE MATERIAL COMPOSITION USED IN REFLECTIVE SUBSTRATE
A versatile silicone resin reflective substrate which exhibits high reflectance of high luminance light from an LED light source over a wide wavelength from short wavelengths of approximately 340-500 nm, which include wavelengths from 380-400 nm near lower limit of the visible region, to longer wavelength in the infra-red region. The silicone resin reflective substrate has a reflective layer which contains a white inorganic filler powder dispersed in a three-dimensional cross linked silicone resin, the inorganic filler powder having a high reflective index than the silicone resin. The reflective layer is formed on a support body as a film, a solid, or a sheet. The silicone resin reflective substrate can be easily formed as a wiring substrate, a packaging case or the like, and can be manufactured at low cost and a high rate of production.
RESIN STRUCTURE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN, AND METHOD FOR MANUFACTURING SAID STRUCTURE
In a resin structure including a resin molded body and a plurality of electronic components embedded in the resin molded body, (i) the resin molded body has a plurality of exposed surfaces on which electrodes of the plurality of electronic components are exposed, (ii) the resin molded body has a recess formed therein, and (iii) the recess has a bottom surface which is at least one of the plurality of exposed surfaces.
Silicone resin reflective substrate, manufacturing method for same, and base material composition used in reflective substrate
A versatile silicone resin reflective substrate which exhibits high reflectance of high luminance light from an LED light source over a wide wavelength from short wavelengths of approximately 340-500 nm, which include wavelengths from 380-400 nm near lower limit of the visible region, to longer wavelength in the infra-red region. The silicone resin reflective substrate has a reflective layer which contains a white inorganic filler powder dispersed in a three-dimensional cross linked silicone resin, the inorganic filler powder having a high reflective index than the silicone resin. The reflective layer is formed on a support body as a film, a solid, or a sheet. The silicone resin reflective substrate can be easily formed as a wiring substrate, a packaging case or the like, and can be manufactured at low cost and a high rate of production.