In accordance with one or more embodiments, a method includes injection molding of a dielectric material in a pre-distorted antenna mold; and curing the dielectric material. The pre-distorted dielectric mold has a shape that compensates for shape distortion of the dielectric material during the curing.

A photocurable composition for stereolithographic three-dimensional printing, wherein the photocurable composition comprises a photoreactive oligomer component comprising a hydrophobic oligomer comprising a photoreactive end group, a photoreactive monomer component comprising a photoreactive monomer having a photoreactive end group, and a photoinitiation composition comprising a photoinitiator; the photocurable composition has a viscosity of 250 to 10,000 centipoise at 22° C., determined using a Brookfield viscometer; and the photocured composition has a dielectric loss of less than 0.010, preferably less than 0.008, more preferably less than 0.006, most preferably less than 0.004, each determined by split-post dielectric resonator testing at 10 gigahertz at 23° C.

A method of manufacturing a polymer composite having an embedded functionality includes the following steps: providing a dry non-conductive fiber fabric having a nominal weight from 25-600 g/m.sup.2; selecting a paste having viscosity below 600 Pa-s, the paste being a conductive paste, dielectric paste and/or a sensing paste; and applying the selected paste on the dry non-conductive fiber woven fabric by either screen-printing or micro-dispensing, thus making a printed functionality. The method further includes the step of forming a laminate having the dry non-conductive fiber woven fabric having the printed functionality and at least one additional fabric or core; and obtaining a polymer composite from the laminate.

A transparent conductive substrate structure used for a thermoforming process includes a transparent cover plate and a touch sensing layer structure. The transparent cover plate includes a toughening layer on one side thereof. The touch sensing layer structure arranged on one surface of the toughening layer, and includes a first transparent conductive layer, a dielectric layer, a barrier layer, a second transparent conductive layer, and a buffer protective layer. Each transparent conductive layer is directly applied to the transparent cover plate, so that the thickness between the transparent conductive layers is below 1 μm. The thickness between layers may be reduced to increase the sensitivity of the touch sensing layer structure. To prevent each transparent conductive layer and an electrode wire layer from breaking during the thermoforming process, the transparent conductive substrate structure is combined with the buffer protective layer to strengthen the structure of each transparent conductive layer.

Described is a method for manufacturing a radio frequency (RF) absorber. The method includes first determining a set of desired RF absorption properties for a RF absorber. A computer model for the RF absorber having the determined set of desired RF absorption properties is then produced. Using a three-dimensional (3D) printing process, melted plastic filament loaded with a RF absorber material is deposited in in computer controlled patterns according to the computer model, thereby producing the RF absorber having the set of desired RF absorption properties.

A wiring harness assembly includes a plurality of electrical conductors having wires enclosed within insulative sheaths that are integrally formed of an electrically insulative material. The assembly also includes a lattice support structure that is attached to the insulative sheaths at multiple locations. The lattice support structure is configured to maintain a desired shape of the assembly. The lattice support structure is formed of filaments that may be formed using an additive manufacturing process The filaments may be arranged such that lattice support structure defines a plurality of hexagonally shaped apertures. A process for manufacturing the wiring harness assembly and an apparatus configured to manufacture the wiring harness assembly is also presented.

Provided is a dielectric material (1, 2, 3, 4) to solve the problems of low production efficiency and high production cost of the existing dielectric material. The dielectric material (1, 2, 3, 4) is a tube structure. The tube wall of the tube structure is formed from a foam material foamed. The dielectric material further includes metal wires (11, 21, 31, 41). The metal wires (11, 21, 31, 41) are disposed in the longitudinal direction of the tube structure, and are evenly distributed in the tube wall of the tube structure without being in contact with each other. The dielectric material (1, 2, 3, 4) with such a structure has the advantages of simple structure, accurate control of the dielectric constant, light weight per unit volume, easy and efficient production, and stable technical indicators. Further provided is a dielectric material production method.

A photocurable composition for stereolithographic three-dimensional printing, wherein the photocurable composition comprises a photoreactive oligomer component comprising a hydrophobic oligomer comprising a photoreactive end group, a photoreactive monomer component comprising a photoreactive monomer having a photoreactive end group, and a photoinitiation composition comprising a photoinitiator; the photocurable composition has a viscosity of 250 to 10,000 centipoise at 22° C., determined using a Brookfield viscometer; and the photocured composition has a dielectric loss of less than 0.010, preferably less than 0.008, more preferably less than 0.006, most preferably less than 0.004, each determined by split-post dielectric resonator testing at 10 gigahertz at 23° C.

A photocurable composition for stereolithographic three-dimensional printing, wherein the photocurable composition comprises a photoreactive oligomer component comprising a hydrophobic oligomer comprising a photoreactive end group, a photoreactive monomer component comprising a photoreactive monomer having a photoreactive end group, and a photoinitiation composition comprising a photoinitiator; the photocurable composition has a viscosity of 250 to 10,000 centipoise at 22° C., determined using a Brookfield viscometer; and the photocured composition has a dielectric loss of less than 0.010, preferably less than 0.008, more preferably less than 0.006, most preferably less than 0.004, each determined by split-post dielectric resonator testing at 10 gigahertz at 23° C.

A dielectric isolator for a twisted pair cable includes a body formed as an elongate strip with a top surface, bottom surface, a first side edge and a second side edge. A first slot is formed in the first side edge and extends at least half way toward the center of the isolator. A second slot is formed in the second side edge and extends at least half way toward the center of the isolator. During cable manufacturing, first and second wedges open the first and second slots. First and second twisted pairs are inserted into the first and second opened slots, respectively. Third and fourth twisted pairs reside at the top and bottom surface, respectively.