The invention relates to the use of compounds of formulae (I) and/or (II) as colorless IR absorbers wherein M is Ni, Pd, Pt, Au, Ir, Fe, Zn, W, Cu, Mo, In, Mn, Co, Mg, V, Cr or Ti, X.sub.1, X.sub.2 and X.sub.3 are each independently of the others sulfur or oxygen, R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.5 and R.sub.6 are each independently of the others hydrogen, NR.sub.7R.sub.8, unsubstituted or substituted C.sub.1-C.sub.18alkyl, C.sub.1-C.sub.18 alkyl wherein the alkylene chain is interrupted with oxygen, unsubstituted or substituted C.sub.1-C.sub.18alkenyl, unsubstituted or substituted aryl, unsubstituted or substituted arylalkyl or unsubstituted or substituted heteroarylalkyl, R.sub.7 and R.sub.8, each independently of the other, being unsubstituted or substituted C.sub.1-C.sub.18alkyl, unsubstituted or substituted aryl, unsubstituted or substituted arylalkyl or unsubstituted or substituted heteroarylalkyl, a further IR absorber optionally being added to the compounds of formulae (I) and (II). The invention relates also to novel dithiolene compounds of formulae (I) and (II) wherein X.sub.1 is oxygen and X.sub.2 and X.sub.3 are oxygen or sulfur. The invention relates furthermore to novel dithiolene compounds of formulae (I) and (II) wherein R.sub.1 to R.sub.6 are NR.sub.7R.sub.8. ##STR00001##

Injection molded parts with a small dimension that exhibit high heat resistance are described. Thermoplastic compositions that can be utilized to form the injection molded parts are described. The thermoplastic composition includes a polyarylene sulfide and a crosslinked impact modifier. The thermoplastic composition can also include siloxane polymers, thermoplastic elastomers, or other additives that can further improve the characteristics of the injection molded parts.

Embodiments of the present disclosure disclose a composite crystal flooring. The composite crystal flooring may have a multi-layer structure. The composite crystal flooring may include a substrate layer. The substrate layer may include at least a first structural layer, a second structural layer, and a third structural layer. The second structural layer may be located between the first structural layer and the third structural layer. A foaming density of the second structural layer may be less than 1.1 grams per cubic millimeter. Components of the second structural layer may include polyvinyl chloride, one or more inorganic fillers, at least one foaming agent, at least one foaming regulator, at least one lubricating agent, and at least one stabilizer. The one or more inorganic fillers may include modified fly ash, hollow glass microbeads, and composite calcium. The composite crystal flooring with a low density may have good thermal stability and rigidity.

A poly(oxyalkylene) polymer and a metal salt of a carboxylic acid, sulfonic acid, or alkylsulfate, in combination are useful as a polymer processing additive synergist. Polymer processing additive compositions, homogeneously catalyzed olefin compositions, and other extrudable polymer compositions including a poly(oxyalkylene) polymer and a metal salt of a carboxylic acid, sulfonic acid, or alkylsulfate are disclosed. Methods of reducing melt defects during the extrusion of a thermoplastic polymer, which may be a homogeneously catalyzed polyolefin, are also disclosed.

The present invention relates to high-voltage components, in particular for electromobility, containing polymer compositions based on at least one polyamide and 10,10′-oxybis-12H-phthaloperin-12-one, and to the use of 10,10′-oxybis-12H-phthaloperin-12-one for marking polyamide-based articles of manufacture as high-voltage components.

A heat resistant resin composition which does not cause stringing when performing fusion-bonding using heated plates. A heat resistant resin composition, including: a maleimide-based copolymer; and at least one resin selected from the group including: ABS resin, ASA resin, AES resin, and SAN resin; wherein: the heat resistant resin composition has a ratio G′/G″ of storage modulus (G′) to loss modulus (G″) measured in accordance with JIS K 7244-10 under conditions of 240° C. at an angular velocity of 0.63 rad/s is 0.30 or more and 1.00 or less.

In the method for manufacturing conglomerate stone slabs using the Bretonstone technology, in the variant where the starting mixture is enclosed between two paper sheets, the improvement consists in replacing each paper sheet with a containment element consisting of a paper sheet, one surface of which has, applied thereon, a film of plastic material which is impermeable to organic vapours, impermeable to the liquids and in particular to the liquid resin constituting the binder of said mixture, resistant to the catalysis temperatures of the said resin and resistant to hot solvents and chemical vapours. Preferably, said plastic material is water-soluble, in particular polyvinyl alcohol.

A recyclable, easily tearable packaging laminate having a good barrier effect and low density, including a first laminate layer and a second laminate layer. The first laminate layer is a co-extruded, stretched composite consisting of a cavitated substrate layer having 5-30 wt. % cavitating agent and a PE proportion of at least 60 wt. %, a connecting layer and a barrier layer consisting of a barrier polymer, preferably polyamide or ethylene vinyl alcohol copolymer, with a thickness of at most 20% of the overall thickness of the first laminate layer. The connecting layer is arranged between the substrate layer and the barrier layer, and the first laminate layer is connected by its barrier layer to the second laminate layer.

A polyphenylene sulfide resin composition exhibits excellent initial toughness and toughness after a long-term high temperature treatment typified by a tensile elongation at break after a dry heat treatment without impairing mechanical strength, chemical resistance and electrical insulation properties. The polyphenylene sulfide resin composition includes 0.01 to 10 parts by weight of an organosilane compound and 0.01 to 5 parts by weight of a metal salt of phosphorus oxoacid based on 100 parts by weight of a polyphenylene sulfide resin, and a tensile elongation at break, which is measured in accordance with ASTM-D638 under the conditions of a tensile speed of 10 mm/min and an ambient temperature of 23° C. after treating at 200° C. for 500 hours using an ASTM No. 4 dumbbell test piece obtained by injection molding the composition, is 10% or more.

The present invention relates to 3-D structures having high temperature stability and improved micro-porosity as well as processes of making and using same. The disclosed 3-D are advantageous because they have low densities and low permittivities. When compared to previous 3-D structures, the present structures maintain their low permittivities over a broader range of electromagnetic frequencies. Thus, when used in communication devices such as array antennas, can provided higher communication performance in high temperature environments.