The invention relates to a method for manufacturing an optoelectronic component substrate (12) comprising a stack of layers, the method comprising a step of: preforming a substrate (12) comprising a face which has a pattern with at least one zone made of a first material and one zone made of a second material, the two materials being thermosetting or thermoplastic materials, the first material being an electrically conductive material and the second material being an electrically insulating material, and molding by compression the face of the substrate (12) with a face of a reference element (22) having a surface roughness less than or equal to 50 nanometers.

A method for preparing an HVDC cable for jointing or termination includes the step of providing a section of an HVDC cable comprising a conductor surrounded by a first semiconducting layer, and at least one insulation layer of a first polymer material surrounding the first semiconducting layer, where the insulation layer comprises conductive volatile by-products. A tape of a second polymer material is provided, where the additional layer comprises conductive volatile by-products. The tape is lapped onto the insulation layer thereby forming an additional layer. Heat is applied to crosslink the additional layer and redistribute the conductive volatile by-products.

A fiber-reinforced resin member is provided in which a non-conductive sleeve and first and second non-conductive sheets are disposed between a metal fastening member and CFRP laminate, electrical continuity between the metal fastening member and the CFRP laminate is cut off, and corrosion of the metal fastening member due to galvanic corrosion is prevented. A first annular space is formed between a first flange portion of a first member and the first non-conductive sheet, a second annular space is formed between a second flange portion of a second member and the second non-conductive sheet. Therefore, even if frayed carbon fiber sticks out from a gap between the non-conductive sleeve and the first and second non-conductive sheets, due to the first and second annular spaces being formed therein, it is possible to prevent the sticking-out carbon fiber from contacting the first and second members and providing electrical continuity.

A one-surface groove for wiring is formed in a front surface 2a, opposite-surface grooves for wiring are formed in a back surface 2b by protruding core members, and communication parts for allowing the one-surface groove and the opposite-surface grooves to communicate with each other are formed to shape a board section 2 made of a non-conductive resin. After the core members are retracted, a conduction-side resin, which will become conductive, is shaped in the one-surface groove, the opposite-surface grooves, and the communication parts to form front-side wiring 3, communication wirings 4, and back-side wirings 5, whereby a wiring circuit component is provided.

A method is provided to make a bipolar plate of a flow cell. The two insulating frames traditionally cladding the graphite plate is changed. Through injection-molding, an acid-resisting insulating material is molded on the graphite plate to form an integrated bipolar plate. Composite channels are designed around the graphite plate. Thus, the binding force between the acid-resisting insulating material and the graphite plate is increased and the risk of electrolyte leakage is reduced. In order to reduce shunt currents, branch channels are also made in the frame through injection-molding. By using the bipolar plate thus made accordingly, not only the possibility of electrolyte leakage but also the number of components and the time for processing assembly can be significantly reduced. The cost of processing and assembly is effectively decreased. Accordingly, the present invention simplifies the structure of bipolar plate with cost reduced.

Various implementations include a self-heating device. The device includes an electrically insulative layer, an electrically conductive layer, a first electrode, and a second electrode. The electrically insulative layer has a first surface and a second surface spaced apart from the first surface. The electrically conductive layer has a first surface and a second surface spaced apart from the first surface. The second surface of the conductive layer is coupled to the first surface of the insulative layer. The conductive layer includes a polymer. Conductive nanoparticles are embedded in the polymer. The first electrode and a second electrode are coupled to the conductive layer. The first electrode and the second electrode are spaced apart from each other and in electrical communication with each other through the conductive layer. The conductive layer produces heat through Joule heating when electrical current is passed through the conductive layer.

A semiconductor package including a circuit substrate, an interposer structure, a plurality of dies, and an insulating encapsulant is provided. The interposer structure is disposed on the circuit substrate. The plurality of dies is disposed on the interposer structure, wherein the plurality of dies is electrically connected to the circuit substrate through the interposer structure. The insulating encapsulant is disposed on the circuit substrate, wherein the insulating encapsulant surrounds the plurality of dies and the interposer structure and encapsulates at least the interposer structure, the insulating encapsulant has a groove that surrounds the interposer structure and the plurality of dies, and the interposer structure and the plurality of dies are confined to be located within the groove.

A rechargeable battery includes a battery case, a cover that closes an open end of the battery case, and a power collection terminal arranged on the cover to supply power from a power generating element to an external terminal. The power collection terminal extends through a gasket arranged on a lower surface of the cover, an insulator arranged on an upper surface of the cover, and the external terminal arranged on an upper surface of the insulator. An annular sealing member is held between the lower surface of the cover and the gasket. The insulator is a resin-molded component. The insulator includes a through hole defined by an inner wall that includes a lower open end, an upper open end, and a central portion. At least one of the lower open end and the upper open end has a larger diameter than the central portion.

A method of three-dimensionally shaping articles, such as articles that are difficult to transport, includes the following successive steps: placing at least one flexible cord (1) on a former (10), the cord (1) incorporating a heating electrical resistance surrounded by at least a first set of yarns of thermoplastic polymer material; connecting the flexible cord (1) to an electrical power supply for a given duration to cause the thermoplastic polymer of at least the first set of yarns surrounding the heating resistance to soften, the cord then taking on the shape imposed by the former (10); cooling the cord; and optionally removing the former (10) in order to obtain the three-dimensional object.

Provided is a motor bobbin around which a winding wire is wound, said motor bobbin comprising insulating paper and a resin molded body. The insulating paper and the resin molded body are coupled and fixed together without using an adhesive agent. Surfaces of the insulating paper which are in contact with the resin molded body are configured using aramid paper comprising an aramid fibrid and aramid short fibers. Resin is melt extruded and thermal-fusion bonded upon the aramid paper comprising the aramid fibrid and the aramid short fibers, and the surfaces configured from the aramid paper are surface treated to obtain the insulating paper. The motor bobbin is obtained by bringing melted portions of the resin molded body into contact with the top of the aramid paper.