The present disclosure provides a molding system for preparing an injection-molded fiberless plastic article. The molding system includes a molding machine; a mold disposed on the molding machine; a processing module configured to generate an anisotropic viscosity distribution of the fiberless molding resin in the mold cavity; and a controller coupled to the processing module. The mold has a mold cavity for being filled with a fiberless molding resin including a plurality of polymer chains. The processing module is configured to generate the anisotropic viscosity distribution based on a molding condition for the molding machine and based in part on consideration of an orientation effect of the plurality of polymer chains. The controller is configured to control the molding machine with the molding condition using the generated anisotropic viscosity distribution of the fiberless molding resin to perform an actual molding process for preparing the injection-molded fiberless plastic article.

In one embodiment, a method may comprise heating a composite material into a viscous form, wherein the composite material comprises a thermoplastic and a plurality of reinforcement fibers, wherein the plurality of reinforcement fibers is randomly arranged within the thermoplastic. The method may further comprise extruding a plurality of strands of the composite material, wherein extruding the plurality of strands causes the plurality of reinforcement fibers within each strand to align. The method may further comprise arranging the plurality of strands of the composite material to form an assembly fixture, wherein the assembly fixture comprises an anisotropic thermal expansion property, and wherein the anisotropic thermal expansion property is based on an orientation of the plurality of reinforcement fibers within the assembly fixture.

A method for fabricating polymeric sheets containing microwires includes encapsulating at least a portion of individual lengths of a plurality of microwires in a non-conductive polymeric sheet while the microwires are attached to the substrate. The microwires are then detached from the substrate without removing the microwires from the polymeric sheet. The detaching step forms a separated polymeric sheet containing the detached microwires. Individual detached microwires of the plurality are approximately perpendicular to the separated polymeric sheet. A microwire array device includes a non-conductive polymeric sheet and a plurality of microwires. Individual microwires of the plurality have an independent length at least partially encapsulated by the polymeric sheet, are approximately perpendicular to the polymeric sheet, and contain magnetic ferrite.

A powder layered modeling apparatus capable of modeling a three-dimensional object using a material powder contains at least a crystalline resin and filler particles. A modeling unit which partitions a modeling space for laying a material powder layer by the material powder to mold the three-dimensional object, a powder laying unit capable of laying the material powder layer in the modeling space by moving the material powder along a first direction with respect to the modeling space, a powder laying unit capable of laying the material powder layer in the modeling space by moving the material powder along a second direction not parallel to the first direction, and an energy supply unit which supplies energy for melting or sintering the material powder to a part constituting a cross-sectional layer to be molded of the three-dimensional object of the material powder layer laid in the modeling space.

A housing assembly for an electronic circuit including an electronic control unit (ECU) is a low-profile, generally rectangular device that includes a base, a cover that closes an open end of the base, and a printed circuit board (PCB). The housing assembly securely supports the PCB and its associated electronic components while providing improved cooling properties and lower manufacturing costs. This is achieved by providing passive cooling features on an outer surface of the cover, and by employing a thermally conductive plastic to form the passive cooling features, where the cover has predetermined and defined anisotropic thermal conduction properties configured to optimize thermal conduction and cooling of the ECU.

The present invention relates to novel anisotropic composite materials and processes for production thereof. The composite materials are based on the crosslinking of polyisocyanates and feature good weathering stability.

The present disclosure provides a molding system for preparing a fiber-reinforced thermoplastic composite article. The molding system includes: a molding machine; a mold disposed on the molding machine and having a mold cavity for being filled with a composite molding material including a polymeric resin and a plurality of fibers; a processing module configured to generate an anisotropic stress distribution of the composite molding material in the mold cavity based on a molding condition for the molding machine; and a controller coupled to the processing module and configured to control the molding machine with the molding condition to perform an actual molding process for preparing the fiber-reinforced thermoplastic composite article. The anisotropic stress distribution of the composite molding resin is generated based in part on consideration of an integral effect of an elongational viscosity and a shear viscosity of the composite molding material.

The present disclosure provides a molding system for preparing a fiber-reinforced thermoplastic composite article. The molding system includes: a molding machine; a mold disposed on the molding machine and having a mold cavity for being filled with a composite molding material including a polymeric resin and a plurality of fibers; a processing module configured to generate an anisotropic stress distribution of the composite molding material in the mold cavity based on a molding condition for the molding machine; and a controller coupled to the processing module and configured to control the molding machine with the molding condition to perform an actual molding process for preparing the fiber-reinforced thermoplastic composite article. The anisotropic stress distribution of the composite molding resin is generated based in part on consideration of an integral effect of an elongational viscosity and a shear viscosity of the composite molding material.

A method for fabricating polymeric sheets containing microwires includes encapsulating at least a portion of individual lengths of a plurality of microwires in a non-conductive polymeric sheet while the microwires are attached to the substrate. The microwires are then detached from the substrate without removing the microwires from the polymeric sheet. The detaching step forms a separated polymeric sheet containing the detached microwires. Individual detached microwires of the plurality are approximately perpendicular to the separated polymeric sheet. A microwire array device includes a non-conductive polymeric sheet and a plurality of microwires. Individual microwires of the plurality have an independent length at least partially encapsulated by the polymeric sheet, are approximately perpendicular to the polymeric sheet, and contain magnetic ferrite.

Provided is an anisotropic optical film, which can, while keeping excellent display characteristics (e.g., brightness and contrast) in the direction of a viewing angle, suppress decreased display characteristics in the other directions, when the anisotropic optical film is used as a diffusion film of a display panel. In an anisotropic optical film including two or more anisotropic light diffusion layers where the linear transmittance varies depending on the incident angle of incident light, each of the anisotropic light diffusion layers is provided with a matrix region and a plurality of pillar regions that differ in refractive index from the matrix region, the film includes, as the anisotropic light diffusion layers, at least two types of anisotropic light diffusion layers (a) and (b) that differ in linear transmittance, the maximum linear transmittance of the anisotropic light diffusion (a) is 40% or more and less than 95%, and the minimum linear transmittance thereof is less than 20%, and the maximum linear transmittance of the anisotropic light diffusion layer (h) is 20% or more and less than 40%, and the minimum linear transmittance thereof is less than 20%.