The disclosure provides a circuit substrate and a method for manufacturing the same. The circuit substrate includes a wiring and a substrate having a base region and a circuit region. The base region having a first pattern is constituted by a first thermoplastic material. The circuit region having a second pattern is constituted by a second thermoplastic material. The first pattern has a portion opposite to the second pattern. The wiring is formed on the circuit region along the second pattern. The first thermoplastic material is different from the second thermoplastic material, and the second thermoplastic material includes a catalyst particle.

A method for producing a multilayer body and a multilayer body, wherein the method includes: providing a single-layered or multi-layered substrate with a first surface and a second surface, providing one or more sensor films which each have at least one sensor area and have a first surface and a second surface facing away from the first surface, applying the one or more sensor films to the second surface of the substrate such that the first surface of the respective sensor film rests on the second surface of the substrate at least in areas, thermoforming a series of layers comprising the substrate and the one or more sensor films applied to the second surface of the substrate such that, during the thermoforming, on the first surface of the substrate a surface relief is formed which is determined by the shaping, of one or more of the one or more sensor films.

An electronic medical device is disclosed here. An exemplary embodiment of the medical device includes a printed circuit board assembly, a protective inner shell surrounding at least a portion of the printed circuit board assembly, and an outer shell surrounding at least a portion of the protective inner shell. The printed circuit board assembly has a printed circuit board, electronic components mounted to the printed circuit board, a battery mounted to the printed circuit board, and an interface compatible with a physiological characteristic sensor component. The protective inner shell is formed by overmolding the printed circuit board assembly with a first material having low pressure and low temperature molding properties. The outer shell is formed by overmolding the protective inner shell with a second material that is different than the first material.

A method for separating composite materials and mixtures, in particular solid-material mixtures and slags, and to a device for carrying out said method. The method for separating composite materials and mixtures comprises the step of transporting the composite material or the mixture through a separating device. The composite material to be separated or the mixture to be separated is excited by mechanical impulses as it passes through the separating device and is thereby separated. The device (1) for carrying out the method comprises a drive unit (21) for driving a rotor element (32), which is connected to a bearing/shaft unit (22) and which is part of a rotor unit (31). The rotor element itself has at least one rotor tool (33) and each rotor tool has at least one rotor tool component (34) and is surrounded by a stator element (42), which is part of a stator unit (41). The stator element itself has at least one stator tool (43) and each stator tool has at least one stator tool component (44). The rotor element and the stator element are substantially cylindrical.

The present invention is a transfer device for unloading a resin molded article from one mold provided with a resin injection unit, the resin molded article being unloaded by the transfer device from one mold provided with a resin injection unit having a member projecting between at least part of the resin molded article and another mold, wherein the resin injection unit has a member projecting between at least part of the resin molded article and the other mold, and the transfer device is equipped with a holding member for holding the resin molded article and a horizontal movement mechanism that causes the holding member holding the resin molded article to move in the horizontal direction to separate the resin molded article from the resin injection unit.

An electric valve can be further miniaturized while reducing the number of manufacturing man-hours. The electric valve contains: a motor including a stator member and a rotor member that displace a valve body, and a housing for accommodating the motor. The housing is formed by joining a heat generation portion formed of a first material to a heat receiving portion formed of a second material. The light transmittance in the first material is lower than the light transmittance in the second material.

The disclosure relates to systems and methods for using additive manufacturing (AM) to fabricate printed circuits having side-mounted components and contacts. More specifically, the disclosure is directed to additive manufacturing methods for fabricating electronic components (AME), for example; printed circuit board (PCB), flexible printed circuit (FPC) and high-density interconnect printed circuit board (HDIPCB) (the PCBs, FPCs, and HDIPCB's together referred to as AMEs, or AME circuits), having conductive contacts and/or components along the Z axis of side walls or facets of the each of the printed AMEs.

A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.

The invention relates to a method for forming a laser-welded connection, in which two parts to be joined (11; 11a, 12; 12a) are connected to one another under the effect of a laser beam (1) in a joining region (30; 30a) to form a weld (2), wherein one part to be joined (11; 11a) consists of a material transparent to laser radiation and the other part to be joined (12; 12a) consists of a material absorbent to laser radiation, and wherein the two parts to be joined (11; 11a, 12; 12a) form a receptacle (25; 25a; 25b) for a component (13; 13a; 13b; 14) separate from the parts to be joined (11; 11a, 12; 12a).

Described herein are techniques for reducing resin squeeze-out including a method comprising receiving a first component and a second component, where the first component is configured to be joined to the second component at an overlap area using an adhesive layer to form a structure having a ledge. The method further comprises applying the adhesive layer to the overlap area on the first component. The method further comprises selectively curing a portion of the adhesive layer adjacent to the ledge. The method further comprises forming the structure by combining the first component, the second component, and the adhesive layer and curing a remainder of the adhesive layer.