In an example 3D printing method, an electrical conductivity value for a resistor is identified. Based upon the identified electrical conductivity value, a predetermined amount of a conductive agent is selectively applied to at least a portion of a build material layer in order to introduce a predetermined volume percentage of a conductive material to the resistor. Based upon the identified electrical conductivity value and the predetermined volume percent of the conductive material, a predetermined amount of a resistive agent is selectively applied to the at least a portion of the build material layer in order to introduce a predetermined volume percentage of a resistive material to the resistor. The build material layer is exposed to electromagnetic radiation, whereby the at least the portion coalesces to form a layer of the resistor.

Provided are an irreversibly discoloring pigment for preventing overheating, a thermochromic molded article including the same, and a method of preparing the same, and more particularly, a discoloring pigment which becomes discolored when overheated, and then maintains the discoloration even after being cooled to room temperature, a thermochromic molded article including the discoloring pigment, and methods of preparing the discoloring pigment and the thermochromic molded article.

Provided is a curable particulate silicone composition that is hot-meltable, has excellent handling workability, curing properties, and gap fill properties when melted, and gives a cured product having excellent flexibility and resilience from room temperature to high temperatures of about 150° C. Also provided are pellets or the like formed by molding the curable particulate silicone composition. The curable particulate silicone composition comprises: (A) hot-meltable silicone particles that have a softening point of 30° C. or higher and have a hydrosilylatable group and/or a radical reactive group; (B) an inorganic filler (particulates) that is substantially free of coarse particles having an average particle diameter of 10.0 μm or larger; and (C) a curing agent. When cured, the composition gives a cured product having a storage modulus of 2000 Mpa or lower at 25° C. and of 100 Mpa or lower at 150° C.

A method of manufacturing a semiconductor device includes providing, in a housing, an insulating substrate having a metal pattern, a semiconductor chip, a sinter material applied on the semiconductor chip, and a terminal, providing multiple granular sealing resins supported by a grid provided in the housing, heating an inside of the housing until a temperature thereof reaches a first temperature higher than a room temperature and thereby discharging a vaporized solvent of the sinter material out of the housing via a gap of the grid and a gap of the sealing resins, and heating the inside of the housing until the temperature thereof reaches a second temperature higher than the first temperature and thereby causing the melted sealing resins to pass the gap of the grid and form a resin layer covering the semiconductor chip.

A structure includes a first substrate film and a functional electronics assembly. The first substrate film comprises a recess defining a volume. The functional electronics assembly comprises at least a first substrate, at least one electronics component on the first substrate, and at least one connection portion. The functional electronics assembly is connected to the first substrate film via the at least one connection portion. The at least one electronics component is arranged at least partly into the volume. At least part of the at least one electronics component is embedded into a first material arranged into the recess.

A manufacturing method is configured to include arranging a conductive circuit-attached film, in which a conductive circuit having stretchability is formed on a base film, on a molding surface of a first mold having the molding surface for forming an internal surface of a preform; mold-clamping the first mold and a second mold paired with the first mold; molding the preform by injecting molten resin into a cavity formed by the mold-clamping; mold-opening the first mold and the second mold; taking out a conductive circuit-attached preform in which the conductive circuit-attached film and the preform are integrated; and blow-molding the conductive circuit-attached preform.

A method of packaging an integrated circuit includes (a) providing: (i) an integrated circuit (e.g., in wafer form) having a two-dimensional contact array on a top surface thereof, (ii) a polymer shell lower portion, and (iii) a polymer shell upper portion, said upper portion having a two-dimensional array of openings formed therein, which array of openings corresponds to said two dimensional contact array; wherein one or both of said polymer shell upper and lower portions are produced by the process of additive manufacturing; and (b) enclosing said integrated circuit between said polymer shell lower portion and said polymer shell upper portion with said contact array aligned with array of openings to produce a integrated circuit packaged within a polymer shell.

A warpage reduction device the present disclosure includes a jig having a warped shape capable of distributing stress of a workpiece, a light source heating the workpiece so as to be flat, a pressurizer applying pressure to the heated workpiece to be pressed against the jig so as to be deformed, a cooler cooling the deformed workpiece, and a controller controlling operations of the light source, the pressurizer, and the cooler.

A flexible electrode and a fabrication method therefor are provided. The flexible electrode is formed by mixing organic-soft-matrix with inorganic-hard-material. The inorganic-hard-material is composed of silicate lamellar blocks and electrochemically active materials. Each of the silicate lamellar blocks is formed by multiple stacked nano-scaled sheet-like silicate lamellae. The organic-soft-matrix includes conductive polymer and binder. The binder is water-soluble and ionically conductive. The flexible electrode has a floor-ramp like opened-perforated layer structure formed by hierarchically aggregated inorganic silicate lamellar blocks, and pores of the opened-perforated layer structure are filled with the organic-soft-matrix, so as to form a network channel structure having organic phase and inorganic phase interlaced with each other. The floor-ramp like opened-perforated layer structure composed of aggregated inorganic silicate lamellar blocks contributes to stiffness of the flexible electrode, and the conductive polymer and the binder in the organic-soft-matrix respectively form electron channels and ion channels in the flexible electrode.

The invention relates to a press for encapsulating electronic components mounted on a carrier, comprising: at least two press parts displaceable relative to each other, a drive system for the displacement of the press parts, and an intelligent control adapted to control the drive system of the press parts wherein the drive system comprises at least two individual controllable actuators, the intelligent control further connects to plural displacement sensors for detecting the relative displacement of the press parts, and wherein the intelligent control is adapted to control the actuators of the drive system dynamically over time based on the measured values detected with the displacement sensors. The invention also relates to an actuator set to convert a prior art press into a press according to the present invention as well as to a method for encapsulating electronic components mounted on a carrier.