An apparatus for forming pre-shaped insulating sheets comprises first bending station and a second bending station. The first bending station is used for bending a flat sheet of insulating material into a Z-shaped sheet (5). The second bending station is used for bending the Z-shaped sheet into an S-shape. The first and second bending stations comprise pairs of first (13a, 13b) 13b and second bending operators for creating bending movements.

Systems and methods for forming insulation on magnet wire are provided. An extruder that includes one or more rotating screws may receive a plurality of ingredients for a polymeric insulation material and process the plurality of ingredients to facilitate polymerization of the polymeric insulation material within the extruder. An application assembly in fluid communication with the extruder may apply the polymeric insulation material onto a wire. A curing device may then cure the polymeric insulation material.

The direct-current cable includes a conductive portion; and an insulating layer covering an outer periphery of the conductive portion, the insulating layer containing cross-linked base resin and inorganic filler, the base resin containing polyethylene, a BET specific surface area of the inorganic filler being greater than or equal to 5 m.sup.2/g and less than or equal to 150 m.sup.2/g, and a mean volume diameter of the inorganic filler being less than or equal to 1.0 m, the mass ratio of the inorganic filler with respect to the base resin being greater than or equal to 0.001 and less than or equal to 0.05, and the cross-linked base resin being cross-linked by a cross-linking agent containing organic peroxide.

According to one embodiment, an X-ray tube comprises a cathode for emitting electrons, an anode having an anode target with which electrons emitted from the cathode collides to radiate X-rays, a glass container housing the cathode and the anode, an anode rod extending from the anode to an outside of the container, an annular metal member through which the anode rod is inserted, the annular metal member connecting the anode and the container to maintain an inside of the container in vacuum, and an electrically insulating molding resin member charged into a space formed between the anode rod and outer surfaces of the container and the metal member.

A semiconductor package including a circuit substrate, an interposer structure, a plurality of dies, and an insulating encapsulant is provided. The interposer structure is disposed on the circuit substrate. The plurality of dies is disposed on the interposer structure, wherein the plurality of dies is electrically connected to the circuit substrate through the interposer structure. The insulating encapsulant is disposed on the circuit substrate, wherein the insulating encapsulant surrounds the plurality of dies and the interposer structure and encapsulates at least the interposer structure, the insulating encapsulant has a groove that surrounds the interposer structure and the plurality of dies, and the interposer structure and the plurality of dies are confined to be located within the groove.

The present invention provides an insulation film, comprising a film upper layer and a film lower layer, wherein both of the film upper layer and film lower layer are made of a PC or PET material, the PC or PET material contains a flame retardant to meet the flame retardance and puncture resistance property thereof; a film intermediate layer located between the film upper layer and the film lower layer, the film intermediate layer is made of the blends of PP and/or PE and PC and/or PET; an upper surface of the film intermediate layer is bound together with a lower surface of the film upper layer, a lower surface of the film intermediate layer is bound together with an upper surface of the film lower layer.

A molded article includes a first plateable region spaced apart from a second plateable region the first plateable region by a barrier of electrically insulating material. Each of the plateable regions include an associated plateable layer of electrically conductive material for being electroplated with a different plateable finish. Several different geometries and configurations of the barrier and/or the plateable regions are provided to prevent migration of plating material from one of the plateable regions acting as bipolar electrode while another one of the plateable regions is being electroplated. A non-plateable insert may be disposed between the plateable regions to prevent migration of plating material from one of the plateable regions onto the other one of the plateable regions. A conducive robber in electrical communication with one of the one of the plateable regions, and which may be removable, may also be used to prevent migration of plating material.

A gate-all around fin double diffused metal oxide semiconductor (DMOS) devices and methods of manufacture are disclosed. The method includes forming a plurality of fin structures from a substrate. The method further includes forming a well of a first conductivity type and a second conductivity type within the substrate and corresponding fin structures of the plurality of fin structures. The method further includes forming a source contact on an exposed portion of a first fin structure. The method further comprises forming drain contacts on exposed portions of adjacent fin structures to the first fin structure. The method further includes forming a gate structure in a dielectric fill material about the first fin structure and extending over the well of the first conductivity type.

A device for joining a first component to be welded to a second component to be welded, the joining device having at least one electrically conductive, resistive heating film which comprises a central connection portion and two lateral electrical connection portions. The joining device comprises at least one first electrical insulation member which is positioned in contact with the first face of the heating film, and at least one second electrical insulation member which is positioned in contact with the second face of the heating film, the two electrical insulation members being configured to allow the transfer of heat and to prevent the flow of electric current between the heating film and each component to be welded.

The present invention provides an insulation film (100), comprising a film upper layer (101) and a film lower layer (103), wherein both of the film upper layer (101) and film lower layer (103) are made of a PC or PET material, the PC or PET material contains a flame retardant to meet the flame retardance and puncture resistance property thereof; a film intermediate layer (102) located between the film upper layer (101) and the film lower layer (103), the film intermediate layer (102) is made of the blends of PP and/or PE and PC and/or PET; an upper surface of the film intermediate layer (102) is bound together with a lower surface of the film upper layer (101), a lower surface of the film intermediate layer (102) is bound together with an upper surface of the film lower layer (103).