A method of manufacturing hexagonal boron nitride laminates contains steps of: a) Dissolving dielectric polymers in solvent. b) Mixing h-BN powder to form a well-mixed h-BN coating slurry. c) Coating slurry on substrates and dried at 100 to 150° C. d-1) For free standing h-BN film, peel off h-BN dielectric polymer layer from substrate in water batch by roll to roll process. d-2) For h-BN film on substrates, heat compression of the substrates and hBN laminates at 100 to 250° C. for multi-layer structures. Thereby, hexagonal boron nitride laminates exhibit thermal conductivity of 10 to 40 W/m.Math.K, which is significantly larger than that currently used in thermal management. In addition, thermal conductivity of hexagonal boron nitride laminates increases with the increasing mass density, which opens a way of fine tuning of its thermal properties.

A nylon compound is disclosed having good through plane thermal conductivity and improved physical strength. The compound comprises a combination of nylon, graphite, and long glass fibers. The through plane thermal conductivity of the compound ranges from about 1 W/m.Math.K to about 4 W/m.Math.K, as measured by the C-Therm Test described herein. This nylon compound is also electrically conductive, preferably having a surface resistivity ranging from about 1×10.sup.3 Ohm/sq to about 1×10.sup.5 Ohm/sq as measured by IEC 60093.

The invention relates to an assembly of parts comprising a first part containing a first polymer composition and a second part containing a second polymer composition, both compositions comprising a semi-crystalline polymer and optionally one or more other components, the first part and the second part being fastened to each other through an interface between the first polymer composition and the second polymer composition, wherein the interface is free from mechanically interlocking elements and the thermal conductivity of the second polymer composition (TC2) is higher than the thermal conductivity of the first polymer composition (TC1) with a factor TC2/TC1 of at least 1.5. The invention further relates to a process for manufacturing such an assembly and to various uses of said assembly.

Aspects of the disclosure are directed to methods and/or apparatuses involving one or more of a conductive polymer, deposition of a conductive polymer and 3D (three-dimensional) printing of a continuous bead of material. As may be implemented in accordance with one or more embodiments characterized herein, a 3D structure is formed as follows. A stacked layer is formed by depositing a continuous bead of material along an uninterrupted path that defines a first layer of the 3D structure. A sidewall of the 3D structure is formed with opposing surfaces respectively defined by successive stacked layers of the 3D structure by, for each stacked layer (including the first layer), depositing the continuous bead of material along the path and with a surface thereof in contact with a surface of the continuous bead of material of an adjacent one of the stacked layers.

A process for manufacturing a urethane foam pad comprising the steps of: providing a urethane resin and a filler agent; mixing a predetermined amount of the filler agent with the urethane resin to create a urethane mixture within a mold container; drawing a vacuum on the urethane mixture; allowing the urethane mixture to expand and gel for a predetermined amount of time to form an expanded urethane foam pad; releasing the vacuum on the urethane mixture; and removing the expanded urethane foam pad from the mold container.

An additive manufacturing method includes providing a polymeric material and changing a cooling rate of the polymeric material by adding a second material to the polymeric material. The additive manufacturing method also includes providing the polymeric material and the added second material to an additive manufacturing apparatus and depositing the polymeric material, having the changed cooling rate, with the additive manufacturing apparatus at a deposition rate that is based at least in part on the changed cooling rate of the polymeric material.

A single-cavity multi-runner applied to oriented arrangement extrusion molding equipment of graphene fibers includes a first extrusion cavity, the first extrusion cavity includes a first inlet and a first outlet arranged opposite to each other; a first molding cavity, the first molding cavity is arranged in an inclined manner, a second inlet is arranged at the high position end, a second outlet is arranged at the low position end of the first molding cavity, and the second inlet is connected to the first outlet; flow channels, the flow channels are formed by dividing the first molding cavity using baffle plates arranged horizontally and along the flowing direction of a heat-conducting mixture; a second molding cavity, the second molding cavity includes a third inlet and a third outlet arranged opposite to each other, the third inlet is connected to the outflow end of the flow channels.

A thermal interface material is disclosed. The material includes: a sheet extending between a first major surface and a second major surface, the sheet including: a base material; and a filler material embedded in the base material. The base material may include anisotropically oriented thermally conductive elements. In some embodiments, the thermally conductive elements are preferentially oriented along a primary direction from the first major surface towards the second major surface to promote thermal conduction though the sheet along the primary direction. In some embodiments, the base material is substantially free of silicone. In some embodiments, the thermal conductivity of the sheet along the primary direction is at least 20 W/mK, 30 W/mK, 40 W/mK, 50 W/mK, 60 W/mK, 70 W/mK, 80 W/mK, 90 W/mK, 100 W/mK, or more.

A thermally conductive dielectric film includes a thermoplastic layer including polyester segments and 5 to 30% by wt polyether amide segments. The thermally conductive dielectric film has a thickness of less than 100 micrometers.

A set of augmented reality (AR) or virtual reality (VR) glasses are disclosed. The glasses comprise a fiber reinforced structure. The fiber reinforced structure includes a continuous fiber component. The fiber reinforced structure also includes a thermoplastic material injection molded over the continuous fiber component, wherein the thermoplastic material surrounds the continuous fiber component. The glasses also comprise electronics that are coupled to the fiber reinforced structure, wherein the electronics are configured to facilitate presentment of imagery onto a lens of the glasses.