An apparatus forms a pattern of an imprint material by curing the imprint material in a state in which the imprint material on a pattern formation region of a member, where a pattern is to be formed, is in contact with a pattern region of a mold. The apparatus includes a dispenser for placing the imprint material on the pattern formation region of the member and a non-pattern formation region of the member, outside the pattern formation region, a detector for detecting the non-pattern formation region in a state in which the imprint material has been placed on the pattern formation region and the non-pattern formation region by the dispenser, and a controller for performing processing for determining an abnormality in the dispenser based on a detection result of the non-pattern formation region by the detector.

A method for manufacturing an electromechanical structure, including producing conductors on a flat film; estimating a strain a plurality of locations of the flat film will undergo during formation thereof into a three-dimensional film; attaching electronic elements on the flat film at selected locations of the plurality of locations of the flat film, wherein the estimated strain of the selected locations of the plurality of locations is less than the estimated strain in other locations of the plurality of locations; forming the flat film into the three-dimensional film; and injection molding material on the three-dimensional film.

An injection molded article is provided with: a flat molded resin body that has a flat rectangular parallelepiped shape and is formed from an injection molded resin; and a base sheet affixed to the surface of the molded resin body. The base sheet has formed therein a first conductive layer on a first surface and a through hole passing through from the first surface to a second surface. The through hole is filled with a conductive material, and a second conductive layer is formed so as to be electrically connected with the first conductive layer via the conductive material with which the through hole is filled. In addition, a sealing material is formed on the first conductive layer so as to cover the through hole. The molded resin body is fixed together with the first surface side of the base sheet so as to cover the sealing material.

A method includes placing a package structure into a mold chase, with top surfaces of device dies in the package structure contacting a release film in the mold chase. A molding compound is injected into an inner space of the mold chase through an injection port, with the injection port on a side of the mold chase. During the injection of the molding compound, a venting step is performed through a first venting port and a second venting port of the mold chase. The first venting port has a first flow rate, and the second port has a second flow rate different from the first flow rate.

A tool provided that individually creates three-dimensional structural elements which are sequentially positioned into formation of a shaped object.

Material mixing for an additive manufacturing apparatus is provided. A further aspect employs multiple material inlets for simultaneously feeding a polymer and/or nanocomposite material in at least a first inlet, and ceramic or other particles in at least a second inlet, to a single additive manufacturing outlet nozzle. In another aspect, a three dimensional printing machine varies a chemical or compounding characteristic, such as a loading percentage, of printing material during printing. In another aspect, in situ mixing of a polymer and/or nanocomposite with variable amounts of ceramic, magnetic or other particles therein in an additive manufacturing apparatus, such as a multi-material aerosol jet printing machine.

A resin molding apparatus capable of suppressing an occurrence of defects related to resin filling. The resin molding apparatus includes: a molding mold which forms a cavity; a pot which is arranged in the molding mold and is capable of accommodating a resin material, and in which an opening portion opening directly to the cavity is formed; and a plunger which is arranged to be slidable in the pot, and transfers the resin material accommodated in the pot toward the cavity via the opening portion by extruding the resin material. An inner diameter of the opening portion is formed to be the same as an outer diameter of the plunger or larger than the outer diameter of the plunger.

A method of additive manufacturing of a three-dimensional object is disclosed. The method comprises sequentially forming a plurality of layers each patterned according to the shape of a cross section of the object. In some embodiments, the formation of at least one of the layers comprises performing a raster scan to dispense at least a first building material composition, and a vector scan to dispense at least a second building material composition. The vector scan is optionally along a path selected to form at least one structure selected from the group consisting of (i) an elongated structure, (ii) a boundary structure at least partially surrounding an area filled with the first building material, and (iii) an inter-layer connecting structure.

A three-dimensional molded circuit component, includes: a base member which includes a metal part and a resin part; a circuit pattern which is formed on the resin part; and a mounted component which is mounted on the base member, and is electrically connected to the circuit pattern. The resin part includes a resin thin film as a portion thereof, which includes a thermoplastic resin, of which a thickness is in the range of 0.01 mm to 0.5 mm, and which is formed on the metal part. The mounted component is arranged on the metal part via the resin thin film.

The polyester sheet in accordance with an aspect of the present invention contains crystals of polyester which is a polycondensate of polyvalent carboxylic acid and polyalcohol. The polyester sheet contains nano-oriented crystals which contain crystals of polyester in each of which a polymer chain is highly oriented and each of which has a crystal size of 50 nm or less. A heatproof temperature of the polyester sheet is higher than a temperature that is lower than an equilibrium melting point of the polyester by 80° C., and a melting point of the polyester sheet is higher than a temperature that is lower than the equilibrium melting point of the polyester by 40° C.