B29K2995/0013

METHODS AND SYSTEMS FOR INCREASING PRINT SPEED DURING ADDITIVE MANUFACTURING
20220410493 · 2022-12-29 · ·

An additive manufacturing method includes providing a polymeric material and changing a cooling rate of the polymeric material by adding a second material to the polymeric material. The additive manufacturing method also includes providing the polymeric material and the added second material to an additive manufacturing apparatus and depositing the polymeric material, having the changed cooling rate, with the additive manufacturing apparatus at a deposition rate that is based at least in part on the changed cooling rate of the polymeric material.

CORE-SHEATH FILAMENT WITH A THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE CORE

A core-sheath filament having a) a core that is a thermally conductive pressure-sensitive adhesive particles and b) a non-tacky, thermoplastic sheath is provided. The thermally conductive pressure-sensitive adhesive in the core includes a (meth)acrylate-based polymeric material and thermally conductive particles. Additionally, methods of making the core-sheath filament and methods of using the core-sheath filament to print a thermally conductive pressure-sensitive adhesive are described.

Housing Parts, Housings and Processes for Preparing the Same
20220264762 · 2022-08-18 ·

The present invention relates to a housing part, a housing and an electronic device. The housing part according to this invention comprises a first layer, said first layer being molded from a first composition comprising a1) 50-90 wt. % of a first amorphous polymer and b1) 10-50 wt. % of a first thermally conductive filler, the first composition having a thermal conductivity (TC1) of 4-40 W/(m*K), a second layer, said second layer being molded from a second composition comprising a2) 50-90 wt. % of a second amorphous polymer and b2) 10-50 wt. % of a second thermally conductive filler, the second composition having a thermal conductivity (TC2) of 0.5-10 W/(m*K), and the second layer being molded over the first layer by leaving at least one area of the first layer not being over-molded with the second layer for being exposed to at least one heat source, wherein, TC1 is at least 2 W/(m*K) larger than TC2, the amounts of al and b1 are based on the total weight of the first composition, the amounts of a2 and b2 are based on the total weight of the second composition, and the thermal conductivity is measured in-plane according to ASTM E1461-01. The housing part provided in this invention has high heat dissipating efficiency and mechanical properties as well as high dimensional stability.

Reusable mold for injection molding and molding method

A reusable mold for injection molding and molding method includes a reusable mold member, a mold cavity defined in the mold member, and at least one heat sink recess defined in the mold member for accommodating a heat sink material therein for rapidly removing heat from the mold cavity when the mold member is used to injection mold a molded part. The reusable mold injection molds a molded part and rapidly removes heat from the mold cavity via a heat sink material accommodated in the at least one heat sink recess.

Resin member and method for producing resin member

A resin member is formed from a resin material containing filler and an insulating base polymer as a main component. The resin member includes an alignment layer close to a surface of the resin member. The alignment layer includes the filler aligned in the surface direction and the base polymer filling the space between pieces of the filler. The alignment layer includes a carbonized portion that is carbonized matter of the base polymer, contains graphite, and provides electrical conductivity and thermal conductivity.

Dispensing Systems And Methods Including Online Remixing Of Thermal Management And/Or EMI Mitigation Materials
20220250302 · 2022-08-11 ·

Exemplary embodiments are disclosed of systems and methods for dispensing thermal management and/or EMI mitigation materials. The system and methods include online remixing prior to dispensing the thermal management and/or EMI mitigation materials. In an exemplary embodiment, a system includes an online remixer configured to be operable for receiving a supply of the thermal management and/or EMI mitigation material including one or more functional fillers within the matrix, and remixing the one or more functional fillers including filler settlement, if any, within the matrix prior to dispensement of the thermal management and/or EMI mitigation. The remixing may reduce the filler settlement, if any, within the matrix and thereby allow for improved viscosity and flow rate of the thermal management and/or EMI mitigation material.

Thermal interface materials

A thermal interface material is disclosed. The material includes: a sheet extending between a first major surface and a second major surface, the sheet including: a base material; and a filler material embedded in the base material. The base material may include anisotropically oriented thermally conductive elements. In some embodiments, the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction. In some embodiments, the base material is substantially free of silicone. In some embodiments, the thermal conductivity of the sheet along the primary direction is at least 20 W/mK, 30 W/mK, 40 W/mK, 50 W/mK, 60 W/mK, 70 W/mK, 80 W/mK, 90 W/mK, 100 W/mK, or more.

THERMALLY CONDUCTIVE SHEET AND METHOD FOR MANUFACTURING THERMALLY CONDUCTIVE SHEET
20220262702 · 2022-08-18 · ·

A thermally conductive sheet having a binder resin, a first thermally conductive filler, and a second thermally conductive filler, wherein the first thermally conductive filler and the second thermally conductive filler are dispersed in the binder resin, and the specific permittivity and the thermal conductivity are different in the thickness direction B and the surface direction A of the thermally conductive sheet. A thermally conductive sheet includes step A of preparing a resin composition for forming a thermally conductive sheet by dispersing a first thermally conductive filler and a second thermally conductive filler in a binder resin, step B of forming a molded block from the resin composition for forming a thermally conductive sheet, and step C of slicing the molded block into a sheet and obtaining a thermally conductive sheet having different relative permittivity and thermal conductivity in the thickness direction and the surface direction.

Injection Molding a Modulator Support Cage
20220278601 · 2022-09-01 ·

A Magnetic Gear Modulator (MGM) of a Concentric Magnetic Gear (CMG) is manufactured by injection molding a modulator cage over angularly spaced apart MGM pole pieces made of a magnetically conducting material. The pole pieces are initially connected by a support ring, or held by a fixture. The modulator cage is preferably a thermally conductive strengthening fiber filled plastic, a carbon fiber plastic, a carbon fiber filled plastic material, a glass material, or a high performance composite plastic molding material. After molding, the outer and/or inner portions of the molding material, and support ring if present, are machined away preferably exposing both inner and outer faces of the pole pieces embedded in the modulator cage. An MGM made using injection molding over a connected support ring and pole pieces reduces cost, and a carbon fiber plastic modulator cage increases strength.

RESIN MEMBER AND METHOD FOR PRODUCING RESIN MEMBER

A resin member is formed from a resin material containing filler and an insulating base polymer as a main component. The resin member includes an alignment layer close to a surface of the resin member. The alignment layer includes the filler aligned in the surface direction and the base polymer filling the space between pieces of the filler. The alignment layer includes a carbonized portion that is carbonized matter of the base polymer, contains graphite, and provides electrical conductivity and thermal conductivity.